Photothermal dual-curing solder resist ink with high adhesion and use method thereof

A technology of solder resist ink and high adhesion, applied in ink, photosensitive materials used in optomechanical equipment, optics, etc., can solve problems such as poor adhesion, difficulty, and decreased insulation reliability of solder resist ink coating, and achieve The effect of good adhesion and excellent toughness

Inactive Publication Date: 2019-06-11
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When selecting ink raw materials, it is very difficult to balance the adhesion, toughness and insulation reliability of the solder resist ink coating at the same time.
Because at present, ingredients such as acrylate resin or polyurethane are usually added to enhance its adhesion to the surface of the substrate, but it will bring many negative effects
On the one hand, the molecular weight and viscosity of the above-mentioned additives are relatively large, and it is difficult to dissolve evenly with other componen

Method used

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  • Photothermal dual-curing solder resist ink with high adhesion and use method thereof
  • Photothermal dual-curing solder resist ink with high adhesion and use method thereof
  • Photothermal dual-curing solder resist ink with high adhesion and use method thereof

Examples

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Example Embodiment

[0022] The present invention will be described in further detail below in conjunction with specific embodiments.

[0023] In a dust-free laboratory, the raw materials were stirred and mixed according to the proportions in Table 1 to prepare the photothermal dual-curing solder resist inks of Examples 1-4 and Comparative Examples 1-7.

[0024] Table 1:

[0025]

[0026]

[0027] Wherein the acrylate compound with carboxyl used in the embodiment refers to omega-carboxyl-polycaprolactone-acrylate; Silicone elastomer is the copolymerization compound of linear polysiloxane and elastic block and strengthening agent composition The complex body, the elastic block is polymethyl methacrylate block, the reinforcing agent is silica, quartz and diatomaceous earth; the sealing agent is methyl isocyanate; the epoxy resin-acrylate copolymer is bisphenol A Copolymer synthesized with acrylate; photoinitiator is benzoin; pigment is carbon black; additive is silicone leveling agent; organi...

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Abstract

The invention belongs to the technical field of ink, and relates to a photothermal dual-curing solder resist ink with high adhesion and a use method thereof. A formula of the photothermal dual-curingsolder resist ink comprises 100 parts by mass of an acrylate compound with a carboxyl group, 0.5-30 parts by mass of organosilicon elastomer, 0.5-20 parts by mass of a sealant, 0.1-30 parts by mass ofan epoxy resin-acrylate copolymer, 5-30 parts by mass of epoxy resin, 0.5-5 parts by mass of a photoinitiator, 1-5 parts by mass of pigment, 0.1-5 parts by mass of an additive and an organic solventfor dissolving the above components. The use method comprises the steps of coating, exposure development and curing. The solder resist ink coating of the invention has good adhesion, excellent toughness, softness and insulation reliability, is especially used for a FPC roll-to-roll process, and can pass various FPC reliability tests.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to a photothermal dual-curing solder resist ink with high adhesion. Background technique [0002] With the high integration of components such as integrated circuits, the advancement of semiconductor packaging technology, the development of high-frequency signal transmission, and the trend of thinner and shorter terminal electronic products, the PCB printed circuit board (Printed CircuitBoard) is directly promoted to multi-layer , high density, and complex structure. The technical progress of high-end products such as HDI (High Density Interconnect) circuit boards, packaging substrates and flexible FPC (Flexible Printed Circuit) circuit boards has requirements for the brightness, resolution, adhesion and other properties of photothermal dual-curing solder mask inks. Continuous improvement, among which the improvement of the adhesion between solder resist ink and different types of PCB...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/102G03F7/027G03F7/004
Inventor 张燕红向文胜赵建龙李林朱坤陆兰陈小华杜冰张兵
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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