High-conductivity and low-temperature cured conductive paste and preparation method thereof

A high-conductivity, conductive paste technology, used in cable/conductor manufacturing, equipment for manufacturing conductive/semi-conductive layers, conductive materials dispersed in non-conductive inorganic materials, etc. Industrial application, heating energy consumption and other issues

Inactive Publication Date: 2018-06-08
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, compared with the high-temperature sintered paste with good conductive effect, the current low-temperature cured paste cannot be sintered and densified, the gap between the conductive powder is large, and the contact resistance is high. The resistivity is generally 2-3 times larger than that of copper wire. Magnitude
Excessive resistivity will cause various problems such as heat generation and energy consumption, and cannot completely replace good conductors such as metal copper
[0004] For example, the following existing techno

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] A high-conductivity low-temperature curing conductive paste, said high-conductivity low-temperature curing conductive paste, which includes 33 parts by weight of spherical silver powder, 47 parts by weight of flake silver powder, 1 part by weight of carbon nanotubes, 10 parts by weight Bisphenol A epoxy resin in parts by weight, modified imidazole latent curing agent in 1 part by weight, and additives in 8 parts by weight.

[0052] Wherein said addition is DBE, polyvinylpyrrolidone and N-methylpyrrolidone.

[0053] The preparation process parameters are as follows: using a self-rotating and revolving mixer to mix the above materials together to form a slurry; put the initially mixed slurry into a three-roll grinder to grind it into a slurry.

[0054] The above slurry was screen-printed onto an alumina substrate, and then baked at 180° C. for 15 minutes, and then the printed sheet was taken out.

Embodiment 2

[0056] A high-conductivity low-temperature curing type conductive paste, said high-conductivity low-temperature curing type conductive paste, which includes 51 parts by weight of spherical silver powder, 35 parts by weight of flake silver powder, and 2 parts by weight of silver powder with a particle size of 20 nanometers , 0.5 parts by weight of carbon nanotubes, 5.5 parts by weight of liquid novolak epoxy resin, 1 part by weight of acid anhydride curing agent, and 5 parts by weight of additives.

[0057] Wherein said addition is dispersant, polyvinylpyrrolidone and N-methylpyrrolidone.

[0058] The preparation process parameters are as follows: using a self-rotating and revolving mixer to mix the above materials together to form a slurry; put the initially mixed slurry into a three-roll grinder to grind it into a slurry.

[0059] The above slurry was printed onto the alumina substrate by screen printing, and then baked at 180°C for 40 minutes, and then the printed sheet was ...

Embodiment 3

[0061] A high-conductivity low-temperature-curable conductive paste, said high-conductivity low-temperature-curable conductive paste, which includes 80 parts by weight of spherical silver powder, 10 parts by weight of agglomerated silver powder, 2 parts by weight of carbon nano-silver powder deposited nanotubes, 4 parts by weight of epoxy resin, 1 part by weight of amine curing agent, and 3 parts by weight of additives.

[0062] Wherein said addition is ethyl cellulose, DBE and N-methylpyrrolidone.

[0063] The carbon nanotubes deposited with nano-silver powder are made by adding silver nitrate to the aqueous solution of nano-conductive carbon tubes, mixing thoroughly, and filtering the liquid to obtain a filter cake, which is then moved into a sodium bromide solution, and then the solution is adjusted to a wavelength of 150nm to 500nm. Under the condition of light, nano-silver particles deposited on the surface of the carbon nanotubes are formed; the solution after the reacti...

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Abstract

The invention relates to a high-conductivity and low-temperature cured conductive paste and a preparation method thereof. The high-conductivity and low-temperature cured conductive paste comprises conductive metal powder, a nanometer conductive carbon material, cured resin and a curing agent. The conductive paste is connected with the conductive metal powder by means of structure characteristic ofthe nanometer conductive material to form a three-dimensional continuous conductive passage, a material capable of being liquefied or sintered at a low temperature is utilized, a connection effect between the conductive metal powder and the nanometer conductive carbon material is improved, so that the resistivity of the conductive paste reaches microohms.cm scale and is approximate to that of a favorable conductor such as silver and copper.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and relates to a high-conductivity low-temperature curing conductive paste and a preparation method thereof. Background technique [0002] With the improvement of environmental protection requirements, more and more industrial products have begun to adopt additive manufacturing methods, including precision printing technology, 3D printing technology, etc. The method of manufacturing conductive lines by additive process mostly uses conductive paste as raw material, including high-temperature sintered type, such as conductive silver paste for crystalline silicon solar cells, MLCC conductive silver paste and palladium paste, and low-temperature curing type, such as touch screen silver paste. [0003] However, compared with the high-temperature sintered paste with good conductive effect, the current low-temperature cured paste cannot be sintered and densified, the gap between the conduct...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/24H01B13/00H01B5/14
CPCH01B1/22H01B1/24H01B5/14H01B13/00H01B13/0026
Inventor 郭冉姜宗清胡军辉
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
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