Glass powder for copper conductive paste, preparation method and application thereof

Abstract

The invention discloses glass powder for copper conductive paste, which comprises the following components in parts by weight: 2-40 parts of vanadium pentoxide, 12-60 parts of silicon dioxide, 5-35 parts of boron oxide and 1-20 parts of zinc oxide. The glass powder is crystallized glass, can obtain high high-temperature viscosity, can prevent glass transition defects, and reduces interference on welding wetting and welding adhesion. The glass powder is used for preparing the conductive copper paste, and the copper paste is used for preparing MLCC end electrodes. The glass powder shows strong adhesive force with a BaTiO3 ceramic matrix, ensures good compatibility between end electrodes and base metal internal electrodes, and meets all requirements of MLCC on copper end electrode paste glasspowder. Meanwhile, the invention also provides a preparation method and application of the glass powder for the copper conductive paste.

Description

technical field [0001] The invention relates to a lead-free and cadmium-free glass powder and a preparation method thereof. The glass powder is used for preparing a copper conductive terminal paste, and the copper conductive terminal paste is mainly used for preparing MLCC terminal electrodes. Background technique [0002] With the continuous development of electronic equipment in the direction of light, thin, short and small, chip electronic components are required to be further miniaturized, and have high reliability, high precision, high integration, high frequency, intelligence, low power consumption, large capacity, low cost. Chip multilayer ceramic capacitor (MLCC) is one of the most widely used and fastest growing chip components in electrical equipment. Initially, it was mainly used in oscillation, coupling, filtering, and bypass circuits in various military and civilian electronic machines. Today, the application field has expanded to notebook computers, mobile pho...

AI Technical Summary

Problems solved by technology

However, during the copper paste sintering process, Bi will interact with BaTiO in the MLCC ceramic body 3 The reaction will cause the insulation resistance to drop, and will also increase the stress between the ceramic body and the metal terminal electrode, which will easily cause the terminal to crack during the accelerated aging process of high temperature, high pressure and high humidity.

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