Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film

A technology of benzimidazole polyamic acid and polyimide film is applied in the field of benzimidazole-substituted polyimide film and preparation, and can solve the problems affecting the performance and yield of flexible circuit boards, and the water absorption of polyimide. High rate, secondary processing influence and other problems, to achieve the effect of good dimensional stability, excellent mechanical properties, high thermal stability

Active Publication Date: 2019-09-06
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyimide prepared by the above-mentioned prior art has a high water absorption rate (WA>6%), and it is easy to cause quality defects such as cracking and delamination of the flexible circuit board in the production process of the flexible circuit board when used in the flexible circuit board, which is serious. Affect the performance and yield of flexible circuit boards
At the same time, Qingming X

Method used

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  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film
  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film
  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film

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Example Embodiment

[0058] The present invention provides a preparation method of the benzimidazole substituted polyimide described in the above technical scheme, including the following steps:

[0059] Under protective atmosphere conditions, mixing diamine monomers, dianhydride monomers, and solvents for polymerization reaction to obtain benzimidazole polyamic acid;

[0060] Subjecting the benzimidazole polyamic acid to an imidization reaction to obtain a benzimidazole substituted polyimide;

[0061] The diamine monomer has a structure represented by formula A-1 or formula A-2:

[0062]

[0063] In formula A-1 and formula A-2, R 1 Including any one of the following substituents:

[0064]

[0065] The dianhydride monomer includes any one or two of the following structural formulas:

[0066]

[0067] In the present invention, unless otherwise specified, all raw material components are commercially available products well known to those skilled in the art.

[0068] In the present invention, the diamine monomer...

Example Embodiment

[0100] Example 1

[0101]

[0102] Under nitrogen protection, add 10g of 6-amino-2-(4-aminobenzene)-1-methylbenzimidazole to 50g of N,N-dimethylacetamide, stir and mix under ice bath conditions, and add 9.1601 g pyromellitic dianhydride continues to stir. With the extension of the stirring time, the viscosity of the system increases. Add 58.6g of N,N-dimethylacetamide. The solid content of the resulting system is 15.0wt%. Start timing, after 10 hours of polymerization, take off the reaction device and seal the bottle mouth, put it in a refrigerator at -20°C and freeze for 24 hours to defoam to obtain a uniform yellow benzimidazole polyamic acid glue (PAA glue) ;

[0103] Thaw the PAA glue solution at room temperature for 30 minutes, and apply a film on a clean and flat glass sheet with a thickness of 400μm. Transfer the coated glass sheet to a blast oven, according to 80℃ / 1h+140℃ / 1h+200℃ / 1h heating program to remove the solvent, after the oven temperature drops to room temperat...

Example Embodiment

[0104] Example 2

[0105]

[0106] Under nitrogen protection, add 10g of 6-amino-2-(4-aminobenzene)-1-methylbenzimidazole to 50g of N,N-dimethylacetamide, stir and mix under ice bath, add 12.3471 g3,3',4,4'-Biphenyltetracarboxylic dianhydride continues to stir, the viscosity of the system increases with the extension of the stirring time, and 76.6g of N,N-dimethylacetamide is added, and the resulting system is solid The content is 15.0wt%, starting from the time when the solvent is added, after 10 hours of polymerization, the reaction device is removed and the bottle mouth is sealed, and placed in a refrigerator at -20°C for 24 hours to defoam to obtain a uniform yellow benzimidazole Polyamic acid glue (PAA glue);

[0107] Thaw the PAA glue solution at room temperature for 30 minutes, and apply a film on a clean and flat glass sheet with a thickness of 400μm. Transfer the coated glass sheet to a blast oven, according to 80℃ / 1h+140℃ / 1h+200℃ / 1h heating program to remove the solve...

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Abstract

The invention provides a benzimidazole-substituted polyimide, a preparation method thereof, a benzimidazole-substituted polyimide film, and a preparation method and an application of the film, and belongs to the technical field of polyimide materials. The glass transition temperature of the benzimidazole-substituted polyimide film is 328-431 DEG C, the 5% thermal decomposition temperature is 498-537 DEG C, the tensile strength is 69-190 MPa, the tensile modulus is 3.5-6.2 GPa, the water absorption rate is 1.12-1.78%, the thermal expansion coefficient is 2.5-48.0 ppm/K, and the film is thermally soluble in m-cresol, N-methylpyrrolidone, dimethyl sulfoxide, N,N-dimethylformamide, N,N-dimethylacetamide and tetrahydrofuran organic solvents. The benzimidazole-substituted polyimide film providedby the invention has the advantages of high thermal stability, good dimensional stability, low water absorption rate, excellent mechanical properties, and good solubility in organic solvents.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a benzimidazole-substituted polyimide and a preparation method thereof, a benzimidazole-substituted polyimide film, a preparation method and an application thereof. Background technique [0002] Polyimide (Polyimide, referred to as PI), refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain, and is one of the organic polymer materials with the best comprehensive performance. Excellent mechanical properties, electrical properties and flexibility, widely used in electronics, electrical engineering, aerospace and other industries, among them, polyimide films used in flexible circuit boards and other fields need to have excellent heat and cold resistance, radiation resistance , insulation and dimensional stability. [0003] Polyimide is generally prepared by polymerization of diamine monomers and dianhydride monomers. Among them, polyimide fil...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1039C08G73/1085C08J5/18C08J2379/08
Inventor 李慧钱广涛陈春海姚佳楠刘刚陈海权胡梦杰于有海
Owner DONGHUA UNIV
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