Method for depositing metal platinum film pattern on sapphire substrate, product and application of metal platinum film pattern

A technology of sapphire substrate and thin film graphics, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problem of high cost, achieve the effect of low cost, ensure consistency, and avoid diffusion

Inactive Publication Date: 2020-10-02
工业和信息化部电子第五研究所华东分所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, it is necessary to develop a new process for preparing platinum metal thin films in this field, which can effectively overcome the high cost defect of preparing platinum metal thin films in the prior art, and the preparation method is simple and can be industrialized.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A kind of preparation method of metal platinum film pattern:

[0058] The sapphire substrate is sequentially degreased, washed with hot water, cleaned with deionized water, micro-etched, washed with hot water, ultrasonically cleaned, cleaned with absolute ethanol, dried with nitrogen, printed with electroless platinum plating solution, carbon dioxide laser scanning, hot water Cleaning, cleaning with deionized water, cleaning with absolute ethanol, drying with nitrogen gas and heat treatment to form a metal platinum film pattern on the surface;

[0059] Wherein, the microetching treatment is: at room temperature, the sapphire substrate is processed for 2 minutes, and the 1L microetching treatment solution contains:

[0060] Ammonia water (analytical pure, 25wt%): 10g

[0061] Hydrogen peroxide (analytically pure, 30wt%): 2g

[0062] Deionized water: balance;

[0063] Wherein, the printing electroless platinum plating bath is that the electroless platinum plating bath ...

Embodiment 2

[0072] The sapphire substrate is sequentially degreased, washed with hot water, cleaned with deionized water, micro-etched, washed with hot water, ultrasonically cleaned, cleaned with absolute ethanol, dried with nitrogen, printed with electroless platinum plating solution, carbon dioxide laser scanning, hot water Cleaning, cleaning with deionized water, cleaning with absolute ethanol, drying with nitrogen gas and heat treatment to form a metal platinum film pattern on the surface;

[0073] Wherein, the microetching treatment is: the sapphire substrate is processed for 5 minutes at room temperature, and the 1L microetching treatment solution contains:

[0074] Ammonia water (analytical pure, 25wt%): 10g

[0075] Hydrogen peroxide (analytically pure, 30wt%): 2g

[0076] Deionized water: balance;

[0077] Wherein, the printing electroless platinum plating bath is that the electroless platinum plating bath performs graphic printing at room temperature, and the specific process ...

Embodiment 3

[0086] The sapphire substrate is sequentially degreased, washed with hot water, cleaned with deionized water, micro-etched, washed with hot water, ultrasonically cleaned, cleaned with absolute ethanol, dried with nitrogen, printed with electroless platinum plating solution, carbon dioxide laser scanning, hot water Cleaning, cleaning with deionized water, cleaning with absolute ethanol, drying with nitrogen gas and heat treatment to form a metal platinum film pattern on the surface;

[0087] Wherein, the microetching treatment is: the sapphire substrate is processed for 5 minutes at room temperature, and the 1L microetching treatment solution contains:

[0088] Ammonia water (analytical pure, 25wt%): 5g

[0089] Hydrogen peroxide (analytically pure, 30wt%): 5g

[0090] Deionized water: balance;

[0091] Wherein, the printing electroless platinum plating bath is that the electroless platinum plating bath performs graphic printing at room temperature, and the specific process i...

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Abstract

The invention discloses a method for depositing a metal platinum film pattern on a sapphire substrate, a product and application of the metal platinum film pattern, and belongs to the technical fieldof thin-film integrated circuits. The process aims to deposit a metal platinum film pattern on the surface of a sapphire substrate to serve as an interconnection line, a welding area and a capacitor electrode in a film integrated circuit, so that the reliability of electronic interconnection is improved. According to the invention, by adopting micro-etching treatment in advance, printing with a chemical platinum plating solution, laser scanning of deposited platinum surface and heat treatment, a platinum plating layer is good in quality, production efficiency is high, raw materials are saved,environmental protection is achieved, small harm is generated to human health and other advantages are achieved; and the requirements of a thin-film integrated circuit are fully met.

Description

technical field [0001] The invention belongs to the technical field of thin film integrated circuits, and in particular relates to a method for depositing metal platinum thin film patterns on a sapphire substrate, a product and an application. Background technique [0002] With the development of society to a high degree of informationization and intelligence, various application fields have higher and higher requirements for high performance, miniaturization and integration of optical / electrical devices. In recent years, breakthroughs in new materials, new principles, and new technologies in optoelectronic technology have provided a new way to realize new functional optoelectronic devices. Thin-film integrated circuits are an important integration technology for thin-film transistors, diodes, resistors, capacitors, and inductors. They have the characteristics of wide range of component parameters, high precision, and excellent temperature-frequency characteristics, and are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3213H01L49/02C23C18/16C23C18/44
CPCC23C18/1612C23C18/44H01L21/32134H01L28/65
Inventor 汪洋杨永兴李晓晴饶丹丹
Owner 工业和信息化部电子第五研究所华东分所
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