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Heat conducting adhesive and preparation method thereof

A heat-conducting adhesive and acrylic glue technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor adaptability to high heat dissipation environments, high heat dissipation, and low thermal conductivity of heat-conducting adhesives, and achieve easy scale-up Mass production, good thermal uniformity and high thermal conductivity

Active Publication Date: 2017-12-08
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current thermal conductive adhesives generally have defects such as low thermal conductivity and poor physical properties, and have poor adaptability to high heat dissipation environments.
The thermal conductivity of double-sided adhesive tape without base material is greatly limited by the thermal conductive adhesive, and it is difficult to improve the thermal conductivity through low-cost solutions, and it is difficult to meet the heat dissipation needs of electronic equipment

Method used

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  • Heat conducting adhesive and preparation method thereof

Examples

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preparation example Construction

[0034] The preparation method of described graphene oxide is: get 2.0 ~ 5.0g graphite powder and 1.0 ~ 2.0g sodium nitrate and join in the concentrated sulfuric acid that 46 ~ 60ml mass fraction is 98%, the mixture is placed in ice bath and stirred for 30 ~ 60min; weigh 6.0~15.0g of potassium permanganate and slowly add to the above mixture, and stir rapidly for 2~5h at 0~5°C; move the mixture into a warm water bath at 35°C and continue stirring for 3~6h; slowly drop Add 90~150ml of distilled water to the mixture, and control the temperature at 98°C for 30min~60min; cool to room temperature, add 30% hydrogen peroxide to remove excess potassium permanganate until the mixture turns bright yellow; add 150~ Dilute with 300ml of distilled water and filter while hot, wash with hydrochloric acid with a molar concentration of 0.01mol / L, absolute ethanol, and deionized water in sequence until there is no sulfate ion in the filtrate, and the solution is neutral. Graphite oxide is obtaine...

Embodiment 1

[0042] A thermally conductive adhesive, which is made of the following raw materials in weight percentage: 70% of acrylic glue, 20% of modified aluminum nitride, 5% of graphene oxide, 3% of tackifying resin, and 2% of dispersant.

[0043] The viscosity of the acrylic glue is 500-1500cps, and the solid content is 100%.

[0044] The preparation method of the modified aluminum nitride is as follows: dissolving aluminum nitride nanoparticles in absolute ethanol, using ultrasonic and ball milling methods to graft silane coupling agent to the surface of aluminum nitride nanoparticles, and through rotary evaporation Remove dehydrated alcohol, obtain modified aluminum nitride particles after drying, wherein, the silane coupling agent is KH-560, and the mass ratio of the silane coupling agent to the aluminum nitride nanoparticles is 7-15: 100, the power of the ultrasonic wave is 1KW, and the ultrasonic time is more than 15 minutes; the conditions of the ball mill are: the speed of the ...

Embodiment 2

[0055] Based on Example 1, the only difference is that the thermally conductive adhesive in this example is made of the following raw materials by weight percentage: 70% acrylic glue, 25% modified aluminum nitride, 3% graphene oxide, and 1% tackifying resin %, and dispersant 1%.

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Abstract

The invention discloses a heat conducting adhesive and a preparation method thereof. The heat conducting adhesive is prepared from the following raw materials in percentage by weight: 65 to 80 percent of acrylic acid glue, 10 to 25 percent of modified aluminum nitride, 0.05 to 5 percent of oxidized graphene, 0.5 to 3 percent of tackifying resin and 0.5 to 2 percent of a dispersing agent. According to the heat conducting adhesive disclosed by the invention, the addition volume of heat conducting filler can be reduced under the situation that higher heat conducting coefficient is obtained, and economy and environment protection are realized; a heat conducting adhesive product has the characteristics of good heat conducting uniformity, high heat conducting coefficient, high adhesion strength, high temperature resistance, insulation and the like. The preparation method disclosed by the invention is simple, safe and reliable in technology, is convenient in operation, is economic and environmentally friendly and is easy in large-scale batch production.

Description

technical field [0001] The invention relates to the technical field of interface heat dissipation materials, in particular to a thermally conductive adhesive and a preparation method thereof. Background technique [0002] Heat conduction has always been an important process in the electronics industry, and the operating temperature of components is often an important basis for reliability. In particular, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature, so the heat dissipation problem has become a crucial consideration in the design of electronic products. All kinds of heat source generators and heat sinks are connected through heat conduction adhesives, such as the heat dissipation design of semiconductor, power supply, white goods and LED industries. [0003] Thermally conductive adhesive is a functional product used to bond heat dissipation devices and other power consumption compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/00C09J11/04C09J11/08C09J11/06
CPCC08K2003/282C08K2201/014C08L2201/08C08L2205/03C09J11/04C09J11/06C09J11/08C09J133/00C08L71/02C08K13/06C08K9/06C08K3/28C08K3/04C08K5/103
Inventor 周福新赖春桃林文峰
Owner TRULY SEMICON
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