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Method of forming a pd-au alloy layer on a substrate

A technology of alloy layer and base material, which is applied in the field of forming Pd-Au alloy layer, can solve the problems of unsuitable vanadium-based film, achieve good composition and properties, and simplify processing

Active Publication Date: 2019-03-15
COMMONWEALTH SCI & IND RES ORG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, existing annealing deposition methods are not suitable for vanadium-based films because the palladium and gold layers substantially diffuse into the vanadium or vanadium alloy substrate during the annealing stage

Method used

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  • Method of forming a pd-au alloy layer on a substrate
  • Method of forming a pd-au alloy layer on a substrate
  • Method of forming a pd-au alloy layer on a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0167] Embodiment 1: complex alloy precursor

[0168] The electroplating solution is formed by a mixture of diamino palladium nitrate solution and potassium cyanide gold solution, and the mixing ratio of palladium: gold is 80:20 and 70:30. Each precursor solution was from Metakem GmbH, Usingen, Germany.

[0169] After mixing, the solution was found to be stable with no gold precipitation in the solution within 2 months.

[0170] Two vanadium tubes are provided for plating. Before electroplating, the outer surface of the vanadium tube is cleaned to remove any oil and oxide layer to allow good adhesion of the alloy layer during electroplating. Such as Figure 4 with 5 As shown, the tubes were subjected to: mechanical cleaning, more specifically mechanical polishing using abrasive media ( Figure 4 ); and cathodic acid etching using hydrofluoric acid ( Figure 5 ). Figure 5 The cleaning steps for cleaning the inside of the tube are shown. It should be noted that in this ...

Embodiment 2

[0173] Embodiment 2: palladium-gold alloy film

[0174] In the experimental trials detailed in this example, palladium-gold alloy thin films were deposited on:

[0175] A). A flat substrate; and

[0176] B). 10mm-diameter x 100mm-long vanadium tube for laboratory testing of sulfur resistance.

[0177] Varying the chemistry of the plating solution to increase stability and identify variables that will affect the composition of the plating alloy. The composition of the deposited alloy layers was quantified by x-ray diffraction (XRD) analysis.

[0178] method

[0179] The following experimental equipment was used for pilot experiments:

[0180] Plating device for small plane samples: Figure 8 A small sample electroplating apparatus 300 for plating planar substrates is shown. A 65 mm x 20 mm mixed metal oxide coated titanium anode 302 was placed in a heating bath along with the substrate to be plated 304 . The bath was placed on a magnetic stirrer (not shown) and then heat...

Embodiment 3

[0301] Example 3: High Surface Area Plating

[0302] The rougher the surface area, the more surface area that traps and / or reflects light at different angles. Surface texture or roughness is important because it provides a greater surface area. h 2Permeability increases with surface area and surface roughness. Shading or light reflectance provides an indication of the roughness of the Pd-Au plated coating. The brightness (shading / light reflectance) of the four samples was measured to correlate it with surface roughness.

[0303] A Hall cell device was set up as described in Example 2. Samples were prepared as described in Example 2. Substrate preparation: in 10% H 2 SO 4 Soak in the medium for 10 seconds, electrolytically clean in Legor SGR1P detergent (100g / L) at 8.6V for 30 seconds, and rinse with deionized water. Connect the sample to the high current density end of the Hall cell and place it in KAu(CN) 2 / Legor Pd plating solution mixture for 5 minutes without sti...

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Abstract

A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold complex, wherein the ratio of gold to palladium to in the solution is from 5 to 40 w / w%. Also taught is a substrate such as a vanadium or vanadium alloy gas separation membrane coated with a palladium-gold alloy layer.

Description

technical field [0001] The present invention generally relates to methods of forming a Pd-Au alloy layer on a substrate. The present invention is particularly applicable to the formation of catalytic sulfur resistant layers on the surface of vanadium or vanadium alloy films, and it is convenient to disclose the invention hereinafter in relation to this exemplary application. However, it should be understood that the present invention is not limited to this application and may be applied as an alloy layer to various metal substrates. Background technique [0002] The following discussion of the background to the invention is intended to facilitate an understanding of the present invention. It should be understood, however, that the discussion is not an acknowledgment or confirmation that any of the material referred to was published, known or part of the common general knowledge as at the priority date of the application. [0003] Hydrogen (H 2 ) is not very abundant in na...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D3/48B01D71/02B01D69/04
CPCB01D63/12B01D69/02B01D69/04B01D53/228B01D69/043B01D67/0069C25D3/567C25D7/04C25D5/34C25D5/38C22C27/025B08B3/08B08B3/12B01D71/02231B01D71/0221
Inventor M·兰利D·维亚诺M·多兰
Owner COMMONWEALTH SCI & IND RES ORG
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