Cyanic acid ester compound and method for producing same, resin composition, cured article, prepreg, sealing material, fiber-reinforced composite material, adhesive agent, metal foil-clad laminate plate, resin sheet, and printed wiring board

Abstract

Provided are: a novel cyanic acid ester compound which has excellent solubility in solvents and makes it possible to produce a cured article having a low thermal expansion coefficient and excellent flame retardancy and heat resistance; a resin composition which contains the compound; and others. Provided is a resin composition which can be cured into a cured article that enables the provision of aprinted wiring board having excellent peel strength, an excellent glass transition temperature, an excellent thermal expansion coefficient, an excellent water absorption rate and an excellent heat conductivity. Provided is a resin composition which can be cured into a cured article that enables the provision of a printed wiring board having a high glass transition temperature and a low thermal expansion property and also having an excellent bending elastic modulus and an excellent heat conductivity. A cyanic acid ester compound represented by general formula (1).

Description

technical field [0001] The present invention relates to cyanate compounds, their production methods, resin compositions, and uses thereof. Background technique [0002] Cyanate compounds are cured to form triazine rings, and are widely used for various functions such as structural composite materials, adhesives, electrical insulating materials, and electrical and electronic components due to their high heat resistance and excellent electrical properties. Raw materials for polymer materials. However, in recent years, the various physical properties required as functional polymer materials have become increasingly severe as the performance required in these application fields has improved. Examples of these physical properties include flame retardancy, heat resistance, low thermal expansion coefficient, low water absorption, low dielectric constant, low dielectric loss tangent, weather resistance, chemical resistance, and high fracture toughness. However, these required phys...

AI Technical Summary

Problems solved by technology

However, to date, these required properties have not necessarily been met

[0004] For example, in the field of semiconductor packaging materials, there is a problem that warpage occurs due to the mismatch of thermal expansion coefficient between the semiconductor chip and the substrate material as the substrate becomes thinner

[0015] Furthermore, multilayer printed circuit boards have problems such as the expansion of warpage, so properties such as high glass transition temperature and low thermal expansion are required for the resin composition used as the material of the insulating layer

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