A kind of acf conductive adhesive tape and its preparation process and application

Abstract

The present invention relates to a kind of ACF conductive adhesive tape and its preparation process and application. The ACF conductive adhesive tape includes a release layer and an adhesive film layer; the upper surface of the release layer is coated with an adhesive film layer, and the adhesive film includes the following components in parts by weight: polyamide Resin 60-70, polyurethane resin 3-7, conductive particles 10-25, tackifying resin 4-6, thermally conductive filler 0.4-0.6, thixotropic agent 4-7; its preparation process includes the following steps: S1, polyamide resin 1. Polyurethane resin and conductive particles are blended in a twin-screw extruder; S2, and then the rubber particles added with conductive particles in S1 are extruded and blended with tackifying resin, thermally conductive filler, and thixotropic agent; S3, blending The final rubber particles are put into the coating machine, heated and melted for coating, the melted film is coated on the release paper, cooled and dried on the water cooling roller, and the ACF conductive tape is obtained. The adhesive tape of the invention has unidirectional electrical conductivity, and the adhesive tape of the invention will not cause heat damage to the back of the card body when used for card making.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to an ACF conductive adhesive tape and its preparation process and application. Background technique [0002] At present, the main packaging processes of dual-interface bank cards include wire pick-up process, tin sheet process, conductive pillar process and ACF conductive tape process. Among them: the wire pick-up process is to first complete the hot-press bonding of the ordinary hot-melt adhesive film and the module carrier tape, pick up the two enamelled copper wire ends on the antenna layer, and perform welding with the contacts on the back of the IC module , and finally complete the thermocompression bonding; the tin sheet process is to firstly complete the thermocompression bonding of the ordinary hot melt adhesive film and the module carrier tape, and weld two tin sheets on the antenna layer in advance, and connect the back of the IC module with tin wire The contacts ...

AI Technical Summary

Problems solved by technology

However, the current problems of these three processes are that the corresponding process equipment and consumables such as tin wire, tin sheet, and solder paste need to be invested. The customer's equipment investment is large, more labor needs to be invested, and the production efficiency is low.

The ACF conductive tape process is to complete the hot-press bonding of the conductive tape and the module carrier tape, without soldering and other operations, and directly heat-press the module and the card body. It does not require special double-interface packaging equipment, and the speed is fast. The performance is stable; however, the conductive particle size of the current ACF conductive tape is small. Since the distance between the contact on the back of the module of the dual-interface bank card and the antenna layer is about 80 μm to 100 μm, the gap between the contact points is relatively large. When encapsulating, the dual-interface encapsulation equipment is required to have a very precise pressure control system to maintain a high and stable pressure. At the same time, it is necessary to increase the heat pressing time. Once the heat pressing is unsuccessful, the card will be scrapped; and the encapsulation needs to be done within 200- Encapsulation at the operating temperature of 220°C will cause thermal damage to the back of the card body and affect the appearance of the card

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