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A kind of epoxy resin packaging glue and its preparation method and application

A technology of epoxy resin and encapsulation glue, which is applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc., and can solve the problems of high crosslinking density, poor moisture resistance, and restrictions on the application of epoxy resin

Active Publication Date: 2021-12-14
BEIJING KMT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the generally high viscosity and high crosslinking density of epoxy resin, there are disadvantages such as large internal stress, fatigue resistance, heat resistance, and poor moisture resistance, which largely restrict the application of epoxy resin in structural materials. Aspects of application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0079] (1) Take 100 parts of sodium desoil, 3 parts of dodecyltrimethylammonium bromide, and 200 parts of ultrapure water in a beaker, stir them evenly and carry out ultrasonic dispersion. The power of the ultrasonic disperser is set to 600W, and the ultrasonic frequency 40KHz, the ultrasonic time is 20min, and the temperature is set to 60°C; after completion, it is placed in an oven at 80°C for drying treatment, and the product after drying is recorded as α 1 .

[0080] (2) Take the product α of step (1) 1 100 parts, 20 parts of 3', 4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate, 150 parts of xylene, and 0.5 parts of chromium acetylacetonate were placed in a glass cup and sealed, stirred evenly and carried out Ultrasonic dispersion, the power of the ultrasonic disperser is set to 600W, the ultrasonic frequency is 40KHz, the ultrasonic time is 20min, and the temperature is set to 80°C. Toluene solvent, the resulting product is modified montmorillonite, denoted as β ...

preparation example 2

[0082] (1) Take 100 parts of sodium desoil, 3 parts of dodecyltrimethylammonium bromide, and 200 parts of ultrapure water in a beaker, stir them evenly and carry out ultrasonic dispersion. The power of the ultrasonic disperser is set to 600W, and the ultrasonic frequency 40KHz, the ultrasonic time is 20min, and the temperature is set to 60°C; after completion, it is placed in an oven at 80°C for drying treatment, and the product after drying is recorded as α 1 .

[0083] (2) Take the product α of step (1) 1 100 parts, 20 parts of DER-331 epoxy resin, 150 parts of xylene, and 0.5 parts of chromium acetylacetonate were placed in a glass cup and sealed. After stirring evenly, ultrasonic dispersion was performed. The power of the ultrasonic disperser was set to 600W, and the ultrasonic frequency was 40KHz. The time is 20 minutes, and the temperature is set to 80°C. After the dispersion is completed, the above product is added to a vacuum distillation device, and the reaction is c...

preparation example 3

[0085] (1) Take 100 parts of sodium desoil, 3 parts of octadecyltrimethylammonium bromide, and 200 parts of ultrapure water in a beaker, stir them evenly and carry out ultrasonic dispersion. The power of the ultrasonic disperser is set to 600W, and the ultrasonic frequency 40KHz, the ultrasonic time is 20min, and the temperature is set to 60°C; after completion, it is placed in an oven at 80°C for drying treatment, and the product after drying is recorded as α 3 .

[0086] (2) Take the product α of step (1) 3 100 parts, 20 parts of DER-331 epoxy resin, 150 parts of xylene, and 0.5 parts of chromium acetylacetonate were placed in a glass cup and sealed. After stirring evenly, ultrasonic dispersion was performed. The power of the ultrasonic disperser was set to 600W, and the ultrasonic frequency was 40KHz. The time is 20 minutes, and the temperature is set to 80°C. After the dispersion is completed, the above product is added to a vacuum distillation device, and the reaction is...

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Abstract

The invention discloses an epoxy resin encapsulation glue, which comprises A component and B component; the A component comprises the following components: epoxy resin, antioxidant, accelerator A, filler and modified layered silicon acid salt; the B component includes the following components: acid anhydride, accelerator B and coupling agent; preferably the mass ratio of the A component and the B component is 1: (0.2-1.2). The epoxy resin encapsulation glue of the present invention has excellent characteristics of high temperature and high humidity resistance, and retains good mechanical properties, and can be used as an LED encapsulation glue.

Description

technical field [0001] The invention relates to an epoxy resin encapsulation glue and a preparation method thereof, and a packaging method using the epoxy resin encapsulation glue, belonging to the field of LED encapsulation materials. Background technique [0002] As a new light source, LED has the advantages of low energy consumption and low pollution compared with traditional methods, and has a better development prospect. [0003] At present, LEDs are mainly packaged with epoxy resin, and the main functions of the resin shell after LED packaging are: to protect the chip from external erosion. Epoxy resin has good comprehensive mechanical properties, high bonding strength, wide bonding surface, low shrinkage, good stability, excellent electrical insulation performance and good processing performance, and is widely used in the field of LED packaging materials. However, due to the generally high viscosity and high crosslinking density of epoxy resin, there are disadvantage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04H01L33/56
CPCC09J163/00C09J11/06C09J11/04H01L33/56C08K2201/011C08L2203/206C08L2201/08C08L2205/025C08L2205/03C08L63/00C08K13/06C08K9/04C08K7/00C08K3/346C08K5/526C08K7/18
Inventor 庞凯敏马晨阳刘聪刘新平
Owner BEIJING KMT TECH
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