Silicon resin and preparation method thereof, resin composition, semi-cured sheet, laminated board, insulation board, circuit substrate, and covering film

Abstract

The invention provides silicon resin and a preparation method thereof, a resin composition, a semi-cured sheet, a laminated board, an insulation board, a circuit substrate, and a covering film. The silicon resin has at least one of a structural formula (1) or a structural formula (2); the resin composition has excellent dielectricity, heat resistance and humidity resistance and low thermal expansion coefficient, water absorption rate and the like; the semi-cured sheet, the laminated board, the insulation board, the circuit substrate and the covering film prepared from the resin composition meet the requirements of 5G electronic products on the performance of the circuit substrate.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to a silicone resin and a preparation method thereof, a resin composition with the silicone resin and a prepreg, a laminate, an insulating board, a circuit substrate, and a cover film. Background technique [0002] With the advent of the fifth generation mobile communication network (referred to as 5G), its electronic equipment is developing towards miniaturization, high density, high informatization and high frequency, so higher and more stringent requirements are put forward for the circuit substrate . Circuit substrate materials are required to have lower dielectric loss, dielectric constant and thermal expansion coefficient, lower water absorption, and higher heat resistance. [0003] In recent years, materials for 5G have gradually emerged. For example, the patent application No. CN 102993683A uses a modified polyphenylene ether resin system. This system has exce...

AI Technical Summary

Problems solved by technology

[0003] In recent years, materials for 5G have gradually emerged. For example, the patent application No. CN 102993683A uses a modified polyphenylene ether resin system. This system has excellent heat resistance and dielectric properties and low water absorption, but the adhesion between the substrate and copper foil Poor, and the thermal expansion coefficient of the substrate is large; the patent application No. CN 109503456A uses vinyl benzyl polyimide resin system, the system has heat resistance, but there are deficiencies such as large water absorption and general dielectric properties; No. CN101692756A The patent application uses a polybutadiene resin system, which has excellent dielectric properties and low water absorption, but has disadvantages such as poor heat resistance and large thermal expansion coefficient; the patent application No. CN10134312A uses a cyanate resin system with a specific structure, The water absorption and thermal expansion coefficient of the system are low, but the dielectric properties are average, and there are deficiencies such as poor moisture and heat resistance.

Images