High-conductivity and low-temperature cured conductive paste and preparation method thereof

Abstract

The invention relates to a high-conductivity and low-temperature cured conductive paste and a preparation method thereof. The high-conductivity and low-temperature cured conductive paste comprises conductive metal powder, a nanometer conductive carbon material, cured resin and a curing agent. The conductive paste is connected with the conductive metal powder by means of structure characteristic ofthe nanometer conductive material to form a three-dimensional continuous conductive passage, a material capable of being liquefied or sintered at a low temperature is utilized, a connection effect between the conductive metal powder and the nanometer conductive carbon material is improved, so that the resistivity of the conductive paste reaches microohms.cm scale and is approximate to that of a favorable conductor such as silver and copper.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and relates to a high-conductivity low-temperature curing conductive paste and a preparation method thereof. Background technique [0002] With the improvement of environmental protection requirements, more and more industrial products have begun to adopt additive manufacturing methods, including precision printing technology, 3D printing technology, etc. The method of manufacturing conductive lines by additive process mostly uses conductive paste as raw material, including high-temperature sintered type, such as conductive silver paste for crystalline silicon solar cells, MLCC conductive silver paste and palladium paste, and low-temperature curing type, such as touch screen silver paste. [0003] However, compared with the high-temperature sintered paste with good conductive effect, the current low-temperature cured paste cannot be sintered and densified, the gap between the conduct...

AI Technical Summary

Problems solved by technology

[0003] However, compared with the high-temperature sintered paste with good conductive effect, the current low-temperature cured paste cannot be sintered and densified, the gap between the conductive powder is large, and the contact resistance is high. The resistivity is generally 2-3 times larger than that of copper wire. Magnitude

Excessive resistivity will cause various problems such as heat generation and energy consumption, and cannot completely replace good conductors such as metal copper

[0004] For example, the following existing technologies all have the aforementioned defects such as large resistance or high energy consumption: CN201180005330 provides a conductive paste, which is a conductive paste containing metal particles, branched polyester and organic solvents, and the metal particles The average particle size is above 1×10-3μm and below 5×10-1μm

[0005] In order to find new solutions, there are currently a series of solutions involving new materials, resin materials or nanotube replacement, but new materials are often costly and difficult to effectively industrialize