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A kind of preparation method of high stability copper-based electrical contact material

An electric contact material, high stability technology, applied in the direction of contacts, circuits, electric switches, etc., can solve the problems of reducing the conductive strength of materials, poor high-temperature stability of materials, and unstable contact interfaces, etc. Density, the effect of improving stability

Active Publication Date: 2018-12-04
南通雷拓电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to solve the problem that the existing copper-based electrical contact material ceramic matrix and metal matrix have a price difference, and under the action of high temperature, the contact interface is unstable, resulting in poor high-temperature stability of the material and reducing the conductive strength of the material. Provided A kind of preparation method of highly stable copper-based electrical contact material

Method used

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  • A kind of preparation method of high stability copper-based electrical contact material

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example 1

[0020] According to the mass ratio of 1:10, mix copper chloride and 10% aluminum nitrate solution by mass fraction, and after heating in a water bath at 45°C for 25 minutes, the mixed solution is obtained. Mix 10% sodium carbonate solution and 10% sodium hydroxide solution by mass fraction, and ultrasonically disperse to obtain a mixed lye. Add the mixed lye dropwise to the mixed solution at a volume ratio of 1:5, and control the dropping time to 10 minutes. After the addition is complete, stir and mix and place in a high-pressure reactor, crystallize at 100°C and 0.8MPa for 10 hours, centrifuge at 2500r / min and collect the lower precipitate, wash with deionized water until the washing liquid is neutral , vacuum-dried and placed in a ball mill jar, ball milled at 350r / min for 3 hours, and passed through a 200-mesh sieve to obtain an interface-modified powder; in parts by weight, weigh 70 parts of titanium, 10 parts of silicon and 10 parts of graphite to mix , mix and ball mill...

example 2

[0022] According to the mass ratio of 1:10, mix copper chloride and 10% aluminum nitrate solution by mass fraction, and after heating in a water bath at 47°C for 27 minutes, the mixed solution is obtained. Mix 10% sodium carbonate solution and 10% sodium hydroxide solution by mass fraction, and ultrasonically disperse to obtain a mixed lye. The mixed lye is added dropwise to the mixed solution at a volume ratio of 1:5, and the dropping time is controlled to be 12 minutes. After the addition is completed, stir and mix and place in a high-pressure reactor, crystallize at 104°C and 0.9MPa for 11 hours, centrifuge at 2750r / min and collect the lower precipitate, wash with deionized water until the washing liquid is neutral , vacuum-dried and placed in a ball mill jar, ball milled at 375r / min for 4 hours, and passed through a 200-mesh sieve to obtain an interface-modified powder; in parts by weight, weigh 72 parts of titanium, 12 parts of silicon and 12 parts of graphite to mix , mi...

example 3

[0024]According to the mass ratio of 1:10, mix copper chloride with the mass fraction of 10% aluminum nitrate solution, and heat it in a water bath at 50°C for 30 minutes to obtain the mixed solution. Mix 10% sodium carbonate solution and 10% sodium hydroxide solution by mass fraction, and ultrasonically disperse to obtain a mixed lye. The mixed lye is added dropwise to the mixed solution at a volume ratio of 1:5, and the dropping time is controlled to be 15 minutes. After the addition is completed, stir and mix and place in a high-pressure reactor, crystallize at 110°C and 1.0MPa for 12 hours, centrifuge at 3500r / min and collect the lower precipitate, wash with deionized water until the washing liquid is neutral , vacuum-dried and placed in a ball mill jar, ball milled at 400r / min for 5 hours, and passed through a 200-mesh sieve to obtain an interface-modified powder; in parts by weight, weigh 75 parts of titanium, 15 parts of silicon and 15 parts of graphite to mix , mix and...

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Abstract

The invention relates to a preparing method of a high-stability copper-based electric contact material, and belongs to the field of electronic element material preparing. Through ferric chloride and aluminum nitrate as raw materials, copper powder is doped, copper aluminum hydrotalcite is prepared, the hydrotalcite serves as an interface bonding agent, through Ti3SiC2 and copper powder composite burning, the phenomenon that due to the chemical potential difference of the material under the high-temperature environment, atoms between the interfaces are driven to diffuse is avoided, the hydrotalcite serves as the combination interface, a ceramic base body and copper powder particles are subject to wrapping, a large number of fresh surface layers and strong combination faces can be formed, the contact area of the contact material can be increased, the diffusion distance is shortened, diffusion compatibility is achieved, stability of the contact interface in the material can be effectively improved, meanwhile, through the interface modified effect, the mutual permeation effect of the ceramic base and the metal material can be improved, generation of holes in the material can be reduced, the material compactness is improved, and therefore the material conductive strength can be effectively improved.

Description

technical field [0001] The invention relates to a preparation method of a highly stable copper-based electrical contact material, which belongs to the field of preparation of electronic element materials. Background technique [0002] Electric contact is a key electrical component used in various power equipment, automatic instruments and control devices, and is mainly responsible for the task of connecting and switching circuits and load currents. Studies have shown that the quality of contact materials directly affects the breaking capacity, electromechanical life and dielectric recovery strength of circuit breakers, and also directly affects the reliability and service life of switches and electrical appliances. If the electrical contact fails, it may cause the disorder of the entire system, or even completely paralyze it, resulting in irreparable and serious consequences. Excellent contact materials play a decisive role in the performance of electrical contacts, so ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/05C22C9/00C22C32/00H01H1/021
CPCC22C1/05C22C9/00C22C32/0052H01H1/021
Inventor 江建荣季美
Owner 南通雷拓电子有限公司