Additive of Co-Ni alloy electroplating solution for electroplating

Abstract

The invention provides an additive of a Co-Ni alloy electroplating solution for electroplating. The additive comprises chlorobenzaldehyde, 1, 3-propanedithiol, butyne alcohol ether propane sodium sulfonate and sodium diethylenetriamine pentaacetate. The additive can effectively inhibit abnormal deposition of CoNi, a coating is small in grain, the surface is smooth, internal stress is low, deep plating capacity is high, and the electroplating effect is better than that of similar electroplating solutions.

Description

technical field [0001] The invention belongs to an electroplating process, and relates to an additive composition of a Co-Ni alloy electroplating solution for a porous copper plate for a crystallizer. Background technique [0002] Continuous casting is the most important method of producing steel slabs, and the mold is compared to the "heart" of the continuous casting machine. The performance of the mold copper plate directly affects the quality of the casting slab, the production efficiency and production cost of continuous casting, crystallization As an important heat-conducting part of molten steel solidification and forming in continuous casting, the copper plate of the mold is to release the heat of the liquid steel as soon as possible to form a solidified billet shell of sufficient thickness. Therefore, for the copper plate of the mold, its primary function The functional requirement is better thermal conductivity, which is why copper is selected as the mold material. ...

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