A gain-type heterojunction ultraviolet photodetector
A technology of electrical detectors and heterojunctions, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems that hinder the practical application of AlGaN heterojunction photoconductive detectors, unfavorable detection of weak ultraviolet light signals, and decrease in photoelectric gain , to achieve excellent power consumption characteristics, simple preparation process, and low dark current effect
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Embodiment 1
[0034] In this embodiment, an epitaxial growth method of metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE) is used to grow a gain type AlGaN heterojunction ultraviolet photodetector, which sequentially includes a c-plane sapphire substrate (201), a 20nm A low-temperature AlN nucleation layer (202) with a thickness of 500 nm, a high-temperature unintentionally doped AlN transition layer (203) with a thickness of 500 nm, and an Al and Ga alloy composition graded Al with a thickness of 100 nm x Ga 1-x N (x=0.7-0.4) layer (204), 200 nm thick unintentionally doped Al 0.4 Ga 0.6 N-layer (205), 20 nm thick unintentionally doped Al 0.6 Ga 0.4 N-layer (206), 30 nm thick unintentionally doped Al 0.4 Ga 0.6 N layer (207), 60nm thick acceptor Mg doped Al 0.43 Ga 0.57 N layer (208), the hole concentration in the layer is 3×10 18 cm -3 , and inadvertently doped Al alloys made by etching, evaporation, etc. 0.6 Ga 0.4 An interdigitated ohmic contact el...
Embodiment 2
[0037] In this embodiment, a gain-type AlGaN heterojunction ultraviolet photodetector is grown by an epitaxial growth method of metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE), which sequentially includes a c-plane sapphire substrate (301), a thickness of 25 nm A low-temperature GaN nucleation layer (302), a high-temperature unintentionally doped GaN transition layer (303) with a thickness of 3 μm, a transition GaN layer with a thickness of 0 nm (that is, this layer may not be provided in this embodiment), a 1 μm-thick Unintentionally doped GaN layer (305), 25 nm thick unintentionally doped Al 0.26 Ga 0.74 N layer (306), 30nm thick unintentionally doped GaN layer (307), 60nm thick acceptor Mg-doped GaN layer (308), the hole concentration in the layers is 2 × 10 18 cm-3, and inadvertently doped Al alloys made by etching, evaporation, etc. 0.26 Ga 0.74 An interdigitated ohmic contact electrode (309) formed of a Ti / Al / Ni / Au metal layer alloy on ...
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