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Surface processing method of TCO conductive materials on solar cell

A technology of solar cells and conductive materials, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as poor adsorption, complicated process, and high cost, and achieve the effect of improving adsorption

Inactive Publication Date: 2018-08-10
SUZHOU SUNWELL NEW ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the biggest problem of electroplating copper on TCO is the poor adsorption force, and the electroplated metal grid lines are very easy to fall off. The industry's solution to this is the standard process of the semiconductor industry. First, sputter or evaporate the entire surface of the TCO. "Seed layer" metal, and then make a mask for the opening, remove the mask after electroplating in the opening of the mask, and finally use chemical etching to remove the part that is not electroplated. This process is not only complicated, but also the cost is too high, which is not suitable for solar cells. mass production

Method used

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  • Surface processing method of TCO conductive materials on solar cell
  • Surface processing method of TCO conductive materials on solar cell
  • Surface processing method of TCO conductive materials on solar cell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] In the production process of heterojunction solar cells, after depositing ITO on the front and back sides, the front and back sides are patterned by dry film lithography, and openings are formed on the dry film after development.

[0042] The sample was immersed in a sulfuric acid solution with a concentration of 0.5mol / L, the treatment time was 10s, and the treatment temperature was 30°C.

[0043] The solar cell is immersed in an aqueous solution containing sodium chloride and hydrochloric acid, the concentration of sodium sulfate is 0.02 mol / L, the concentration of hydrochloric acid is 0.2 mol / L, the ITO in the surface dry film opening before and after the negative electrode of the power supply is connected, and the ITO in the solution when the positive electrode of the power supply is connected For graphite electrodes, the current density of the ITO surface is 2mA / cm2, and the time is 10s.

[0044] The sample after surface treatment is immersed in the electroplating ...

Embodiment 2

[0046]In the production process of heterojunction solar cells, after IWO is deposited on the front and rear sides, the front surface is patterned by inkjet printing UV curing ink to form partially exposed openings.

[0047] Contact the front surface of the solar cell with an aqueous solution containing potassium sulfate, nitric acid, and oxalic acid. The concentration of potassium sulfate is 0.8mol / L, the concentration of nitric acid is 0.2mol / L, and the concentration of oxalic acid is 0.1mol / L. The negative electrode of the power supply is connected to the rear surface, and the positive electrode of the power supply is connected The platinum electrode in the solution, the current density of the IWO surface treated by electricity is 1.5mA / cm2, and the time is 50s.

[0048] The front surface of the solar cell is contacted with the electroplating solution, copper is electroplated first, and tin is electroless at last, and the plated metal pattern becomes the metal grid line of th...

Embodiment 3

[0050] In the production process of heterojunction solar cells, after depositing ATO on the front and back sides, the front surface is patterned by photolithography to form partially exposed openings.

[0051] The sample was placed in the reaction chamber of the plasma etching machine, and oxygen gas was introduced at a frequency of 13.56 MHz, and the processing time was 10 s.

[0052] Immerse the solar cell in an aqueous solution containing sodium sulfate and hydrochloric acid. The concentration of sodium sulfate is 0.01 mol / L, and the concentration of hydrochloric acid is 0.0005 mol / L. The solar cell is irradiated with a white LED light source for 20 seconds.

[0053] The front surface of the solar cell is contacted with the electroplating solution, first electroless nickel plating, then electroplating copper, and finally electroplating silver, and the plated metal pattern becomes the metal grid line of the solar cell.

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Abstract

The present invention discloses a surface processing method of TCO conductive materials on a solar cell. The method comprises the concrete steps of: allowing a TCO layer to be in contact with conductive solution with acid in low concentration, providing electrons for the surface of the TCO, and forming a current at the interface of the TCO and the conductive solution for flowing through, wherein the current direction is from the conductive solution to the interface of the TCO and the solution to allow the current to communicate with an electrode in the conductive solution to form a conductiveloop. The surface processing method of TCO conductive materials on a solar cell performs processing of the surface of the TCO prior to electroplating to improve the adsorption capacity of a plating plate and the surface of the TCO and reach the enough adsorption capacity when metal electroplating is directly performed on the TCO.

Description

technical field [0001] The invention relates to the field of solar cell manufacturing, in particular to a surface treatment method for a TCO conductive material on a solar cell. Background technique [0002] Transparent conductive films (TCO), including indium tin oxide (ITO), tin oxide (TO), tungsten-doped indium oxide (IWO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO) and fluorine-doped tin oxide (FTO) etc. are widely used on different types of solar cell surfaces due to their light-transmitting and conductive properties. [0003] In order to significantly reduce the manufacturing cost of solar cells, it has become a consensus in the industry to replace silver paste with electroplated copper for metal conductive electrodes. [0004] However, the biggest problem of electroplating copper on TCO is the poor adsorption force, and the electroplated metal grid lines are very easy to fall off. The industry's solution to this is the standard process of the semiconductor i...

Claims

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Application Information

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IPC IPC(8): H01L31/18
CPCH01L31/1888Y02E10/50Y02P70/50
Inventor 李中天
Owner SUZHOU SUNWELL NEW ENERGY CO LTD