Detachable epoxy adhesive for multi-wire cutting and preparation method thereof

An epoxy adhesive and multi-wire cutting technology, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of affecting production efficiency, long degumming time, and chip dropping, so as to improve product yield and increase The effect of glue application efficiency and convenient operation

Pending Publication Date: 2018-06-29
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, if the solar silicon rod glue used in mortar cutting is used in diamond wire cutting, the following problems generally exist: 1. The waiting time for the machine is long, which affects the production efficiency; 2. The toughness of the glue is poor, and there are pieces falling during the cutting process. Risk; 3. The strength, hardness and other properties of the glue in the water-based cutting fluid are seriously reduced, which is easy to cause chip drop, and when the silicon rod is removed from the machine, the silicon rod shakes due to the soft glue layer, resulting in edge chipping of the silicon chip; 4. The degumming time is long , affecting subsequent production

Method used

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  • Detachable epoxy adhesive for multi-wire cutting and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0027] Weigh the following component A raw materials by mass: bisphenol A epoxy resin 55kg, carboxyl-terminated nitrile rubber and epoxy resin prepolymer 8kg, dibutyl sebacate (DBS) 3kg, silicon micropowder 20kg, talcum powder 15kg 1. Blue pulp 1kg. Add the above raw materials into the reaction kettle in order, stir for 1 hour until the material is uniform and there is no color difference, then vacuumize for 1-2 hours to remove the air bubbles generated during stirring.

[0028] Weigh the following component B raw materials by mass: CAPCURE3-800 polythiol curing agent 45kg, modified amine curing agent 18kg, 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) 1kg, silicon 35kg of fine powder, 1kg of yellow paste, the above raw materials are put into the reaction kettle in order, stirred for 1h until the material is uniform and there is no color difference, and then vacuumed for 1~2h to remove the bubbles generated during stirring, after the end, discharge the material and pack it, an...

Embodiment 2

[0030] Weigh the following component A raw materials by mass: bisphenol A epoxy resin 45kg, bisphenol F epoxy resin 10kg, polyurethane modified epoxy resin 8kg, dioctyl phthalate (DOP) 3kg, calcium carbonate 35kg 1. Blue pulp 1kg. Add the above raw materials into the reaction kettle in order, stir for 1 hour until the material is uniform and there is no color difference, then vacuumize for 1-2 hours to remove the air bubbles generated during stirring.

[0031] Weigh the following component B raw materials by mass: CAPCURE3-800 polythiol curing agent 25kg, modified amine curing agent 38kg, 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) 1kg, silicon 35kg of fine powder, 1kg of yellow paste, the above raw materials are put into the reaction kettle in order, stirred for 1h until the material is uniform and there is no color difference, and then vacuumed for 1~2h to remove the bubbles generated during stirring, after the end, discharge the material and pack it, and seal it for stora...

Embodiment 3

[0033] Weigh the following component A raw materials by mass: bisphenol A epoxy resin 20kg, bisphenol F epoxy resin 35kg, amino-terminated nitrile rubber 8kg, dibutyl phthalate (DBP) 3kg, calcium carbonate 35kg, 1kg blue slurry, add the above raw materials into the reaction kettle in order, stir for 1h until the material is uniform and there is no color difference, then vacuumize for 1~2h to remove the bubbles generated during stirring, after the end, discharge the material and pack it, and seal it for storage;

[0034] Weigh the following component B raw materials by mass: 45kg of CAPCURE3830 polythiol curing agent, 18kg of modified amine curing agent, 1kg of benzyldimethylamine (BDMA), 35kg of talcum powder, and 1kg of yellow paste, and add the above-mentioned raw materials to the reaction kettle in order , stir for 1 hour until the material is uniform without color difference, and then vacuumize for 1 to 2 hours to remove the air bubbles generated during stirring.

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Abstract

The invention discloses a detachable epoxy adhesive for multi-wire cutting. The detachable epoxy adhesive comprises two components A and B, wherein the component A and the component B are matched according to a mass ratio of 1 to 1, and the component A is prepared from the following raw materials by mass percent: 30-60% of epoxy resin, 5-10% of toughener, 15-30% of filler, and 1-3% of blue pulp; the component B is prepared from the following raw materials by mass percent: 15-50% of polythiol curing agent, 10-30% of modified amine curing agent, 1-2% of accelerator, 1-5% of diluent, 15-30% of filler, and 1-3% of yellow pulp. The detachable epoxy adhesive disclosed by the invention has the beneficial effects that: 1, the components A and B have low viscosity after mixing and have excellent handleability; 2, the surface drying time of the components A and B is fast after mixing, thereby meeting the high efficiency requirements of the photovoltaic industry; 3, after the end of the cutting,a silicon wafer can be degummed faster and the degumming efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a detachable epoxy adhesive for multi-wire cutting and a preparation method thereof. Background technique [0002] Over the past ten years, the photovoltaic industry has experienced explosive growth. In 2008, my country's photovoltaic installed capacity was only 145MW, and by 2016 it had increased by 238 times, reaching 34.54GW. Due to rapid growth, China's solar installed capacity has accounted for 45% of the global share last year. [0003] As the most important component of photovoltaic modules, silicon wafers are mainly processed by mortar cutting. In recent years, a new cutting method, diamond wire cutting, has emerged. Diamond wire cutting has the advantages of high cutting efficiency, small kerf loss, and environmental pollution. Low, silicon wafer precision, small surface damage and other characteristics, so diamond wire cutting is gradually replacing mortar...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/08C09J11/04C09J11/06
CPCC08K2003/2227C08K2003/265C08K2201/014C08L2205/025C08L2205/03C09J11/04C09J11/06C09J11/08C09J163/00C08L13/00C08L63/00C08K13/02C08K3/34C08K5/11C08K5/12C08K3/36C08L15/00C08K3/26C08K3/22
Inventor 赵江涛刘龙江邱磊常兴
Owner 康达新材料(集团)股份有限公司
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