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Positive photosensitive polyimide resin composition and application thereof

A technology of polyimide resin and composition, applied in optics, opto-mechanical equipment, photosensitive materials for opto-mechanical equipment, etc., can solve the damage of circuit board substrate material, unfavorable film quality, harsh production conditions, etc. problems, to achieve the effect of meeting performance requirements, simple cleaning and processing processes, and wide application scenarios

Pending Publication Date: 2020-11-20
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent JP4240908B2 discloses a positive-type photosensitive polyimide resin composition capable of chain extension, which relies on the reaction of terminal amino groups and carboxyl groups in the polyimide precursor to increase the molecular weight, but the polyimide precursor also has solubility The shortcomings of large and strong water absorption are not conducive to the quality of film formation
Patent CN106842819A discloses a positive-type photosensitive polyimide resin composition containing an alkyne group-containing monomer terminated and flexible in developer selection, but its defect is that the reactivity is low, and the curing temperature is 300 ° C, which is too high The curing temperature requires more stringent production conditions and higher product costs, and may also cause damage to the substrate material of the semiconductor component circuit board

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  • Positive photosensitive polyimide resin composition and application thereof
  • Positive photosensitive polyimide resin composition and application thereof
  • Positive photosensitive polyimide resin composition and application thereof

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preparation example Construction

[0065] Preparation of photosensitive polyimide varnish: mix the obtained alkali-soluble polyimide resin A component and B component according to the required ratio, add methylimidazole, epoxy resin crosslinking agent and phenolic resin, and add Solvent γ-butyrolactone, stirring and dissolving at room temperature, after the dissolution is uniform, add a certain amount of diazide quinone compound under dark light, stir and dissolve, dissolve evenly and filter to obtain photosensitive polyimide varnish, dark light Save for later.

[0066] Coating, exposure, development and curing of photosensitive polyimide, the specific steps are as follows: first, the film is coated by spin coating, followed by pre-baking, pre-baking for 10 min (100°C), and pre-baking is completed After that, the exposure was carried out immediately, and the exposure time was 3 min. Then the development experiment was carried out, the development time was 3min, and then the developed sample was heated to 140°C f...

Embodiment 1

[0068] Under dry nitrogen flow, first dissolve 3.66 g (10 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as 6FAP) in 8 g of γ-butyrolactone (GBL ), followed by adding 3.00 g (9.68 mmol) of bis(3,4-dicarboxyphenyl) ether dianhydride (ODPA), and then adding 2 g of GBL, allowing it to react at 10 °C for 4 h. Then a certain amount of toluene was added and stirred at 180 °C for 4 h. After stirring, the solution was poured into 300 mL of water to obtain a yellowish precipitate. The precipitate was collected by filtration, washed three times with water, then washed three times with hot alcohol water, and finally dried in a vacuum dryer at 80 °C for 12 h to obtain a slightly yellow alkali-soluble polyimide. The powder (A-1) of the amine resin had a yield of 90% and a degree of imidization of 95%.

[0069] Under dry nitrogen flow, first dissolve 3.66 g (10 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as 6FA...

Embodiment 2

[0073] Under dry nitrogen flow, first dissolve 3.66 g (10 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as 6FAP) in 8 g of γ-butyrolactone (GBL ), followed by adding 3.06 g (9.87 mmol) of bis(3,4-dicarboxyphenyl) ether dianhydride (ODPA), and then adding 2 g of GBL, allowing it to react at 10 °C for 4 h. Then a certain amount of toluene was added and stirred at 180 °C for 4 h. After stirring, the solution was poured into 300 mL of water to obtain a yellowish precipitate. The precipitate was collected by filtration, washed three times with water, then washed three times with hot alcohol water, and finally dried in a vacuum dryer at 80 °C for 12 h to obtain a slightly yellow alkali-soluble polyimide. Amine resin powder (A-2) had a yield of 94% and a degree of imidization of 91%.

[0074] Under dry nitrogen flow, first dissolve 3.66 g (10 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as 6FAP) in 8 g o...

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Abstract

The invention discloses a positive photosensitive polyimide resin composition and application thereof. The composition comprises component A resin, component B resin and an additive, wherein the component A resin contains a basic structure: an X group represents an organic group of which a single bond is divalent; the Y group represents a divalent organic group having 1 to 4 aromatic rings or an aliphatic divalent organic group; n represents a positive integer of 1 to 500; and the resin structure of the component B is as follows: a group A represents a divalent organic group; and the group B is a group containing activated unsaturated bonds. The component A and the component B adopted in the invention can be subjected to a click reaction to generate high molecular weight polyimide. The composition can use alkali liquor with lower concentration at the beginning and obtain higher resolution, polyimide resin with longer chain length and higher molecular weight is obtained through reactionafter development, higher comprehensive mechanical properties are obtained, and the composition can be applied to many high-tech fields needing high modulus, high tensile strength, low thermal expansion coefficient and low dielectric constant.

Description

technical field [0001] The invention relates to a positive-type photosensitive polyimide resin composition and its application, which is suitable for the surface protective film of semiconductor elements, high-definition ultra-thin flexible circuit boards, interlayer insulating films and insulating layers of organic electroluminescent elements, etc. field. Background technique [0002] Photosensitive polyimide is a polymer material with dual properties of light sensitivity and heat resistance. Due to its unique properties, it is widely used in the preparation of semiconductor components, flexible printed circuit boards and integrated circuit manufacturing. In recent years, with the development trend of miniaturization of various electronic products and the popularity and promotion of portable devices such as smartphones and tablet terminals, the refinement and complexity of semiconductor components required for their production have continued to deepen, and flexible printed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/008G03F7/004H05K3/06
CPCG03F7/0392G03F7/0085G03F7/004H05K3/06
Inventor 高原童荣柏李春锐周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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