Electric-insulation coating and preparation method thereof

Abstract

The invention relates to the technical field of composite coatings, and provides an electric-insulation thermal-radiation coating and a preparation method thereof. The electric-insulation thermal-radiation coating comprises the following raw materials in parts by weight: 50 to 150 parts of a coating matrix, 50 to 150 parts of a composite heat dissipation filler, 0.2 to 10 parts of a surface activeagent, 0.1 to 15 parts of a coupling agent, 15-100 parts of a solvent and 0.5 to 5 parts of a defoaming agent, wherein the composite heat dissipation filler is formed by mixing at least two selectedfrom the group consisting of a spherical filler, a fibrous filler and a flaky filler, each filler comprises a core material and an outer coating layer, the outer surface of the core material is coatedwith the outer coating layer, the core material is a heat-conducting and electric-conducting material, and the outer coating layer is made of a heat-conducting and insulating material. The electric-insulation thermal-radiation coating is high in emissivity, good in electrical insulation, high in thermal conductivity and heat dissipation performance and stable in physical and chemical properties;the preparation method is simple; and the adding sequence and the reaction process of all the components in a formula for the coating are optimized.

Description

technical field [0001] The invention belongs to the technical field of composite coatings, in particular to an electrical insulation radiation heat dissipation coating and a preparation method thereof. Background technique [0002] With the rapid development of electronic integration technology, electronic equipment is developing in the direction of miniaturization and thinning, and the integration degree of the system is getting higher and higher. On the other hand, with the application of high-power components in electronic equipment, the thermal power consumption increases sharply, and the resulting heat does not have enough space to dissipate, which directly affects the working performance and service life of the product. Statistics show that more than 40% of the The reliability (life) failure of electronic products is caused by the problem of temperature rise. With the advent of the 5G era, the heat dissipation task of electronic products has become particularly severe...

AI Technical Summary

Problems solved by technology

In the electronics industry, the application of radiation heat dissipation coatings in some scenarios needs to consider its insulation properties. For example, in the PCB board industry, coating radiation heat dissipation coatings on the boards can effectively reduce the overall temperature rise of the boards, but if the coatings are conductive It will connect the high and low voltage areas, causing safety hazards and violating safety regulations. At this time, the properties of carbon materials and metal fillers that conduct heat and conduct electricity will seriously affect their use. Although the coating prepared by ceramic fillers has electrical insulation properties, the ceramic fillers Thermal conductivity and heat dissipation are generally lower than carbon materials and metal fillers

In addition, for some heat-dissipating coatings currently on the market, when the amount of coating used reaches a certain thickness, its thermal resistance will increase significantly, so that the radiation heat dissipation performance of the coating cannot be fully utilized.

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