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Compounding brightener for copper plating and preparation method thereof

A technology of brightener and copper plating, which is applied in the field of compound brightener for copper plating and its preparation, which can solve the problems of poor bonding between copper layer and iron substrate, non-dense crystal grain composition of copper plating layer, and low cathode current efficiency, etc. problem, to achieve the effect of inhibiting rapid deposition, good toughness, eliminating pitting and pinholes

Inactive Publication Date: 2017-09-19
常州蓝森环保设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The characteristics of the alkaline copper plating brightener are: the bonding force between the copper layer and the iron substrate is good, and the grains of the copper layer are dense, which is called "high-density copper plating", but the copper plating layer is not too bright, and the cathode current efficiency is low (45~ 65%); acidic copper plating brightener is the more widely used of the two, that is, the brightener is used in the acid sulfate bright copper plating process to obtain a fully bright copper coating; its characteristic is that the coating is bright Like a mirror surface, the cost of copper plating is lower than that of nickel plating. The components of the plating solution are simple, without complexing agents, and the wastewater treatment is simple. The binding force is very poor, and the dispersion ability is poor, the crystallization of the coating is rough, and pinhole pitting is easy to occur

Method used

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  • Compounding brightener for copper plating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0023] Take 15g of sodium phenyl polydithiodipropane sulfonate, 0.5g of 2-mercaptobenzothiazole, and 0.5g of ethylenethiourea, add it to 100mL of 95% ethanol solution, stir at 300r / min for 20min, then add 50g polyethylene glycol P1000, 50g sodium dodecylsulfonate, 0.1g lanthanum nitrate, 1L deionized water, continue to stir for 20min, and discharge to obtain a compound brightener for copper plating.

[0024] Add the compound brightener for copper plating prepared by the present invention into the electroplating solution in the aqueduct, control the addition amount to 0.8mg / L, stir and mix for 15min, then control the temperature in the aqueduct to 45°C, and the current density to 1A / dm 2 , Put the plated parts into the aqueduct for electroplating for 10 minutes.

example 2

[0026] Take 20g of sodium phenyl polydithiodipropane sulfonate, 0.8g of 2-mercaptobenzothiazole, and 0.8g of 2-tetrahydrothiazolthione, add it to 150mL of 97% ethanol solution, and stir at 350r / min for 25min. Then add 75g of polyethylene glycol P6000, 75g of OP-21, 0.3g of lanthanum nitrate, 2L of deionized water, continue stirring for 25min, and discharge to obtain a compound brightener for copper plating.

[0027] Add the compound brightener for copper plating prepared by the present invention into the electroplating solution in the aqueduct, control the addition amount to 0.9 mg / L, stir and mix for 18 minutes, then control the temperature in the aqueduct to 48°C, and the current density to 6A / dm 2 , Put the plated parts into the aqueduct and electroplate for 15 minutes.

example 3

[0029] Take 25g of sodium phenyl polydithiodipropane sulfonate, 1.0g of 2-tetrahydrothiazolethione, and 1.0g of ethylenethiourea, add it to 200mL of ethanol solution with a mass fraction of 98%, stir at 400r / min for 30min, and then add 100g Polyethylene glycol P6000, 100g aliphatic amine polyoxyethylene ether, 0.5g yttrium nitrate, 2L deionized water, continue stirring for 30min, and discharge to obtain a compound brightener for copper plating.

[0030] Add the compound brightener for copper plating prepared by the present invention into the electroplating solution in the aqueduct, control the addition amount to 1.0mg / L, stir and mix for 20min, then control the temperature in the aqueduct to 50°C, and the current density to 10A / dm 2 , Put the plated parts into the aqueduct for electroplating for 20 minutes.

[0031] The coating on the surface of the composite brightener for copper plating obtained in the above embodiments is detected and compared with the coating on the surfac...

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Abstract

The invention discloses a composite brightener for copper plating and a preparation method thereof, belonging to the technical field of electroplating. The brightener of the present invention comprises sodium phenyl polydithiodipropanesulfonate, heterocyclic sulfide, polyether compound, surfactant, rare earth salt; Described heterocyclic sulfide is 2-thiol benzothiazole, ethyl One or both of thiourea, 2-tetrahydrothiazolethione; the polyether compound is one of polyethylene glycol P1000, polyethylene glycol P6000; the surfactant is twelve One of sodium alkylsulfonate, OP-21, fatty amine polyoxyethylene ether; the rare earth salt is one of lanthanum nitrate and yttrium nitrate. After using the compound brightener for copper plating of the present invention, the copper plating layer has good compactness, brightness and uniformity, good bonding force with the substrate, and no pinhole pitting phenomenon.

Description

technical field [0001] The invention relates to a composite brightener for copper plating and a preparation method thereof, belonging to the technical field of electroplating. Background technique [0002] The acidic copper plating process is suitable for the intermediate coating of the protective decorative electroplating layer, used for electroplating various lighting, hardware tools and daily necessities, and also widely used in plastic electroplating, printed circuit board electroplating and electroforming and other fields. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, conductivity, reflectivity, corrosion resistance. In the copper electroplating process, copper plating with brightener is used as a t...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 孙建忠方晓俊王之霖
Owner 常州蓝森环保设备有限公司
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