Spatial limiting solvent assisted growth method for preparing organic-inorganic composite semiconductor monocrystalline film
An inorganic composite, single crystal thin film technology, applied in the direction of single crystal growth, crystal growth, semiconductor devices, etc., can solve the problems of difficult transportation in the grain boundary region, easy to damage the film and substrate, and unfavorable film crystal quality, etc. Achieve the effect of avoiding short circuit problems of devices, improving flatness, and improving and reducing roughness
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Embodiment 1
[0054] Embodiment 1: A method for preparing an organic-inorganic composite semiconductor single crystal thin film with space-limited solvent-assisted growth, comprising the following steps:
[0055] (1) The CH prepared by conventional spin-coating method 3 NH 3 PB 3 The compound semiconductor polycrystalline film is placed in a closed container filled with cyclohexane saturated vapor for 0.5 hours, so that the film as a whole can evenly absorb solvent vapor;
[0056] (2) Closely attach the polished silicon wafer with a clean surface to the surface of the film, and then cover and seal them with a polytetrafluoroethylene film;
[0057] (3) Place the above-mentioned sealed sample in a high-pressure autoclave, then fill the high-pressure autoclave with dimethyl silicone oil, and seal it;
[0058] (4) Apply a constant high pressure of 200MPa on the autoclave, then raise the temperature of the autoclave to 120°C and keep it constant for 48 hours;
[0059] (5) After the above-men...
Embodiment 2
[0072]Example 2: A space-limited solvent-assisted growth method for preparing an organic-inorganic compound semiconductor single crystal thin film. The operation steps are the same as in Example 1, except that the solvent cyclohexane used is replaced by isopropanol. The time for the crystal film to absorb solvent vapor is 1 hour, the polished cover is replaced by a polished quartz plate, the heat and pressure medium is ethylene glycol, the hot pressing pressure is 200 MPa, the hot pressing temperature is 200 °C, and the hot pressing treatment time is For 10 hours, the cooling rate was 0.06°C / min.
Embodiment 3
[0073] Example 3: A space-limited solvent-assisted growth method for preparing an organic-inorganic compound semiconductor single crystal thin film. The operation steps are the same as in Example 1, except that the compound semiconductor is replaced by CH 3 NH 3 PB 3-X Cl X , the solvent cyclohexane used was replaced by DMF, the time for the polycrystalline film to absorb solvent vapor was 0.1 hour, the polished cover slip was changed to a gallium arsenide single wafer, the flexible film used to cover the sample was gold foil, and the heat and pressure transfer medium was For fluorinated liquid, the heat treatment pressure is 150MPa, the hot pressing temperature is 100°C, the heat treatment time is 50 hours, and the cooling rate is 0.2°C / min.
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