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Method for preparing low temperature solder sheets

A low-temperature solder and solder technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of deviation of solder tab composition, poor solid filling, affecting welding performance, etc., to improve uniformity and strength. , reduce the possibility of fracture, reduce the effect of residual stress

Active Publication Date: 2017-12-19
CHINA NAT ELECTRIC APP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the casting and drawing method, the cooling rate and the surface roughness of the casting roll have an important influence on the microstructure of the solder, and impurities are easily brought into the solder, the performance of the solder is not good, and the produced solder sheet is thicker
However, the solder prepared by electroplating deposition method is difficult to accurately control the thickness of the coating, and the bonding strength between the coating metal and the plating metal is not very high.
In the cold-rolling composite method, improper cold-rolling process will lead to deviations between the solder sheet and the required solder composition, which will affect the soldering performance
Although the stack rolling-diffusion alloying method has improved the cold rolling composite method, for example, the patent (ZL201710149734X) discloses a preparation method of a metal foam composite solder sheet, which adopts the normal temperature rolling method, but the normal temperature rolling process There is residual stress in the solder sheet, the metal foam skeleton is deformed and easily broken, and the low-melting point metal is in a solid state with poor fillability and large porosity, so it is difficult for the solder sheet to reach the expected strength; and it needs to go through electroplating steps, and the electroplating solution will cause great harm to the environment. negative impact

Method used

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  • Method for preparing low temperature solder sheets
  • Method for preparing low temperature solder sheets
  • Method for preparing low temperature solder sheets

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, the foamed metal skeleton is selected as open-cell foamed copper with a porosity of 98%, and the low-melting point solder is pure Sn, which is rolled by a two-roll rolling mill. The specific operation steps are as follows:

[0030] Clean the copper foam with a size of 60mm×40mm×0.5mm in dilute hydrochloric acid with a volume fraction of 1% for 5s, then ultrasonically clean it in absolute ethanol for 30s, and impregnate the treated foamed copper with tin at 250°C for 5s to obtain Foamed copper reinforced tin solder with a certain thickness on the surface, the thickness of the surface tin layer is selected to be 8 μm, and the foamed copper reinforced tin with uniform thickness is heated to 280 ° C, that is, it reaches a solid-liquid mixed state. The obtained solder is rolled by a two-roll mill, and used Protected by argon gas to prevent tin oxidation, the rolling thickness is 200μm (0.2mm), and a solder sheet with a smooth surface, uniform thickness, an...

Embodiment 2

[0033] In this embodiment, the foamed metal matrix is ​​selected as open-cell foamed nickel with a porosity of 80%, and the low-melting point solder is pure tin, which is rolled by a flat cross wedge rolling mill. The specific operation steps are as follows:

[0034] Wash nickel foam with a size of 80mm×60mm×0.5mm in dilute hydrochloric acid with a volume fraction of 2% for 5 seconds, then ultrasonically clean it in absolute ethanol for 30 seconds, and impregnate the treated foam nickel with tin for 2 seconds at 240°C to obtain Foamed nickel reinforced tin metal with a certain thickness on the surface, the thickness of the surface tin layer is selected to be 5 μm, and the foamed nickel reinforced tin with uniform thickness is heated to 290 °C, and the obtained solder is rolled by a flat cross wedge rolling machine and protected by argon , To prevent tin oxidation, supplemented by ultrasonic vibration, the rolling thickness is 120μm, and the solder sheet with a smooth surface, u...

Embodiment 3

[0037] In this embodiment, the foamed metal matrix is ​​selected as open-cell foamed nickel with a porosity of 60%, and the low-melting point solder is pure tin, which is rolled by a hot press. The specific operation steps are as follows:

[0038] Clean the nickel foam with a size of 60mm×40mm×0.2mm in dilute hydrochloric acid with a volume fraction of 2% for 5s, then ultrasonically clean it in absolute ethanol for 40s, and impregnate the treated foamed nickel with tin at 250°C for 1s to obtain Nickel foam reinforced tin solder with a certain thickness on the surface, the thickness of the surface coating is 5 μm, and the nickel foam reinforced tin solder with uniform thickness is heated to 300 ° C, and the obtained solder is rolled by a two-roll mill in a vacuum state, and the rolled thickness is The thickness is 120 μm, and the solder sheet with a flat surface, uniform thickness, and well-formed shape is selected for the soldering experiment.

[0039] The microscopic appearan...

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Abstract

The invention discloses a method for preparing low temperature solder sheets. The method comprises the following steps: firstly, carrying out chemical cleaning on stains and oxide films on the surface of a foam metal skeleton; filling metal foam with low-melting point solder in an infiltration way; and finally heating the metal foam filled with the low-melting point solder to a solid-liquid mixed state and rolling to obtain composite sheets with certain thicknesses. According to the method disclosed by the invention; the foam metal-reinforced solder is rolled in the solid-liquid mixed state, so that the problems that the foam metal skeleton is stretched to form a thin strip-type fiber structure and is fractured during normal temperature rolling are effectively solved; meanwhile, during rolling in the solid-liquid mixed state, low-melting point metal which is in a liquid state is good in fluidity and can be uniformly filled in the foam metal skeleton, so that the mass percentage of the foam metal skeleton can be increased, the porosity of the foam metal is reduced and the uniformity and the strength of the foam metal-reinforced low melting point solder are increased.

Description

technical field [0001] The invention relates to the field of soldering technology, in particular to a method for preparing a low-temperature solder sheet. Background technique [0002] With the rise of 3D packaging technology, the application of smaller, thinner, lighter, more reliable, multifunctional, low power consumption and low cost materials in the field of electronic packaging is becoming more and more important. Solder is the main connection method in secondary packaging, and its size and performance have also become key factors affecting electronic devices. Metal foam reinforced low-melting-point composite solder has a low melting point, can obtain reliable metallurgical joints, and has broad application prospects in the field of electronic packaging. [0003] The main methods of traditional production of solder sheet are casting and drawing method, electroplating deposition method and cold rolling composite method. In the casting and drawing method, the cooling r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 王玲万超符永高肖勇曹诺刘阳
Owner CHINA NAT ELECTRIC APP RES INST
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