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Organic silicon pouring sealant and preparation method thereof

A technology of silicone potting glue and hydrogen silicon, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of weak adhesion, complicated preparation process, and limited preparation process, and achieve Good high temperature resistance, simple preparation process, and broad application prospects

Inactive Publication Date: 2019-05-24
BEIJING GUANGKEBOYE SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Silicone potting adhesives have low cohesive strength, weak adhesion, and large curing shrinkage, resulting in poor sealing performance and limited preparation processes, which limit the development of silicone potting adhesives
Chinese patent CN 109161375 discloses a silicone potting compound prepared by double-ended vinyl silicone oil, which has good thermal conductivity, thermal stability and mechanical properties after curing, but the invention is a one-component potting compound, and the curing process hard to control
Chinese patent CN 108192562 A discloses a silicone material made by polycondensation of dihydroxy polysiloxane. The fully cured material has good weather resistance and good adhesion, but small molecular compounds are produced during the preparation process. Very likely to be harmful to electronic devices
Chinese patent CN 104119832 A discloses an epoxy siloxane polymer prepared by mixing epoxy dialkoxysiloxane, dialkoxysiloxane, binary silanol, and silicon glycol compounds , cured under ultraviolet lamps, avoiding the problems of easy poisoning of platinum metal catalysts and environmental pollution, etc., the prepared silicone potting adhesive has good adhesion and dielectric properties, but the whole preparation process is complicated, and the synthetic silicone potting Sealing material performance is uneven

Method used

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  • Organic silicon pouring sealant and preparation method thereof
  • Organic silicon pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A silicone encapsulant, which is composed of A component and B component, wherein A component includes: 50 parts of double-ended vinyl silicone oil with a viscosity of 500mPa·s and a viscosity of 1200mPa·s in parts by weight 50 parts of dual-end vinyl silicone oil, 1 part of silane coupling agent, 5 parts of fumed silica, 50 parts of 5 μm spherical silica, 80 parts of 5 μm spherical alumina, and 0.015 parts of catalyst.

[0024] Component B includes the following components in parts by weight: 10 parts of hydrogen-containing silicone oil with a viscosity of 500 mPa·s, 60 parts of vinyl MQ silicone resin, and 0.15 parts of inhibitor.

[0025] Add double-terminal vinyl silicone oil, fumed silica and silane coupling agent into the mixer, stir evenly at a speed of 200 rpm, then add reinforcing materials in batches, and stir at a high speed of 1500 rpm For 30 minutes, add the catalyst at the end and continue to stir until uniform; mix the vinyl MQ silicone resin, hydrogen-co...

Embodiment 2

[0028] A silicone encapsulant, consisting of two components, A component and B component, A component includes the following components in parts by weight: 60 parts of double-ended vinyl silicone oil with a viscosity of 500mPa·s, a viscosity of 40 parts of 1500mPa·s double-ended vinyl silicone oil, 1 part of silane coupling agent, 5 parts of fumed silica, 50 parts of 5 μm spherical silica, 70 parts of 5 μm spherical alumina, and 0.015 parts of catalyst.

[0029] Component B includes the following components in parts by weight: 10 parts of hydrogen-containing silicone oil with a viscosity of 200 mPa·s, 50 parts of vinyl MQ silicone resin, and 0.15 parts of inhibitor.

[0030] According to the preparation process described in Example 1, component A and component B were mixed to prepare a potting compound and test samples. According to the test method of Example 1, the performance test was carried out on the test sample, and the results are shown in Table 1.

Embodiment 3

[0032] A silicone encapsulant, consisting of two components, A component and B component, A component includes the following components in parts by weight: 60 parts of double-ended vinyl silicone oil with a viscosity of 1200mPa·s, a viscosity of 40 parts of 1500mPa·s double-ended vinyl silicone oil, 1 part of silane coupling agent, 5 parts of fumed silica, 50 parts of 5 μm spherical silica, 50 parts of 5 μm spherical alumina, and 0.01 part of catalyst.

[0033] Component B includes the following components in parts by weight: 10 parts of hydrogen-containing silicone oil with a viscosity of 20 mPa·s, 70 parts of vinyl MQ silicone resin, and 0.15 parts of inhibitor.

[0034] According to the preparation process described in Example 1, component A and component B were mixed to prepare a potting compound and test samples. According to the test method of Example 1, the performance test was carried out on the test sample, and the results are shown in Table 1.

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Abstract

The invention discloses an organic silicon pouring sealant and a preparation method thereof, and belongs to the field of electronic polymer materials. The problems that an existing organic silicon pouring sealant is poor in heat resistance and poor in sealing performance are solved. The product comprises a component A and a component B, wherein the mass ratio of the component A to the component Bis (3-5):1; the component A comprises, by weight, 96-102 parts of double-ended vinyl silicone oil, 0.5-1 part of a coupling agent, 80-120 parts of a reinforcing material, 5-10 parts of a thixotropic agent and 0.01-0.02 part of a catalyst; the component B comprises, by weight, 10-20 parts of hydrogen-containing silicone oil, 50-70 parts of vinyl MQ silicon resin and 0.1-0.15 part of an inhibitor. The preparation process is simple and environmentally friendly, and the cured pouring sealant has good high-temperature resistance, is good in air tightness and long in service life, is a flexible material and is particularly suitable for packaging of equipment such as nuclear power sensors.

Description

technical field [0001] The invention relates to the field of electronic polymer materials, in particular to a silicone potting glue. Background technique [0002] Potting glue is mainly used for bonding, sealing, potting and coating protection of electronic components. With the development of industries such as aerospace, aircraft manufacturing and electronics, new sealing materials with high temperature resistance and good stability are required. Especially in the nuclear power industry, nuclear power sensor equipment puts forward higher performance requirements for potting compounds. [0003] Traditional epoxy and polyurethane potting sealants cannot be widely used due to excessive hardness and poor heat resistance after curing. Due to its good thermal stability, cold resistance, electrical properties and excellent weather resistance, silicone has good process characteristics and is environmentally friendly during operation. The cured material has good toughness and can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06
Inventor 田陆牛晓茹
Owner BEIJING GUANGKEBOYE SCI & TECH