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Method for selective metallization of plastic product and surface of plastic substrate

A metallization and product technology, applied in the field of selective metallization of plastic film products and plastic substrate surfaces, can solve the problems of solution decomposition, easy self-decomposition, and difficult to achieve metallization, achieve good adhesion performance, reduce production costs, The effect of improving production efficiency

Active Publication Date: 2022-03-15
广东硕成科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Electroless nickel belongs to the self-catalysis system, which is particularly sensitive to metal palladium and is easy to self-decompose. At present, the relatively mature process of plastic surface metallization uses metal palladium as the catalyst, which has high requirements on the process stability of chemical nickel deposition. Inadvertently causing the solution to decompose, so a chemical nickel stabilizer must be added during use
Today's conventional chemical nickel stabilizers all use high-polluting heavy metals such as lead, cadmium, mercury, and thallium, which do not meet the environmental protection requirements of today's society.
[0005] The practical application of metallizable plastics in the prior art has great limitations. Most non-electroplating-grade conventional plastics cannot be metallized, and metallizable electroplating-grade plastics can only be fully metallized, which is difficult to achieve. Achieving metallization selectivity, technical issues affecting industry development
For example, plastics such as PC, PET, PMMA, etc., are difficult to achieve metallization, and for conventional electroplating grade plastics, only the entire surface can be metallized, and it is difficult to achieve metallization selectivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0032] The second aspect of the present invention provides the preparation method of above-mentioned plastic film product, it is characterized in that, described method comprises the following steps:

[0033] S01 uses the method of vacuum plating to metallize the surface of the non-metallic layer to form a bonding layer;

[0034] S02 uses chemical plating to form a chemical layer on the surface of the bonding layer;

[0035] S03 uses electroplating to form a protective layer on the surface of the chemical layer.

[0036] vacuum plating

[0037] Vacuum plating mainly includes several types of vacuum evaporation, sputtering and ion plating. They all use distillation or sputtering to deposit various metal and non-metal films on the surface of plastic parts under vacuum conditions. This way can get very thin surface coating.

[0038] In the present invention, sputtering coating is mainly used for metallization to form a bonding layer.

[0039] sputter coating

[0040] Com...

Embodiment approach

[0050] As an embodiment of the present invention, the chemical layer formed by the electroless plating is a copper film.

[0051] As an embodiment of the present invention, the plating step of the electroless plating includes at least one or more of copper plating and a combination of the following steps;

[0052] The combination of steps includes:

[0053]Leavening, gum removal, neutralization, adjustment, activation pretreatment, activation, activation reduction.

[0054] As an embodiment of the present invention, the plating step of the electroless plating includes at least one or more of copper plating and a combination of the following steps;

[0055] The combination of steps includes: activation, activation and reduction.

[0056] Puffy

[0057] Bulking is a prerequisite for providing a uniform and ideal pore wall for subsequent steps.

[0058] The leavening agent used in the present invention is made up of water, leavening additive, pH correction agent; And the le...

Embodiment 1

[0153] This embodiment provides a kind of plastic film product, and described plastic film product is deposited with three-layer metal thin film, is bonding layer, chemical layer and protective layer respectively; Described bonding layer is made up of bonding plastic layer and bonding metal layer; Plastic film The thickness is 50 μm.

[0154] The bonding layer is coated by sputtering, the chemical layer is coated by electroless plating, and the protective layer is coated by electroplating.

[0155] Wherein, the bonding plastic layer is formed of Ni metal, the bonding metal layer is formed of Cr metal, and both the chemical layer and the protective layer are formed of copper metal.

[0156] The mode of sputtering is as follows:

[0157] S01. In the environment of argon and reaction gas, turn on the bias power supply, turn on the intermediate frequency power supply of the target material required for coating, and coat non-metallic materials. The bias power supply voltage is set...

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Abstract

The invention provides a plastic film product. At least three metal films are deposited on the plastic film product, which are respectively a bonding layer, a chemical layer and a protective layer; the bonding layer is composed of a bonding plastic layer and a bonding metal layer; the The bonding layer has a thickness of 2-500 nm.

Description

technical field [0001] The invention relates to a plastic surface treatment method, and more particularly to a plastic film product and a selective metallization method on the surface of a plastic substrate. Background technique [0002] The commonly used methods for metallization modification of plastic surface are: chemical treatment, vacuum plating, spray plating, and doping metal powder or metal salt in the material. The metal film coating obtained by vacuum plating and spray plating is extremely thin, with poor conductivity, shielding performance and wear resistance; the method of doping metal powder or metal salt in polymer materials is cumbersome to operate, high in cost, poor in decorative performance, and rarely used The chemical treatment method is a commonly used method, which is widely used and has the advantages of strong decoration, good bonding force, excellent conductivity, and controllable metal layer thickness. [0003] Articles made from electrically non-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/02C23C14/20C23C18/31C23C18/40C25D3/38
CPCC23C28/02C23C14/205C23C18/1633C23C18/31C23C18/40C25D3/38
Inventor 曾庆明孙宇曦宋亦健李友
Owner 广东硕成科技股份有限公司