Thermosetting resin composition, prepreg, laminated board and printed circuit board

A resin composition, thermosetting technology, applied in the directions of printed circuits, circuit substrate materials, printed circuit components, etc., can solve the problems of deteriorating interlayer adhesion, decreased interlayer adhesion of laminates, poor dispersion of molybdenum compounds, etc. , to achieve the effect of improving the quality of the hole wall, reducing hole cracking, and excellent thermal conductivity

Active Publication Date: 2018-06-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, some people use block fillers such as talc as lubricants to improve processability, but the effect is not obvious, and the addition of these block fillers further deteriorates the interlayer adhesion.
In addition, in order to improve the drilling processability, a metal molybdenum compound was added. As mentioned in CN102656234A, adding a metal molybdenum compound such as zinc molybdate in the thermosetting resin composition improves processability, and it is recommended in this patent to use talc and the like. The molybdenum compound particles formed, which have the problem that the interlayer adhesion of the laminate is significantly reduced, and the dispersion of this type of molybdenum compound in the resin is poor, the density is also high, and it is prone to sedimentation, so satisfactory results cannot be obtained.

Method used

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  • Thermosetting resin composition, prepreg, laminated board and printed circuit board
  • Thermosetting resin composition, prepreg, laminated board and printed circuit board
  • Thermosetting resin composition, prepreg, laminated board and printed circuit board

Examples

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preparation example Construction

[0054] As the preparation method of the resin composition of the present invention, it can be prepared by known methods such as blending, stirring, and mixing the thermosetting resin, inorganic filler, porous molybdenum compound, curing agent and accelerator, and various additives.

[0055] The solvent in the present invention is not particularly limited, but specific examples include alcohols such as methanol, ethanol, butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, butanol, etc. Carbitol and other ethers, acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and other ketones, toluene, xylene, mesitylene and other aromatic hydrocarbons, ethoxy Ethyl acetate, ethyl acetate and other esters, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and other nitrogen-containing solvents. The above-mentioned solvents can be used alone or in combination of two or more, preferably aromatic hydrocarbon solvent...

Embodiment 1-22

[0079] Brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530) (epoxy resin), dicyandiamide (curing agent), 2-methylimidazole (promoter agent), porous zinc molybdate (porous molybdenum compound) and fused silica (Singapore Sibelco, 525, average particle size 2μm) were added to methyl ethyl ketone (solvent), and mechanically stirred to prepare a 65% by weight glue , and then impregnated with glass fiber cloth (7628, Zhuhai Zhubo Electronic Materials Co., Ltd.) (reinforcement material), after heating and drying to form a prepreg (prepreg), place copper foil on both sides, pressurize and heat to make a copper-clad laminate.

[0080] The copper-clad laminates of Examples and Comparative Examples were prepared according to the following preparation process:

[0081] (1) Glue making: Add the solvent into the batching container, add epoxy resin, curing agent and accelerator respectively under stirring; after stirring for ...

Embodiment 23

[0093] Brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530) (epoxy resin), dicyandiamide (curing agent), 2-methylimidazole (promoter agent), porous molybdenum dioxide (prepared according to CN 105977479 A) (porous molybdenum compound) and boehmite (Anhui Yishitong Material Technology Co., Ltd., BG601, average particle size 0.5 μm) were added to butanone (solvent) , mechanically stirred to prepare a 65% glue by weight, and then impregnated with glass fiber cloth (7628, Zhuhai Zhubo Electronic Materials Co., Ltd.) (reinforcement material), and formed a prepreg (prepreg) after heating and drying, and placed copper foil on both sides , pressurized and heated to make a copper-clad laminate.

[0094] In the same manner as in Example 1, a copper-clad laminate using a resin composition was obtained. Table 2 shows the measurement and evaluation results.

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Abstract

The invention provides a thermosetting resin composition, prepreg, a laminated board and a printed circuit board. The thermosetting resin composition is prepared from thermosetting resin, an inorganicfiller and a porous molybdenum compound. The thermosetting resin composition, the prepreg, the laminated board and the printed circuit board provided by the invention have the beneficial effects thatby use of the porous molybdenum compound as a solid lubricant, the problem of dispersion and sedimentation of the molybdenum compound can be effectively solved, and the molybdenum compound can be uniformly distributed in the prepreg; due to better heat conductivity of the porous molybdenum compound, the heat can be better conducted in drilling, the resin can be prevented from sticking on a drilling cutter after being molten, simultaneously the conditions such as hole cracking also can be reduced and the hole-wall quality after drilling can be obviously improved.

Description

technical field [0001] The invention relates to a thermosetting resin composition and a prepreg. Specifically, the present invention relates to a thermosetting resin composition, a prepreg, a laminate and a printed circuit board. Background technique [0002] With the rapid development of electronic products towards miniaturization, multi-function, high performance and high reliability, printed circuit boards begin to move towards high precision, high density, high performance, microporous, thin and multilayer The direction is developing rapidly, and its application scope is becoming more and more extensive. It has rapidly entered civilian electrical appliances and related products from industrial large-scale electronic computers, communication instruments, electrical measurement, national defense, aviation, aerospace and other departments. The matrix material largely determines the performance of printed circuit boards, so it is urgent to develop a new generation of matrix...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L63/04C08K7/24C08K3/36C08K3/34C08J5/24B32B27/20B32B27/04H05K1/03
CPCB32B27/20B32B2260/046B32B2264/10B32B2264/102B32B2264/12B32B2307/302B32B2457/08C08J5/24C08J2363/00C08K3/346C08K3/36C08K7/24C08K2201/003C08L79/04C08L2203/20H05K1/0373C08L63/00C08L63/04
Inventor 杜翠鸣
Owner GUANGDONG SHENGYI SCI TECH
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