Cleaning agent for electronic material
A technology of electronic materials and cleaning agents, applied in the field of cleaning agents, can solve the problems of high corrosion of metal shells, damage of circuit board materials, poor cleaning effect, etc., and achieve the effect of low price, uniformity and safe use
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Embodiment 1
[0027] A cleaning agent for electronic materials, made of the following raw materials in parts by weight:
[0028]
[0029] The additive is a composition prepared by mixing benzyl alcohol and ammonium dihydrogen phosphate in a mass ratio of 3:7;
[0030] The preparation method of described fluorosilicon surfactant, comprises the steps:
[0031] 1) Dissolve 120g of heptadecylfluorodecyltrimethoxysilane in 400g of isopropanol, and add 1,1,3,3-tetramethyl-1,3 bis[3-(oxiranyl methyl 100 g of oxy)propyl] disiloxane and 5 g of triethylamine were stirred and reacted under reflux at 100° C. for 6 hours to obtain a crude product;
[0032] 2) Add 50 g of sodium p-hydroxybenzenesulfonate, 25 g of triphenylphosphine, and 30 g of triethylamine to 350 g of the crude product prepared in step 1), and react under reflux and stirring for 4 hours at 80° C. , adding acetic acid to adjust the pH to neutral, and washing with water three times to prepare the fluorosilicon surfactant.
Embodiment 2
[0034] The technical solution adopted in the present invention is: a cleaning agent for electronic materials, made of the following raw materials in parts by weight:
[0035]
[0036] The additive is a composition prepared by mixing cetylpyridinium chloride and lithium carbonate in a mass ratio of 2:3;
[0037] The preparation method of described fluorosilicon surfactant, comprises the steps:
[0038] 1) Dissolve 130g of heptadecylfluorodecyltrimethoxysilane in 500g of isopropanol, and add 1,1,3,3-tetramethyl-1,3 bis[3-(oxiranyl methyl 100 g of oxy)propyl] disiloxane and 6 g of tetramethylammonium hydroxide were stirred and reacted under reflux at 105° C. for 7 hours to obtain a crude product;
[0039] 2) Add 110 g of sodium p-hydroxybenzenesulfonate, 6 g of triphenylphosphine, and 7 g of triethylamine to 700 g of the crude product prepared in step 1), and react under reflux and stirring for 4.5 hours at 85° C. , adding acetic acid to adjust the pH to neutral, washing wit...
Embodiment 3
[0041] A cleaning agent for electronic materials, made of the following raw materials in parts by weight:
[0042]
[0043] The additive is a composition prepared by mixing cetyl ammonium bromide and antibacterial agent HFXZ-881 at a mass ratio of 5:7;
[0044] The preparation method of described fluorosilicon surfactant, comprises the steps:
[0045] 1) Dissolve 140g of heptadecylfluorodecyltrimethoxysilane in 550g of isopropanol, and add 1,1,3,3-tetramethyl-1,3 bis[3-(oxiranyl methyl 100 g of oxy)propyl] disiloxane and 7 g of base catalyst were refluxed and stirred at 110° C. for 8 hours to obtain a crude product;
[0046] 2) Add 110 g of sodium p-hydroxybenzenesulfonate, 7 g of triphenylphosphine, and 9 g of triethylamine to 700 g of the crude product prepared in step 1), and react under reflux and stirring for 4.7 hours at 87° C. , adding acetic acid to adjust the pH to neutral, washing with water for 5 times, and preparing the fluorosilicon surfactant;
[0047] The ...
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Abstract
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