Polyamide film suitable for outer packing of electronic products and preparation method of polyamide film
A polyamide film, electronic product technology, applied in packaging, wrapping paper, layered products, etc., can solve the problems of poor moisture absorption and flame retardancy, low dimensional stability, low heat resistance, etc., achieve low water absorption, excellent Gas barrier properties, the effect of improving flexibility
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[0066] The present invention also provides a preparation method of polyamide film suitable for outer packaging of electronic products, including the following steps:
[0067] The first step: the components in the upper surface layer, the core layer and the lower layer are separately mixed and stirred. The stirring is preferably carried out by a high-speed mixer for stirring and dispersing uniformly;
[0068] Step 2: Melt and extrude the raw materials of the upper surface layer, core layer and lower layer through their respective extruders, flow out through a T-die, and cool on a cold roll to form an unstretched sheet;
[0069] The third step: the unstretched sheet is stretched stepwise or simultaneously at 60-140°C to obtain a film, and the stretching ratio is preferably 2.6*2.6-3.5*3.5;
[0070] The fourth step: heat setting the stretched film at 150-210°C, the setting time is preferably 5-20s, the relaxation rate is preferably 3%, and at least one surface of the film is corona treate...
Embodiment 1
[0073] The composition of the upper surface layer is: the mass percentage content of polyphenylene sulfide is 65.6%, the mass percentage content of nylon 6 is 20%, the mass percentage content of thermoplastic elastomer is 8%, glycidyl methacrylate grafted styrene The mass percentage content of elastomer is 5%, the mass percentage content of higher alcohol phosphate sodium salt is 0.2%, the mass percentage content of magnesium carbonate is 0.5%, the mass percentage content of erucamide is 0.2%, and the gas-phase method dioxide The silicon content is 0.5% by mass.
[0074] The composition of the core layer is: the mass percentage content of copolymer nylon 6 / 66 is 61.9%, the mass percentage content of MXD6-PA66 copolymer is 10%, the mass percentage content of polyphenylene sulfide is 5%, and the silicone grafting modification The mass percentage content of polyphenylene sulfide is 20%, the mass percentage content of epoxy resin is 3%, and the mass percentage content of castor oil p...
Embodiment 2
[0079] The composition of the upper surface layer is: the mass percentage of polyphenylene sulfide is 75.8%, the mass percentage of nylon 610 is 15%, the mass percentage of polyamide elastomer is 3%, the glycidyl methacrylate grafted benzene The mass percentage content of ethylene elastomer is 4%, the mass percentage content of castor oil phosphate salt is 0.5%, the mass percentage content of diatomaceous earth is 1%, and the mass percentage content of ethylene bisstearamide is 0.2%. , The mass percentage content of precipitated silica is 0.5%.
[0080] The composition of the core layer is: the mass percentage content of copolymer nylon 66 / 6 is 45.9%, the mass percentage content of MXD6-PA66 copolymer is 25%, the mass percentage content of polyphenylene sulfide is 10%, and the polyhedral silsesquioxane of multi-end groups The mass percentage content of oxane grafted modified polyphenylene sulfide is 15%, the mass percentage content of acrylic acid grafted polyphenylene sulfide is...
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