Intelligent coated high-frequency copper clad laminate with high flame-retardant function and preparation method of copper clad laminate

Abstract

The invention provides an intelligent coated high-frequency copper clad laminate with high flame-retardant function and a preparation method of the copper clad laminate. The copper clad laminate comprises a prepreg in the middle, a first resin-coated glass fiber cloth-based copper foil on the upper side of the prepreg, and a second resin-coated glass fiver cloth-based copper foil on the lower sideof the prepreg; and the prepreg is a phosphating modified polyimide film, and the coating resin is a bio-based dimer acid glycidyl ester modified epoxy resin. The high-frequency copper clad laminateprovided by the invention is double-layer direct metallization without bonding layer, meets the requirements of high miniaturization of electronic devices, has high glass transition temperature, low thermal expansion coefficient and dielectric constant, and then has high flame retardancy performance and high rigidity. Both the phosphating modified polyimide film and the bio-based dimer acid glycidyl ester modified epoxy resin glass fiber cloth do not need to be filled with inorganic fillers, so as to reduce the occurrence of agglomeration which leads to uneven microstructure of the copper cladlaminate, and avoid the defects of low transparency and reducing light transmittance of the copper clad laminate.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to an intelligently coated high-frequency copper-clad laminate with high flame-retardant function and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of emerging information industries such as national defense and military industry, aerospace and 3G communications, the Internet of Things, and mobile Internet, the high-frequency signal transmission and high-frequency data processing of electronic circuits are facing higher and higher requirements. Copper-related properties put forward new requirements, requiring lower dielectric constant (D k ) and dielectric loss (D f ) to meet the requirements of increasing information transmission speed and reducing signal transmission loss. On July 1, 2006, the official implementation of two EU directives (Restricting the Use of Certain Hazardous Substances in E...

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Problems solved by technology

[0003] At the same time, the development of 5G technology is applied to mobile cloud computing, wearable devices, unmanned driving, smart home, high-definition video co-camera transmission and other products. The bonding layer of high-frequency copper clad laminates should be reduced as much as possible to reduce the thickness and meet the miniaturization requirements. The requirements of electronic devices, and reduce the dielectric constant Dk and dielectric loss Df to maintain the loss of 5G signals during transmission, but in the prior art, Chinese patent 201611268856.2 forms an adhesive layer by adding inorganic fillers and adhesives. To prepare high-frequency copper-clad laminates, it is not only necessary to add additives but also have an adhesive layer, which increases the thickness and thermal expansion rate of high-frequency copper-clad laminates

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