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A kind of ink composition with high heat resistance and high light transmittance and its application

A technology of ink composition and high light transmittance, which can be used in inks, applications, household appliances, etc., can solve the problems of low light transmittance, air permeability, heat resistance, etc., and achieve low water vapor transmission rate and low oxygen transmission rate , the effect of reducing shrinkage volume

Active Publication Date: 2021-01-26
ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current ink composition is still difficult to simultaneously meet the performance index requirements of high light transmittance, high photocuring rate, low air permeability and high heat resistance that are increasingly required by thin film packaging.

Method used

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  • A kind of ink composition with high heat resistance and high light transmittance and its application
  • A kind of ink composition with high heat resistance and high light transmittance and its application
  • A kind of ink composition with high heat resistance and high light transmittance and its application

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0074] The preparation of the inorganic barrier layer can deposit a layer of SiNx by PECVD, with a thickness ranging from 0.1 μm to 20 μm.

[0075] In addition, there are many options for physical property testing. For example, some implementation methods of cured films have Fourier Transform Infrared (FT-IR) real-time spectroscopy to measure the degree of curing or a weighing method to measure the degree of curing.

[0076] The organic thin film ink composition of the present application can be used for encapsulation of flexible OLED display devices. The flexible OLED device mainly comprises: an organic light-emitting diode, an inorganic layer for encapsulation, and an organic layer stacked together. The OLED device device includes a substrate ITO, a device (organic light-emitting diode) for the device formed on the substrate, and a package member formed on the package member and including an inorganic barrier layer SiN x , organic barrier layer, inorganic barrier layer SiN ...

Embodiment 1

[0079] Embodiment 1: Preparation of silicon-containing monomer 1-1

[0080] Silicon-containing monomer 1-1 is prepared according to the following reaction formula:

[0081]

[0082] 1.1. Synthesis of TM-1

[0083] Add 4.8g (0.2mol) magnesium chips in a 250mL three-necked flask equipped with a constant pressure dropping funnel, an electric stirrer and a condenser, and use high-purity N 2 permutation three times, at N 2 Under protection, add 40mL of tetrahydrofuran to cover the magnesium chips, drop a small amount of mixed solution prepared by 47g (0.2moL) p-dibromobenzene and 100mL tetrahydrofuran at room temperature to initiate the reaction, and then slowly add the mixed solution to maintain the reaction under slight reflux , Dropped within 1h, and when there is no reflux, use an oil bath to heat and reflux for 1h. After cooling to room temperature, 11.6 g (0.09 moL) of dichlorodimethylsilane was added dropwise in a cold water bath at about 10°C. After the drop was compl...

Embodiment 2

[0091] Embodiment 2: Preparation of silicon-containing monomer 1-2

[0092] Silicon-containing monomer 1-2 is prepared according to the following reaction formula:

[0093]

[0094] Add 250ml ethyl acetate, 16g (0.05moL) bis(p-bromophenylsilyl) dimethyl silicon and 6g (0.1moL) Allyl alcohol, with high purity N 2 permutation three times, at N 2 Under protection, 4.8 g of palladium carbon (5% content) was added to maintain the reaction (80° C.) under a slight reflux state for 4 hours.

[0095] Ethyl acetate was evaporated to obtain 22g of crude product, 100mL of dichloromethane and 12mL of triethylamine were added, the reaction solution was cooled to 0°C, 20g (0.2mol) of 2-methacryloyl chloride was slowly added dropwise, and the reaction was kept at 0°C overnight. Residual solvent was removed by distillation and purified by column chromatography to obtain 20.88g of product with a yield of 72%, purity: 99.3%, M / e: 580.

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Abstract

The present invention provides an ink composition having high heat resistance and high transparency. The ink composition is an ultraviolet light curing material, comprising a silicon-containing monomer with a mass percentage of 15-80%, a photocrosslinking initiator with a mass percentage of 1-10% and a mass percentage of 15% ‑75% light-curable monomer. The ink composition is used for thin film encapsulation of OLED devices, can effectively block water and oxygen, has high heat resistance and high transparency, and further prolongs the service life of OLED devices.

Description

technical field [0001] The invention relates to an ultraviolet light curing material, in particular to an ink composition with high heat resistance and high transparency applicable to organic light-emitting OLED devices. Background technique [0002] Organic Light-Emitting Diodes (OLEDs) have all-solid-state, active light-emitting, high brightness, high contrast, ultra-thin and ultra-light, low cost, low power consumption, no viewing angle limitation, wide operating temperature range, etc. characteristics, and can be fabricated on a flexible, lightweight, and durable plastic substrate, which can realize a truly flexible display. It is a technology that best meets people's requirements for future displays. [0003] Compared with liquid crystal display (LCD), organic electroluminescent device (OLED) has low driving voltage, high luminous brightness and luminous efficiency, wide luminous viewing angle, and fast response speed; in addition, it is ultra-thin and can be fabricated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101
CPCC09D11/101
Inventor 洪海兵周光大林建华
Owner ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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