Nickel-rhenium alloy rotary tubular target containing trace rare earth elements and preparation method thereof

A rare earth element and rhenium alloy technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of low alloy target density, many defects in as-cast structure, low utilization rate, and low quality. Achieve the effects of high gas content, good sputtering effect and improved utilization
CN110484886AActive Publication Date: 2019-11-22南京达迈科技实业股份有限公司 +1

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
南京达迈科技实业股份有限公司
Publication Date
2019-11-22

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Abstract

The present invention discloses a nickel-rhenium alloy rotary tubular target containing trace rare earth elements and a preparation method thereof. The target comprises the following components in percentages by mass: Re 2-5%, Zr 0.02-0.1%, B 0.05-0.1%, Mg 0.01-0.05% and balance of Ni and inevitable impurities. The preparation method includes the processes such as vacuum melting, atomization ingotting, sintering, hot isostatic pressing, hot forging, hot rolling, cross roll piercing, annealing and machining. The invention is the rotary tubular target; the utilization rate of the material is improves; furthermore the target microstructure is fine and uniform; and the quality is higher. The invention is the integral target with low gas content and high purity; the target can return to a furnace as the returned material even after use; and the cost is saved.
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Description

technical field

[0001] The invention relates to a target material of magnetron sputtering equipment and a preparation method thereof, in particular to a nickel-rhenium alloy rotary tubular target material containing trace rare earth elements used for magnetron sputtering and a preparation method thereof. Background technique

[0002] With the rapid development of the electronic information industry, the application of thin film science is becoming more and more extensive. The sputtering method is one of the main technologies for preparing thin film materials, and the source material for sputtering deposited thin films is the target material. The film deposited by sputtering with the target has high density and good adhesion. Since the 1990s, new devices and new materials in the microelectronics industry have developed rapidly. Electronics, magnetism, optics, optoelectronics and superconducting thin films have been widely used in high-tech and industrial fields, prompting th...

Claims

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