Anti-warping high-modulus organic silicon insulating tape and preparation method thereof

Abstract

The invention discloses an anti-warping high-modulus organic silicon insulating tape and a preparation method thereof. The insulating tape is characterized by being formed by compounding an anti-warping resin coating, a resin insulating film layer, a high-adhesion organic silicon resin layer and a high-modulus organic silicon pressure-sensitive adhesive layer in sequence. The preparation method comprises the following steps: preparing anti-warping coating resin, namely mixing unsaturated polyester, aliphatic epoxy resin, high-butyl etherified glycoluril resin, butyl acetate and solvent oil, and adding ethyl acetate for diluting to obtain the anti-warping coating resin; preparing a high-modulus organic silicon pressure-sensitive adhesive: dissolving methyl vinyl MQ resin in xylene, mixing with methyl vinyl silicone rubber, octamethylcyclotetrasiloxane, alpha, omega-dihydroxy polysiloxane, heptane and petroleum ether, heating, dropwise adding a toluene solution of dibutyltin dilaurate, and reacting to obtain the high-modulus organic silicon pressure-sensitive adhesive; and taking the resin insulating film, and carrying coating, drying and the like to obtain the warping-resistant high-modulus organic silicon insulating tape. The insulating tape is suitable for mechanical automatic wrapping, bundling, fixing and the like.

Description

technical field [0001] The invention belongs to insulating tapes, and relates to an anti-warping high-modulus silicone insulating tape and a preparation method thereof. The anti-warping high-modulus organic silicon insulating tape of the present invention is particularly suitable for various mechanical automatic wrapping, binding, fixing and other applications. Background technique [0002] In the fields of electronics and motor insulation, with the continuous investment in automated machinery, conventional insulating tapes have short meters, large unwinding force, and poor warpage resistance, which can no longer meet the needs of high efficiency and low loss. Traditional anti-warping silicone insulating tape products increase the initial adhesion of the tape by making the glue soft. Under weak pressure, the adhesive force quickly climbs to offset the stiffness of the tape base material to achieve warpage resistance. Due to the small modulus (Tanδ<1.0) of such an adhesiv...

AI Technical Summary

Problems solved by technology

The present invention solves the problem of the silicone layer on the back of the substrate by adding a layer of (high temperature resistance, low migration, high friction coefficient) anti-warping coating resin on the surface of the resin insulating film (such as PET, PI, PEN, PPS, etc.). The stickiness of the adhesive presents a problem of increasing over time, and realizes the anti-warping silicone insulating tape with controlled single-layer direct collection (see Figure 1) the unwinding force is always smaller than the rigidity of the base material, avoiding irreversible deformation due to tangential stress on the base material with a thickness of 2 μm to 30 μm, thereby improving the performance of the silicone insulating tape on the package. The problem of tip tilting and slipping during the winding process; the present invention starts from the silicone matrix resin, and improves the modulus of the silicone pressure-sensitive adhesive layer by adjusting the ratio of different soft and hard silicone rubbers and silicone resins (Tanδ=1.6 ~2.0), so that the deformation of the adhesive layer under 500g static pressure is less than 15%, so as to solve the problem of large elasticity of the traditional anti-warping tape, and realize the direct collection of a single layer of high-viscosity silicone insulating tape with a length of 1000m. And it is guaranteed that there will be no "rewind" phenomenon when cutting a small size of ≤10mm; thus providing a good anti-warping high-modulus silicone insulating tape and its preparation method

Images