Insulating corrosion-resistant bonding wire with inorganic amorphous coating and preparation method of insulating corrosion-resistant bonding wire

A bonding wire, inorganic non-technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of rising bonding wire manufacturing costs, inability to be widely used, and easy oxidation of bonding wires. and other problems, to achieve the effect of reducing arc height, good wire-bonding workability and high corrosion resistance

Active Publication Date: 2020-01-21
烟台一诺电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, bonding copper wires have oxidation problems, and silver wires have problems such as vulcanization and low reliability. At present, the method to solve the problem of easy oxidation and corrosion of bonding wires is to add an anti-corrosion coating on the surface of the wires, so that the wires are separated from air, etc. Corrosion medium isolation, but conventional electroplating gold, palladium, etc. will cause environmental pollution problems, which also caused a substantial increase in the manufacturing cost of bonding wires, making it impossible to be widely used

Method used

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  • Insulating corrosion-resistant bonding wire with inorganic amorphous coating and preparation method of insulating corrosion-resistant bonding wire
  • Insulating corrosion-resistant bonding wire with inorganic amorphous coating and preparation method of insulating corrosion-resistant bonding wire
  • Insulating corrosion-resistant bonding wire with inorganic amorphous coating and preparation method of insulating corrosion-resistant bonding wire

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Effect test

Embodiment 1

[0019] An insulating and corrosion-resistant inorganic amorphous coating silver bonding wire with a diameter of 25 μm (1.0 mil, not including the thickness of the coating), the weight percentage of each component of the material constituting the bonding wire is:

[0020] The amount of Au is 0.2%, the amount of Pd is 0.1%, the amount of La is 30ppm, and the balance is Ag as the alloy substrate; the material of the outer insulating and corrosion-resistant inorganic amorphous coating is SiO 2 55%, Al 2 o 3 26%, B 2 O 15%, Li 2 O 4%.

[0021] Its preparation method comprises the following steps:

[0022] The first step is to select the alloy base material: select silver metal raw materials with a high purity of more than 99.999%;

[0023] The second step, smelting: according to the percentage of alloy composition, pre-alloy and stir at 1250°C with argon protection, and perform continuous drawing at 1150°C to form alloy rods with a diameter of 8±0.3mm;

[0024] The third step...

Embodiment 2

[0034] An insulating and corrosion-resistant inorganic amorphous copper bonding wire with a diameter of 25 μm (1.0 mil, not including the thickness of the insulating film), the weight percentage of each component of the material constituting the bonding wire is:

[0035] The Cu content of the copper bonding wire is greater than 99.99%; the outer insulation and anti-corrosion inorganic amorphous coating material is SiO 2 58%, Al 2 o 3 25%, B 2 O 16%, Li 2 O 1%.

[0036] Its preparation method comprises the following steps:

[0037] The first step is to select the base material: select a high-purity copper metal raw material with a purity of more than 99.999%;

[0038] The second step, smelting: according to the percentage of alloy composition, continuous drawing casting is carried out at 1200°C, and drawing casting is made into alloy metal rods with a diameter of 7±0.3mm;

[0039]The third step, wire drawing: firstly, the alloy metal rod is drawn into a wire with a diamet...

Embodiment 3

[0046] An insulating and corrosion-resistant inorganic amorphous coating gold bonding wire with a diameter of 20 μm (0.8 mil, not including the thickness of the coating), the weight percentage of each component of the material constituting the bonding wire is:

[0047] The content of Au is 85%, the amount of Pd is 1.5%, and the amount of Ag is 17.5%; the material of the outer insulating and anti-corrosion inorganic amorphous coating is SiO 2 52%, Al 2 o 3 27%, B 2 O 18%, Li 2 O 3%.

[0048] Its preparation method comprises the following steps:

[0049] The first step is to select the alloy base material: select high-purity gold raw materials that reach 99.999% or more;

[0050] The second step, smelting: according to the percentage of the alloy composition, the process of pre-alloying and stirring under the protection of argon at 1550°C, and continuous casting at 1250°C is used to cast alloy metal rods with a diameter of 8±0.3mm ;

[0051] The third step, wire drawing: ...

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Abstract

The invention discloses an insulating corrosion-resistant bonding wire with an inorganic amorphous coating. The bonding wire comprises a bonding wire substrate and an inorganic amorphous plating layer, and the inorganic amorphous plating layer is composed of the following components in percentage by weight: 40%-60% of SiO2, 15%-30% of Al2O3, 10%-25% of B2O and 0.1%-5% of Li2O. The bonding wire provided by the invention has higher corrosion resistance and vulcanization resistance, high tensile strength and good routing operation performance, and does not influence the bonding property of welding of the substrate bonding wire and a chassis; by using the method, the arc height can be reduced, the insulating corrosion-resistant inorganic amorphous plating layer can enhance the adhesion betweenthe wire and glue in the packaging process, the welding reliability is improved, the harmful substances such as C and S cannot be generated, and the corrosion resistance is far higher than that of anorganic coating; compared with palladium plating, gold plating and other metal plating materials, the bonding wire is low in preparation cost, wide in application range, free of pollution to the environment and suitable for the integrated circuit and LED packaging industry.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an insulating and anti-corrosion inorganic amorphous coating bonding wire and a preparation method thereof. Background technique [0002] With the rapid development of electronic information technology, electronic products are evolving in the direction of miniaturization, portability and multi-function. Electronic packaging materials and technologies enable electronic devices to eventually become functional products. A variety of new packaging materials, technologies and processes have been developed. Electronic packaging is working with electronic design and manufacturing to jointly promote the development of an information society. [0003] Bonding wire is one of the four essential basic materials (chip, frame, bonding wire, sealing material) for semiconductor discrete devices and integrated circuit packaging industry. It is used as the inner lead wire between chip and fram...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/60
CPCH01L24/43H01L24/45H01L2224/43848H01L2224/45144H01L2224/45147H01L2224/45139H01L2224/45124H01L2224/45565H01L2924/00011H01L2924/01049
Inventor 林良刘炳磊韩连恒颜廷来刘华章刘运平
Owner 烟台一诺电子材料有限公司
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