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Capacitor film and manufacturing method thereof

A manufacturing method and capacitor technology, applied in the direction of wire wound capacitors, fixed capacitor dielectrics, fixed capacitor parts, etc., can solve problems such as variation, achieve improved dielectric strength retention, improve metal evaporation and formability, Effect of metal vapor deposition and improvement of formability

Active Publication Date: 2021-12-28
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, in order to miniaturize the film capacitor, it is necessary to make the dielectric film thinner, but when the dielectric film is thinner, it has the characteristics of withstand voltage (the characteristic of maintaining the insulating state even at high voltage), operability (even in industrial production It can also be manufactured on a large scale, and it is also possible to stabilize the tendency of film capacitors to deteriorate)

Method used

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  • Capacitor film and manufacturing method thereof
  • Capacitor film and manufacturing method thereof
  • Capacitor film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0255] Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples.

[0256] In addition, in the following description, unless otherwise specified, "%" and "part" which show an amount are a mass basis. In addition, unless otherwise stated, the operation described below was carried out under the conditions of normal temperature and normal pressure.

[0257] In Examples and Comparative Examples, "(1) molecular weight (weight average molecular weight and number average molecular weight) of dicyclopentadiene ring-opening polymer", "(2) dicyclopentadiene ring-opening polymer The glass transition temperature and melting point of the hydrogenated product of the dicyclopentadiene ring-opening polymer", "(3) the ratio of the syndiotactic diads of the hydrogenated product of the dicyclopentadiene ring-opening polymer", "(4) the softening point of the capacitor film ( °C)", "(5) Thermal shrinkage rate (%) of capaci...

manufacture example 1

[0303] (Production example 1: Production of hydrogenated product of ring-opening polymer of dicyclopentadiene)

[0304] 154.5 parts of cyclohexane as an organic solvent and 42.8 parts (30 parts of dicyclopentadiene) of dicyclopentadiene as a dicyclopentadiene were added to a metal pressure-resistant reaction vessel in which nitrogen was replaced. A cyclohexane solution (concentration of 70%) (with an endoform content of 99% or more) and 1.91 parts of 1-hexene as a molecular weight regulator was heated to 53°C. On the other hand, 0.061 parts of The n-hexane solution (concentration: 19%) of aluminum diethylethoxide as the organometallic reducing agent of the ring-opening polymerization catalyst was stirred for 10 minutes to prepare a ring-opening polymerization catalyst solution. This ring-opening polymerization catalyst solution was added to the reactor, and a ring-opening polymerization reaction was performed at 53° C. for 4 hours to obtain a solution containing a dicyclopent...

manufacture example 2

[0310] (Production example 2. Production of unstretched film)

[0311] 1.1 parts of antioxidant (tetrakis[methylene-3-(3',5'-di-tert-butyl-4 '-Hydroxyphenyl) propionate] methane, BASF Japan company make, "Irganox (registered trademark) 1010"), and obtained the resin which is a material of a film.

[0312] The above resin was charged into a twin-screw extruder ("TEM-37B" manufactured by Toshiba Machine Co., Ltd.) having four die holes with an inner diameter of 3 mmΦ. Using the above-mentioned twin-screw extruder, the resin is subjected to hot-melt extrusion molding to form a strip-shaped molded body. This molded body was chopped with a wire cutter to obtain resin pellets. The operating conditions of the above-mentioned twin-screw extruder are as follows.

[0313] ·Barrel set temperature: 270℃~280℃

[0314] ·Die set temperature: 250℃

[0315] ·Screw speed: 145rpm

[0316] ·Feeder speed: 50rpm

[0317] Next, the obtained pellets were supplied to a hot-melt extrusion film m...

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Abstract

The present invention provides a film for capacitors capable of improving the dielectric strength retention at high temperature and improving metal vapor deposition and formability. The capacitor film of the present invention comprises a crystalline dicyclopentadiene ring-opened polymer hydrogenated product, has a heat shrinkage rate of 0.01% to 1.0% and a plane orientation coefficient of 0.01 or more when heated at 200°C for 10 minutes, The density is 1.03×10 6 g / m 3 Above, the film thickness is 15.0 μm or less.

Description

technical field [0001] The present invention relates to a film for capacitors and a manufacturing method thereof. Background technique [0002] As one type of capacitor, a film capacitor has a structure in which dielectric films and metal layers are alternately arranged, and is an element capable of storing electric charge. [0003] In recent years, film capacitors have been reduced in size and increased in capacity, and as a result, they tend to generate heat during driving. Therefore, a film used as a dielectric film of a film capacitor is required to be more excellent in heat resistance. [0004] In addition, in order to miniaturize the film capacitor, it is necessary to make the dielectric film thinner, but when the dielectric film is thinner, it has the characteristics of withstand voltage (the characteristic of maintaining the insulating state even at high voltage), operability (even in industrial production Manufactured on a large scale, it is also possible to stabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/32B29C55/02C08G61/08C08J5/18B29K23/00B29L7/00
CPCH01G4/32C08G61/08C08J5/18H01G4/18H01G4/14C08J2345/00C08G2261/418C08G2261/3325C08G2261/724C08G2261/60C08G2261/11C08G2261/65C09D165/00B29C55/04B29C55/10B29C55/02C08G2261/50C08G2261/90
Inventor 加藤绚子宫泽慎介
Owner ZEON CORP
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