Photothermal dual-curing solder resist ink with high adhesion and use method thereof

Abstract

The invention belongs to the technical field of ink, and relates to a photothermal dual-curing solder resist ink with high adhesion and a use method thereof. A formula of the photothermal dual-curingsolder resist ink comprises 100 parts by mass of an acrylate compound with a carboxyl group, 0.5-30 parts by mass of organosilicon elastomer, 0.5-20 parts by mass of a sealant, 0.1-30 parts by mass ofan epoxy resin-acrylate copolymer, 5-30 parts by mass of epoxy resin, 0.5-5 parts by mass of a photoinitiator, 1-5 parts by mass of pigment, 0.1-5 parts by mass of an additive and an organic solventfor dissolving the above components. The use method comprises the steps of coating, exposure development and curing. The solder resist ink coating of the invention has good adhesion, excellent toughness, softness and insulation reliability, is especially used for a FPC roll-to-roll process, and can pass various FPC reliability tests.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to a photothermal dual-curing solder resist ink with high adhesion. Background technique [0002] With the high integration of components such as integrated circuits, the advancement of semiconductor packaging technology, the development of high-frequency signal transmission, and the trend of thinner and shorter terminal electronic products, the PCB printed circuit board (Printed CircuitBoard) is directly promoted to multi-layer , high density, and complex structure. The technical progress of high-end products such as HDI (High Density Interconnect) circuit boards, packaging substrates and flexible FPC (Flexible Printed Circuit) circuit boards has requirements for the brightness, resolution, adhesion and other properties of photothermal dual-curing solder mask inks. Continuous improvement, among which the improvement of the adhesion between solder resist ink and different types of PCB...

AI Technical Summary

Problems solved by technology

When selecting ink raw materials, it is very difficult to balance the adhesion, toughness and insulation reliability of the solder resist ink coating at the same time.

Because at present, ingredients such as acrylate resin or polyurethane are usually added to enhance its adhesion to the surface of the substrate, but it will bring many negative effects

On the one hand, the molecular weight and viscosity of the above-mentioned additives are relatively large, and it is difficult to dissolve evenly with other components, which will reduce the toughness and rigidity of the solder resist ink coating; In the experiment, the moisture absorption is strong, which leads to a sharp drop in the insulation reliability of the solder resist ink coating

At the same time, if the rigidity and toughness of the solder resist ink coating are increased simply by adding inorganic fillers, problems such as poor adhesion and easy cracking in the insulation reliability test will occur due to the unbalanced ratio of organic and inorganic substances.

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