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A kind of thermosetting resin composition and prepreg and laminated board prepared by using it

A resin composition, thermosetting technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of low glass transition temperature, poor adhesion, insufficient rigidity, etc., and achieve high crosslinking density. , Small thermal shrinkage, the effect of improving peel strength

Active Publication Date: 2021-12-28
常熟生益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. , low glass transition temperature, poor adhesion and other problems, there are still many problems to be solved in practical applications

Method used

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  • A kind of thermosetting resin composition and prepreg and laminated board prepared by using it
  • A kind of thermosetting resin composition and prepreg and laminated board prepared by using it
  • A kind of thermosetting resin composition and prepreg and laminated board prepared by using it

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0095] Three-necked reaction flask into tetrahydrofuran 1000g, after dicyclohexyl carbodiimide 100g, 58.8 g maleic anhydride, bisphenol A 228g mixed sufficiently dissolved three-necked flask was placed the reaction, and then added with stirring a catalytic amount of 4-dimethylaminopyridine, the reaction at room temperature for 5 hours after which the product was isolated and purified to obtain active ester resin a-1, the active ester (a-1) hydroxyl functional group equivalent ratio of resin to calculate input 690 g / eq (228-18 * 58.8 + 0.6 = 276,276 / 690 = 0.4), ester functional equivalents to calculate the charge ratio of 230 g / eq, an unsaturated double bond functionality equivalent weight 460 g / eq.

[0096] Equipped with a thermometer, a dropping funnel, a condenser, a bypass pipe, and a stirrer was charged with the solvent methyl isobutyl ketone 1000g, and resin A-1 276g taken into a flask, sufficiently dissolved. The nitrogen pressure inside the reaction system, and the ...

Synthetic example 2

[0098] Three-necked reaction flask into tetrahydrofuran 1000g, after dicyclohexyl carbodiimide 100g, maleic anhydride 58.8g, 2,7-dihydroxynaphthalene 160g mixed sufficiently dissolved three-necked flask was placed the reaction, and then added with stirring a catalytic amount of 4-dimethylaminopyridine, the reaction at room temperature for 5 hours after which the product was isolated and purified to obtain active ester resin (a-2), (a-2) a hydroxyl functional group equivalent of the resin into an active ester ratio calculating 520 g / eq (0.6 * 58.8 + 160-18 = 208, 208 / 0.4 = 520), a functional equivalent of an ester group to calculate the charge ratio of 173 g / eq, an unsaturated double bond functionality equivalent weight 347 g / eq.

[0099] Equipped with a thermometer, a dropping funnel, a condenser, a bypass pipe, and a stirrer was charged with the solvent methyl isobutyl ketone 1000g, and then the resin A-2 208g taken into a flask, sufficiently dissolved. The nitrogen press...

Embodiment 1～9 and comparative example 2～3

[0104] According to the formulation shown in Table 1, the first embodiment requires the active ester of an unsaturated polyester of Example 5, vinyl crosslinker, initiator according to Example 1 of the prepolymer prepolymerized, in Example 6 embodiment is not active esters saturated polyester, vinyl crosslinker, initiator according to Example 2 of the prepolymer prepolymerized. Examples 3 to 4, Examples 7 to 9 and Comparative Examples 2 and 3 without prepolymerization, but ordinary physical blending, which is not particularly described.

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PUM

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Abstract

The invention discloses a thermosetting resin composition, which, in parts by weight, comprises: (a) epoxy resin: 100 parts; (b) unsaturated polyester active ester resin represented by structural formula (1): 50-200 parts (c) Resin containing both maleimide group and vinyl group as shown in structural formula (2): 10-200 parts by weight; (d) Cyanate resin: 10-200 parts; (e) Acceleration Dosage: 0.05~4 servings. The present invention combines epoxy resin, maleimide resin, cyanide resin through the reactivity of unsaturated bond between unsaturated polyester active ester, resin containing maleimide group and vinyl group at the same time, and cyanate ester. The ester resin is effectively combined in a resin system, so that the resin composition has excellent dielectric properties, heat resistance, strength, rigidity and flexibility, high peel strength, low water absorption, and small thermal shrinkage after curing. For high-speed, high-frequency printed circuit boards.

Description

Technical field [0001] The present invention relates to a thermosetting resin composition and a prepreg applications and laminates thereof prepared, belongs to the technical field of electronic materials. Background technique [0002] In recent years, information processing and information transfer with the high-speed high frequency technology continues to advance, the printed circuit board material of higher and higher demands on the electrical dielectric performance. Briefly, i.e. printed circuit board material requires a lower dielectric constant and dielectric loss tangent, in order to reduce delay, distortion and loss at the time of high-speed transmission signal, and the interference between the signals. Accordingly, it is desirable to provide a thermosetting resin composition, the thermosetting resin composition using such printed circuit board material prepared in a high speed, high frequency signal transmission can exhibit a sufficiently low dielectric constant and low d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L67/06C08L79/08C08L79/04C08L61/14C08L71/12B32B15/20B32B15/14B32B33/00
Inventor 何继亮焦锋陈诚王宁黄荣辉马建崔春梅储正振
Owner 常熟生益科技有限公司
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