Preparation method of polyimide film and polyimide film

Abstract

The invention discloses a polyimide film and a preparation method thereof. The preparation method of the polyimide film comprises the following steps: S1, preparing a heat-conducting filler dispersionliquid, namely mixing clay treated by a first silane coupling agent and a nano-scale inorganic filler treated by a second silane coupling agent in a solvent to form the heat-conducting filler dispersion liquid, the particle size of the clay being micron-sized; S2, adding a diamine monomer and a dianhydride monomer into the heat-conducting filler dispersion liquid to generate a polyamide acid resin solution; wherein the heat-conducting filler dispersion liquid forms a heat-conducting filler structure with a three-dimensional network structure in the polyamide acid resin solution; and S3, casting the polyamide acid resin solution, and carrying out imidization and biaxial tension to obtain the polyimide film. The heat-conducting filler structure with a three-dimensional network structure isformed in the polyimide film through micron-sized clay and nano-sized inorganic filler, so that the polyimide film maintains mechanical properties, the coefficient of thermal expansion of the film isreduced, and the heat-conducting property of the film is improved.

Description

technical field [0001] This application relates to the technical field of electronic information products, in particular to a preparation method of a polyimide film and the polyimide film. Background technique [0002] This section is intended to provide a background or context to the implementations of the application that are recited in the claims. The descriptions herein are not admitted to be prior art by inclusion in this section. [0003] With the rapid development of the electronic information industry, the high integration, high density and high speed of electronic equipment make the circuit or chip quickly accumulate heat in a very small limited space. key to performance. [0004] Polyimide (PI) has excellent thermal stability, electrical insulation and mechanical properties, and is widely used in microelectronics, rail transit, aerospace and other fields. However, the thermal conductivity of the traditional PI film is only about 0.16W / (m·K), which is almost a th...

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Problems solved by technology

However, the thermal conductivity of the traditional PI film is only about 0.16W / (m·K), which is almost a thermal insulator. It is easy to cause circuit overheating in microelectronic devices, which affects the stability of components and integrated circuits. With the increasing demand for insulation and heat conduction of devices, it is urgent to find a high thermal conductivity polyimide film that can quickly and efficiently transfer and release the heat generated by components while maintaining its good overall performance, ensuring the operation of electronic components Stabilize and prolong its service life

[0005] Filling polyimide film with inorganic filler is an effective way to improve its thermal conductivity, but there is a problem: if it is filled with a micron-scale filler with a larger particle size, it is easy to implement in the process, and the obtained polyimide film is thermally conductive. The performance will be improved, but the surface of the prepared film will be rough, and the mechanical and thermal properties will decrease; if nano-scale fillers are used to fill, the phenomenon of particle agglomeration will easily occur, which will affect the mechanical and thermal properties of the film, which is not conducive to popularization and application

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