Method for selective metallization of plastic product and surface of plastic substrate
A metallization and product technology, applied in the field of selective metallization of plastic film products and plastic substrate surfaces, can solve the problems of solution decomposition, easy self-decomposition, and difficult to achieve metallization, achieve good adhesion performance, reduce production costs, The effect of improving production efficiency
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preparation example Construction
[0032] The second aspect of the present invention provides the preparation method of above-mentioned plastic film product, it is characterized in that, described method comprises the following steps:
[0033] S01 uses the method of vacuum plating to metallize the surface of the non-metallic layer to form a bonding layer;
[0034] S02 uses chemical plating to form a chemical layer on the surface of the bonding layer;
[0035] S03 uses electroplating to form a protective layer on the surface of the chemical layer.
[0036] vacuum plating
[0037] Vacuum plating mainly includes several types of vacuum evaporation, sputtering and ion plating. They all use distillation or sputtering to deposit various metal and non-metal films on the surface of plastic parts under vacuum conditions. This way can get very thin surface coating.
[0038] In the present invention, sputtering coating is mainly used for metallization to form a bonding layer.
[0039] sputter coating
[0040] Com...
Embodiment approach
[0050] As an embodiment of the present invention, the chemical layer formed by the electroless plating is a copper film.
[0051] As an embodiment of the present invention, the plating step of the electroless plating includes at least one or more of copper plating and a combination of the following steps;
[0052] The combination of steps includes:
[0053]Leavening, gum removal, neutralization, adjustment, activation pretreatment, activation, activation reduction.
[0054] As an embodiment of the present invention, the plating step of the electroless plating includes at least one or more of copper plating and a combination of the following steps;
[0055] The combination of steps includes: activation, activation and reduction.
[0056] Puffy
[0057] Bulking is a prerequisite for providing a uniform and ideal pore wall for subsequent steps.
[0058] The leavening agent used in the present invention is made up of water, leavening additive, pH correction agent; And the le...
Embodiment 1
[0153] This embodiment provides a kind of plastic film product, and described plastic film product is deposited with three-layer metal thin film, is bonding layer, chemical layer and protective layer respectively; Described bonding layer is made up of bonding plastic layer and bonding metal layer; Plastic film The thickness is 50 μm.
[0154] The bonding layer is coated by sputtering, the chemical layer is coated by electroless plating, and the protective layer is coated by electroplating.
[0155] Wherein, the bonding plastic layer is formed of Ni metal, the bonding metal layer is formed of Cr metal, and both the chemical layer and the protective layer are formed of copper metal.
[0156] The mode of sputtering is as follows:
[0157] S01. In the environment of argon and reaction gas, turn on the bias power supply, turn on the intermediate frequency power supply of the target material required for coating, and coat non-metallic materials. The bias power supply voltage is set...
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Abstract
Description
Claims
Application Information
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