Diamond grinding wheel for grinding and preparation method of diamond grinding wheel

A diamond grinding wheel and diamond technology, applied in the direction of grinding/polishing equipment, grinding equipment, metal processing equipment, etc., can solve the problems of high operating temperature, chip adhesion and blockage, difficult high-speed machining, etc., to achieve increased grinding speed, Reduced power loss and high grinding accuracy

Inactive Publication Date: 2018-11-06
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional superhard abrasives (grinding wheels) are mostly manufactured by resin, ceramics, metal bond sintering and electroplating. The problem is that single crystal particles are only mechanically embedded in the bond and electroplating layer, and bond and Weak force between plating layers
Specifically, although the resin bond is relatively easy to process and repair, it has poor heat resistance, low bonding strength, serious abrasive shedding, and seriously affects efficiency; the vitrified bond is relatively easy to repair and has a high service temperature, but it is brittle and impact toughness. Poor fatigue, prone to brittle cracking, difficult to use in high-speed machining
Although metal bond sintering has strong heat resistance, chemical metallurgical bonding cannot occur between the bond and the abrasive grains, so the abrasive grains are only mechanically embedded in the bond with limited holding power; abrasive grains in metal electroplating are only mechanically embedded
Therefore, it is easy to cause the overall failure of the grinding wheel due to the particle shedding of the abrasive and the peeling off of the coating in flakes. This situation is especially obvious when the more difficult-to-process materials are efficiently ground; in addition, the coating is thick, the exposure height of the abrasive is low, and the chip space is small. , it is easy to fail due to the adhesion and clogging of chips during grinding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A diamond grinding wheel for grinding, which includes a steel core and an abrasive ring, the steel core and the abrasive ring are combined by a resin adhesive, wherein the abrasive ring is prepared from the following components in terms of mass percentage: diamond abrasive: 48%, Metal bond: 47%, auxiliary binder: 5%, the sum of the mass percentage of diamond abrasive, metal bond and auxiliary binder is 100%; the mass percentage of the metal bond contains: Cu powder: 65%, TiH 2 Powder: 35%, Cu powder and TiH 2 The sum of the powder mass percentages is 100%; the abrasive ring composition is by volume percentage: 32% of diamond abrasive, 30% of metal bond, and 38% of pores, and the sum of the volume percentage of diamond abrasive, metal bond and pores is 100%; The diamond abrasive, Cu powder and TiH 2 The particle diameters of the powders are all 30 μm; the auxiliary binder is acrylic emulsion.

[0038] The preparation method of above-mentioned grinding diamond emery wh...

Embodiment 2

[0055] A diamond grinding wheel for grinding, which includes a steel core and an abrasive ring, the steel core and the abrasive ring are combined by a resin adhesive, wherein the abrasive ring is prepared from the following components in terms of mass percentage: diamond abrasive: 48%, Metal bond: 47%, auxiliary binder: 5%, the sum of the mass percentage of diamond abrasive, metal bond and auxiliary binder is 100%; the mass percentage of the metal bond contains: Cu powder: 70%, TiH2 Powder: 30%, Cu powder and TiH 2 The sum of the powder mass percentages is 100%; the abrasive ring composition is by volume percentage: 35% of diamond abrasive, 30% of metal bond, and 35% of pores, and the sum of the volume percentage of diamond abrasive, metal bond and pores is 100%; The diamond abrasive, Cu powder and TiH 2 The particle size of the powder is 60 μm; the auxiliary binder is acrylic emulsion.

[0056] The preparation method of above-mentioned grinding diamond emery wheel, comprise...

Embodiment 3

[0073] A diamond grinding wheel for grinding, which includes a steel core, an abrasive ring, the steel core and the abrasive ring are combined by a resin adhesive, wherein the abrasive ring is prepared from the following components by mass percentage: diamond abrasive: 50%, Metal bond: 45%, auxiliary binder: 5%, the sum of the mass percentage of diamond abrasive, metal bond and auxiliary binder is 100%; the mass percentage of the metal bond contains: Cu powder: 75%, TiH 2 Powder: 25%, Cu powder and TiH 2 The sum of the powder mass percentages is 100%; the abrasive ring composition is by volume percentage: 40% of diamond abrasive, 30% of metal bond, and 30% of pores, and the sum of the volume percentage of diamond abrasive, metal bond and pores is 100%; The diamond abrasive, Cu powder and TiH 2 The particle diameters of the powders are all 100 μm; the auxiliary binder is acrylic emulsion.

[0074] The preparation method of above-mentioned grinding diamond emery wheel, compri...

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Abstract

The invention discloses a diamond grinding wheel for grinding and a preparation method of the diamond grinding wheel and relates to the field of ultra-hard abrasives. The grinding wheel comprises a steel core and an abrasive ring, and the steel core and the abrasive ring are combined through a resin binding agent and a resin glue adhesion agent; the abrasive ring is prepared from diamond abrasives, a metal binging agent and an auxiliary adhesion agent; the metal binding agent contains Cu powder and TiH2 powder; and the abrasive ring is composed of diamond abrasives, a metal binding agent and agap. The preparation method includes the steps that firstly, the diamond abrasives, the Cu powder and the TiH2 powder are mixed uniformly, and a mixed material A is obtained; secondly, the auxiliaryadhesion agent and the mixed material A are mixed uniformly, and a mixed material B is obtained; thirdly, the mixed material B is dried; fourthly, the mixed material B after being dried is subjected to sieving; fifthly, the mixed material B after being subjected to sieving is subjected to cold pressing forming; sixthly, abrasive ring green pressing is performed, and after sintering in the inert gas atmosphere, an abrasive ring green body is made; and seventhly, the resin glue adhesion agent is used for adhering the abrasive ring green body and the steel core, and the diamond grinding wheel forgrinding is obtained.

Description

technical field [0001] The invention relates to the field of superhard abrasives, in particular to a diamond grinding wheel for grinding and a preparation method thereof. Background technique [0002] With the development of modern machining in the direction of high precision, high speed, hard machining, dry machining (no coolant) and cost reduction, quite high requirements are put forward for the performance of abrasive tools. Traditional silicon carbide and corundum ordinary abrasive molds can no longer fully meet the current high-speed, high-efficiency, and high-precision grinding requirements. Therefore, it is an inevitable development to develop various superhard grinding materials with excellent wear resistance and stable processing for a long time trend. Currently commonly used superhard grinding materials include diamond and cubic boron nitride abrasives. Diamond is the hardest material and is extremely wear-resistant, suitable for high-speed grinding and ultra-pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/06B24D18/00
CPCB24D3/06B24D18/00
Inventor 王聪范永刚
Owner NORTHEASTERN UNIV
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