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Preparation method of composite heat-dissipating powder coating for high-temperature component

A technology for powder coatings and high-temperature components, which is applied in the field of preparation of composite heat-dissipating powder coatings for high-temperature components, can solve problems such as difficult large-scale, large-scale preparation and production, poor mechanical properties of heat-dissipating coatings, and poor thermal conductivity, etc., to achieve Excellent high-temperature thermal stability and electrical insulation, safe and convenient transportation, and high raw material utilization

Inactive Publication Date: 2018-08-10
常州五荣化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention: Aiming at the problems of poor mechanical properties, poor heat conduction effect, high raw material cost and complicated production process of the current heat-dissipating coating, it is difficult to realize large-scale and large-scale preparation and production. Preparation method of composite heat dissipation powder coating for high temperature components

Method used

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  • Preparation method of composite heat-dissipating powder coating for high-temperature component

Examples

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example 1

[0023] Add 60g of boric acid into 500mL of deionized water, stir at 300r / min for 20min at 50°C, then add 80g of urea, heat to 60°C, stir for 30min, transfer to a rotary evaporator, evaporate to dryness at 50°C, To obtain the precursor, place the precursor in a muffle furnace, heat it to 800°C for 5 hours in a nitrogen atmosphere, and calcine it for 5 hours. After cooling to room temperature, wash the calcined product twice with 1% hydrochloric acid, and then wash it with absolute ethanol After 2 times, transfer it to a drying oven and dry at 50°C for 10 hours to obtain flake boron nitride. Take 30g of SEBS thermoplastic elastomer, add it to 100g of white oil, and stir at 200r / min for 20min to obtain a mixed solution. Press the Mix with cyclohexane at a mass ratio of 1:5, stir evenly to obtain an adhesive solution, take polystyrene and put it into a pulverizer and grind it to a particle size of 20 μm to obtain polystyrene particles, take 20g of adhesive solution and 120g of poly...

example 2

[0025]Add 70g of boric acid into 600mL of deionized water, stir at 350r / min for 25min at 55°C, then add 100g of urea, heat to 62°C, stir for 35min, transfer to a rotary evaporator, evaporate to dryness at 60°C, To obtain the precursor, place the precursor in a muffle furnace, heat it to 900°C and calcinate it for 5 hours under a nitrogen atmosphere, after cooling to room temperature, wash the calcined product twice with 1% hydrochloric acid, and then wash it with absolute ethanol After 2 times, transfer it to a drying oven and dry at 55°C for 11 hours to obtain flaky boron nitride. Take 40g of SEBS thermoplastic elastomer, add it to 120g of white oil, and stir at 250r / min for 25min to obtain a mixed solution. Press the Mix with cyclohexane at a mass ratio of 1:5, stir evenly to obtain an adhesive solution, take polystyrene and put it into a pulverizer and grind it to a particle size of 30 μm to obtain polystyrene particles, take 25g of adhesive solution and 160g of polystyrene ...

example 3

[0027] Add 80g of boric acid into 800mL deionized water, stir at 400r / min for 30min at 60°C, then add 120g of urea, heat to 65°C, stir for 40min, transfer to a rotary evaporator, evaporate to dryness at 70°C, To obtain the precursor, place the precursor in a muffle furnace, heat it to 1000°C and calcinate it for 6 hours under nitrogen atmosphere, after cooling to room temperature, wash the calcined product with 1% hydrochloric acid for 3 times, and then wash it with absolute ethanol After 3 times, transfer it to a drying oven and dry at 60°C for 12 hours to obtain flaky boron nitride. Take 50g of SEBS thermoplastic elastomer, add it to 150g of white oil, and stir at 300r / min for 30min to obtain a mixed solution. Press the Mix with cyclohexane at a mass ratio of 1:5, stir evenly to obtain an adhesive solution, take polystyrene and put it into a pulverizer and grind it to a particle size of 40 μm to obtain polystyrene particles, take 30g of adhesive solution and 180g of polystyre...

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Abstract

The invention relates to a preparation method of a composite heat-dissipating powder coating for a high-temperature component, and belongs to the technical field of heat-dissipating coatings. According to the preparation method, high-heat-conducting phenylvinyl silicon resin is used as a matrix; contact points are constructed through effectively lapping magnesium hydroxide, which is high in infrared emitting ability and good in insulativity and is capable of realizing the compatibility of heat conduction, insulation and high radiation, with flaky boron nitride; a heat-conducting filling material is uniformly and firmly adsorbed on the surfaces of polystyrene granules by utilizing an adhesive method; a network is linked through uniformly dispersing effective filling particles in the resin by the polystyrene granules, so that an insulating and heat-conducting composite material with a phase separated structure is prepared; a continuous heat-conducting passage can be formed in the condition of the low-content heat-conducting filling material; moreover, the orientation control to the heat-conducting filling material is easily formed; the heat conduction performance is obviously promoted; meanwhile, the resin is ameliorated by utilizing the filling material, and the composite heat-dissipating powder coating is enabled to have favorable mechanical performance, high bonding strength and excellent high-temperature heat stability and electrical insulativity.

Description

technical field [0001] The invention relates to a preparation method of a composite heat-dissipating powder coating for high-temperature components, and belongs to the technical field of heat-dissipating coatings. Background technique [0002] With the rapid development of modern technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have brought great convenience to people's lives, but they have also brought some problems. One of the more serious problems is the heat dissipation of electronic devices. The heat dissipation of electronic devices will seriously affect the life of electronic devices. Therefore, higher requirements are put forward for the heat dissipation efficiency technology of miniaturized electronic devices. [0003] Heat conduction is a basic way of heat transfer. Its process involves the use of heat sinks or cooling devices to quickly transfer the heat load of electronic devices, heati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/07C09D5/03C09D5/25C09D7/61C09D7/63C09D7/65
Inventor 雷国辉王文新蔡静
Owner 常州五荣化工有限公司
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