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W-Cu coating material for electronic packaging and preparation method of W-Cu coating material

A technology for electronic packaging and coating materials, applied in the direction of coating, metal material coating process, melting spray plating, etc., can solve problems such as thermal stress deformation, insufficient proportion and material size, damage to semiconductor chips, etc., to avoid thermal stress. The effect of excessive stress, enhanced thermal conductivity, and increased density

Inactive Publication Date: 2018-03-27
WUHU DINGHENG MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with similar foreign products, domestic products have larger specifications and thicknesses, and the proportions and material sizes are not complete enough. It is difficult to prepare high-density coatings, and there are many pores, resulting in low thermal conductivity. Secondly, the relationship between the coating and the substrate The combination between the tungsten-copper coating and the copper substrate is not strong, and the thermal expansion coefficient between the tungsten-copper coating and the copper substrate is greatly different, which may easily cause thermal stress to cause deformation or even cracking, and damage the semiconductor chip. The traditional coating material has a fixed thermal expansion coefficient and is prone to large thermal stress. Resulting in chip lack of reliability and high cost

Method used

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  • W-Cu coating material for electronic packaging and preparation method of W-Cu coating material
  • W-Cu coating material for electronic packaging and preparation method of W-Cu coating material
  • W-Cu coating material for electronic packaging and preparation method of W-Cu coating material

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Effect test

Embodiment 1

[0031] Such as Figure 1 to Figure 3 As shown, the tungsten-copper coating material for electronic packaging includes the following components in mass percentage: tungsten accounts for 80%, copper accounts for 19%, palladium accounts for 0.58%, tin accounts for 0.33%, and trace elements account for 0.09%. Molybdenum, nickel, manganese, cobalt.

[0032] A preparation method for a tungsten-copper coating material for electronic packaging, the preparation method comprising the following steps:

[0033] Step 1: Prepare the coating powder of high-purity tungsten powder and copper powder by chemical method, mix and atomize the coating powder prepared in proportion, then agglomerate and sinter.

[0034] The coating powder is mixed and dried by wet ball milling, the particle size of the copper powder is 10-100 μm, and the particle size of the tungsten powder is 10-100 μm.

[0035] Step 2: Take the oxygen-free copper substrate and machine it into the required shape and size, then per...

Embodiment 2

[0043] The tungsten-copper coating material for electronic packaging includes the following components in mass percentage: tungsten accounts for 81.1%, copper accounts for 18%, palladium accounts for 0.55%, tin accounts for 0.30%, and trace elements account for 0.05%.

[0044] The trace elements are molybdenum, nickel, manganese and cobalt.

[0045] The preparation method of the tungsten-copper coating material for electronic packaging is the same as the first embodiment.

Embodiment 3

[0047] The tungsten-copper coating material for electronic packaging includes the following components in mass percentage: tungsten accounts for 83%, copper accounts for 16.5%, palladium accounts for 0.30%, tin accounts for 0.18%, and trace elements account for 0.02%. The trace elements are molybdenum, Nickel, manganese, cobalt.

[0048] A preparation method for a tungsten-copper coating material for electronic packaging, the preparation method comprising the following steps:

[0049] Step 1: Prepare the coating powder of high-purity tungsten powder and copper powder by spraying method, mix and atomize the coating powder prepared in proportion, then agglomerate and sinter.

[0050] All the other steps are the same as in Embodiment 1.

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Abstract

The invention relates to a W-Cu coating material for electronic packaging and a preparation method of the W-Cu coating material. The W-Cu coating material comprises the following components in percentage by mass: 80-85% of W, 15-19% of Cu, 0-0.58% of Pd, 0-0.33% of Sn, and 0-0.09% of such microelements as Mo, Ni, Mn and Co. The preparation method comprises the following steps: mixing coating powder which is proportionally prepared, and carrying out agglomeration and sintering; acquiring an oxygen-free Cu matrix, and spraying the sintered coating powder onto the oxygen-free Cu matrix through supersonic vacuum plasma; carrying out laser remelting on the plasma-sprayed oxygen-free Cu matrix; and coating the remolten oxygen-free Cu matrix with a Ni / Au layer. By adoption of the preparation method provided by the invention, the thermal expansion coefficient of the W-Cu coating material can be adjusted; the W-Cu coating material has a buffer function, and can protect a chip from damage causedby excessive thermal stress; and the density of a coating can be improved, the porosity can be reduced, the thermal-conducting property can be enhanced, and the coating and the matrix can be bonded more firmly.

Description

technical field [0001] The invention relates to the technical field of spraying, in particular to a tungsten-copper coating material for electronic packaging and a preparation method thereof. Background technique [0002] As the input power of LED chips continues to increase, large power dissipation brings large heat generation and requires high light output efficiency, which puts forward newer and higher requirements for LED packaging materials. Reasonable selection and design of high-efficiency heat dissipation substrate materials is an important part of improving the heat dissipation of power LED packages. With the increasing demand for high-power LEDs in the market, the use of tungsten copper heat sinks in LEDs is also increasing. [0003] However, at present, there is no military-grade WCu electronic packaging material in China, and it mainly relies on imports. At present, the domestic production of tungsten copper coating materials adopts the rolling method, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/134C23C4/137C23C4/08C23C4/18C22C27/04B22F1/00
CPCB22F1/0003C22C27/04C23C4/08C23C4/18C23C4/134C23C4/137
Inventor 程敬卿
Owner WUHU DINGHENG MATERIAL TECH