Ultraviolet light polymerization hybrid system imprinting resist for large-area nanoimprint
A technology of nanoimprinting and imprinting glue, which is applied in the field of imprinting materials, can solve the problems of curing speed, mold release effect, adhesion, volume shrinkage and environmental adaptability that cannot meet the technical requirements of large-area nanoimprinting process at the same time. Solve problems such as single printing performance and poor substrate adhesion effect, to achieve the effect of increasing curing rate, simplifying equipment structure and operation, and easy demoulding
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Embodiment 1
[0040] An embossing glue is provided, consisting of the following components by weight:
[0041] 50 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 10 parts of bisphenol A epoxy acrylate, 30 parts of triethylene glycol divinyl ether, triarylsulfonium salt 6 parts, 1 part of 1-hydroxycyclohexyl phenyl ketone, 1 part of silicone or silicon polyether defoamer, 2 parts of organosilane leveling agent.
[0042] First select triaryl sulfonium salt as photoinitiator, photoinitiator is 6 parts, then select 30 parts of triethylene glycol divinyl ether, place photoinitiator triarylsulfonium salt in constant pressure funnel at a certain speed Add dropwise in triethylene glycol divinyl ether, then add 1 part of 1-hydroxycyclohexyl phenyl ketone, and start the stirrer to stir at a high speed, and form a uniform solution I after 30 minutes; then choose 50 parts of 3 , 4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate and 10 parts of bisphenol A epoxy acrylate were ...
Embodiment 2
[0044] An embossing glue is provided, consisting of the following components by weight:
[0045] 40 parts of diglycidyl tetrahydrophthalate, 10 parts of bisphenol A epoxy acrylate, 40 parts of triethylene glycol divinyl ether, 6 parts of triarylsulfonium salt, 1-hydroxycyclohexylphenyl methyl 1 part of ketone, 1 part of silicone or polyether defoamer, 2 parts of organic silane leveling agent.
[0046] First choose triaryl sulfonium salt as photoinitiator, photoinitiator is 6 parts, then choose 40 parts of triethylene glycol divinyl ether, photoinitiator triaryl sulfonium salt is placed in constant pressure funnel at a certain speed Add dropwise in triethylene glycol divinyl ether, then add 1 part of 1-hydroxycyclohexyl phenyl ketone, and start the stirrer to stir at a high speed at the same time, and form a uniform solution I after 30 minutes; then select 40 parts of four Diglycidyl hydrogen phthalate and 10 parts of bisphenol A epoxy acrylate were added to solution I, and th...
Embodiment 3
[0048] An embossing glue is provided, consisting of the following components by weight:
[0049] 36 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 12 parts of bisphenol A epoxy acrylate, 4 parts of polyurethane acrylate, 35 parts of triethylene glycol divinyl ether , 1.3 parts of 1,6-hexanediol diacrylate, 1.3 parts of trimethylolpropane triacrylate, 7 parts of triarylsulfonium salt, 2 parts of 1-hydroxycyclohexyl phenyl ketone, silicone or Silicone polyether defoamer 0.4 part, organosilane leveling agent 1 part.
[0050] First select 7 parts of triarylsulfonium salts as the photoinitiator of the cationic polymerization system, then select 35 parts of triethylene glycol divinyl ether, place the photoinitiator triarylsulfonium salts in a constant pressure funnel at a certain speed Add dropwise into triethylene glycol divinyl ether, and start the agitator to stir at high speed at the same time, and form a uniform solution I after 30 minutes; then select 36 ...
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