A kind of anticorrosion and antimildew water-based epoxy curing agent and preparation method thereof
A water-based epoxy, anti-corrosion and anti-mold technology, applied in anti-corrosion coatings, epoxy resin coatings, anti-fouling/underwater coatings, etc., can solve the problems of general anti-corrosion and anti-mold performance, expensive raw materials, high cost, etc., to reduce later maintenance Cost, improve corrosion resistance, good anti-fouling and anti-mildew performance
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Embodiment 1
[0027] The present embodiment provides a high corrosion environment-friendly waterborne epoxy curing agent, component mass, and component is a curing agent as follows:
[0028]
[0029] Embodiment, bisphenol A epoxy resin epoxy value 0.4 embodiment, the polyethylene glycol molecular weight of 4,000, mass compound crosslinker-xylylenediamine and isophoronediamine ratio 14 / 3.
[0030] The present embodiment also provides a method of preparing a waterborne epoxy curing agent, antiseptic mildew, comprising the steps of:
[0031] (1) with stirring at room temperature, 30 g of polyethylene glycol melted in a water bath heated to 50 deg.] C, then 10 g of bisphenol A epoxy resin mixed;
[0032] (2) heating the material in the previous step, to be heated up to 85 ℃ dropwise 0.007 g of aluminum chloride ether solution, to heat the reaction system was dissolved, then cooled to room temperature, quenched with 10 g of a methanol, stirred for 30 min;
[0033] (3) the previous step were heated...
Embodiment 2
[0036] The present embodiment provides a high corrosion environment-friendly waterborne epoxy curing agent, component mass, and component is a curing agent as follows:
[0037]
[0038] Embodiment, bisphenol A epoxy resin epoxy value 0.48, the molecular weight of polyethylene glycol 5000, mass-xylylenediamine and isophorone diamine compound ratio of crosslinking agent present embodiment 12 / 5.
[0039] The present embodiment also provides a method of preparing a waterborne epoxy curing agent, antiseptic mildew, comprising the steps of:
[0040] (1) with stirring at room temperature, 25 g of polyethylene glycol was heated to 60 deg.] C water bath melted, then added 20 g of bisphenol A epoxy resin mixed;
[0041] (2) heating the material in the previous step, to be heated up to 95 deg.] C was added dropwise 0.002 g of boron trifluoride ether solution, 8 grams of the reaction was quenched incubation mixture was dissolved to the system, and then cooled to room temperature, was added ...
Embodiment 3
[0045] The present embodiment provides a high corrosion environment-friendly waterborne epoxy curing agent, component mass, and component is a curing agent as follows:
[0046]
[0047]
[0048] In this embodiment, the hydrogenated epoxy value of 0.52 epoxy resins, polyethylene glycol molecular weight of 6000, the mass ratio of m-xylylenediamine and isophorone diamine compound crosslinker was 5 / 3.
[0049] The present embodiment also provides a method of preparing a waterborne epoxy curing agent, antiseptic mildew, comprising the steps of:
[0050] (1) with stirring at room temperature, 36 g of polyethylene glycol was heated to 70 deg.] C water bath melted, 18 g of hydrogenated epoxy resin was then added uniformly mixed;
[0051] (2) heating the material in the previous step, to be heated up to 100 deg.] C was added dropwise 0.004 g of aluminum chloride ether solution, to heat the reaction system was dissolved, then cooled to room temperature, quenched with 5 g of a methanol...
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