A kind of composite linear dicing knife for semiconductor slicing and its manufacturing method

Abstract

The invention discloses a composite linear dicing blade for semiconductor slicing and a manufacturing method thereof. The linear dicing blade comprises three parts: a flexible substrate, a thermally stable support layer and a dense micro-arc oxidation film layer; wherein the flexible substrate Specifically, it is composed of 80-85 parts by weight of aluminum ingots, 15-18 parts of AlSi10 aluminum-silicon master alloy ingots, 3-5 parts of (CrFe)Al7 alloy ingots, 3-5 parts of magnesium powder blocks, positive silicon 6 parts-8 parts of ethyl acetate fully aged supersaturated solid solution sintered by powder metallurgy; the thermally stable support layer is specifically 25-30 parts by weight of discarded nickel-chromium superalloy, 3-5 parts of activated carbon powder, 18-20 parts of aluminum powder are melted by aluminum to form a semi-fluid and then sprayed out to be uniformly solidified on the surface of the flexible substrate; the dense micro-arc oxidation layer is fixed and grown on the surface of the thermally stable support layer. The invention has low cutting tool vibration rate, sufficient toughness, self-lubrication, high temperature resistance and excellent stability.

Description

technical field [0001] The invention relates to the field of special materials, in particular to a composite linear scribing knife for semiconductor slicing and a manufacturing method thereof. Background technique [0002] Superalloys are mainly divided into two categories: solid solution strengthening and precipitation hardening. Among them, solid solution strengthening superalloys have a slightly lower technical threshold and a larger usage. As we all know, superalloys have high costs and high scrap rates. The condition is bad, and once it fails after long-term use, it can only be discarded directly (recycling and reuse costs are higher, because the reasons for failure are too complicated, including stress corrosion, wear, metal melting, recrystallization, etc., and it is impossible to accurately control when recycling Its composition ratio and impurity refining), resulting in great waste, but even if these alloys can no longer be used in high temperature and severe workin...

AI Technical Summary

Problems solved by technology

However, to achieve excellent linear cutting, there must be at least a few technical features: 1. The cutting edge is thin and hard; 2. The blade is thin and has both strength and toughness; 3. It is not easy to shake the knife (that is, hard and hard cutting occurs as little as possible); 4. The performance is stable, and the mechanical performance will not decrease with the increase of the temperature of the long cutting blade. There is no special technology in this field in the prior art

[0004] Due to the contradictory state of the slicing knife in the prior art due to its size, bonding force, strength and performance, there is still no cutting semiconductor cutting tool with low cutting vibration rate, sufficient toughness, self-lubricating, high temperature resistance and excellent stability on the market. Slicing knife