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Metal resin composite binding agent diamond grinding wheel for PCB micro-drill grooving and preparation method of metal resin composite binding agent diamond grinding wheel

A composite bond and diamond grinding wheel technology, which is applied in the field of diamond grinding wheels, can solve the problems of late start, low precision of machine tool equipment, long research and development cycle, etc., and achieve high feed speed, good chip capacity and thermal conductivity, and high production efficiency. Effect

Active Publication Date: 2021-04-20
江苏赛扬精工科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing domestic PCB micro-diameter cutting tool processing enterprises started late, the research and development cycle is long, and the precision of machine tools is low. Most of the low-end and middle-end PCB cutting tool products are domestically produced. to import products

Method used

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  • Metal resin composite binding agent diamond grinding wheel for PCB micro-drill grooving and preparation method of metal resin composite binding agent diamond grinding wheel
  • Metal resin composite binding agent diamond grinding wheel for PCB micro-drill grooving and preparation method of metal resin composite binding agent diamond grinding wheel
  • Metal resin composite binding agent diamond grinding wheel for PCB micro-drill grooving and preparation method of metal resin composite binding agent diamond grinding wheel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment one prepares metal-resin composite bond diamond grinding wheel, comprises the following steps:

[0032] (1) Put 60 / 40 copper-tin alloy powder with 60% volume percentage and 40% modified polyimide resin powder in a three-dimensional mixer for 4 hours, then pass through a 400-mesh standard sieve to obtain a composite Binding agent;

[0033] (2) Put the composite binder and diamond micropowder in a beaker, add acetone to submerge the powder, use a magnetic stirrer for conventional mixing for 1 h, pass through a 400-mesh standard sieve after natural drying, then add ammonium bicarbonate, and mix well Pass through a 400-mesh standard sieve again to obtain the grinding layer mixture;

[0034] Among them, the volume percentages of diamond abrasives, composite binders, and ammonium bicarbonate are: 35%, 45%, and 20%;

[0035] (3) Put the grinding layer mixture into the existing mold, scrape it flat, place it in an environment with a vacuum degree of 0.08 Pa and a p...

Embodiment 2

[0041] To prepare metal-resin composite bond diamond grinding wheel, adjust the volume percentage of 60 / 40 copper-tin alloy powder and modified polyimide resin powder to 50% 60 / 40 copper-tin alloy powder, 50% modified polyimide resin powder; adjust the volume percentages of diamond abrasive, composite binder, and ammonium bicarbonate in step (2) of Example 1 to: 30%, 55%, and 15%. All the rest were prepared according to the preparation method of Example 1 to obtain a composite bond diamond grinding wheel for slotting PCB micro-drills.

[0042] This grinding wheel is actually used in PCB micro-drilling (0.5mm diameter) tool slotting (0.12mm), the feed speed is 1400 mm / min; the dressing gap is 70,000 pieces of dressing, the service life is 75% higher than the resin grinding wheel, and the comprehensive processing efficiency is increased by 150. %.

Embodiment 3

[0044] Prepare metal-resin composite bond diamond grinding wheel, adjust the volume percentage of 60 / 40 copper-tin alloy powder and modified polyimide resin powder to 40% 60 / 40 copper-tin alloy powder, 60% modified polyimide resin powder; the volume percentages of diamond abrasives, composite binders, and ammonium bicarbonate in step (2) of Example 1 are adjusted to: 25%, 65%, and 10%; the rest are implemented according to The preparation method of example 1 obtains the composite bond diamond grinding wheel for slotting PCB micro-drilling.

[0045] This grinding wheel is actually used in PCB micro-drilling (0.5mm diameter) tool slotting (0.12mm), the feed speed is 1500 mm / min; the dressing gap is 60,000 pieces of dressing; the service life is 50% higher than that of resin grinding wheels; the comprehensive processing efficiency is increased by 100 %.

[0046] As can be seen from the above, compared with the existing PCB micro-drilling and slotting grinding wheel, the grinding...

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Abstract

The invention belongs to the field of diamond grinding wheels, and particularly relates to a metal resin composite binding agent diamond grinding wheel for PCB micro-drill grooving and a preparation method of the metal resin composite binding agent diamond grinding wheel. The volume ratios of a diamond abrasive, a composite binding agent and ammonium bicarbonate are 25-35%, 45-65% and 10-20%. The composite binding agent consists of 60 / 40 bronze alloy powder and resin powder, the resin powder is modified polyimide resin, and the curing temperature of the resin powder is 300-500 DEG C. When the diamond grinding wheel prepared from a metal resin composite binding agent is used for machining a PCB micro-drill on a CNC numerical control machine tool, the advantages of good metal binding agent profile retentivity and high strength are achieved, and the characteristics of good resin binding agent elasticity and excellent self-sharpening performance are achieved; and meanwhile, pores are further used for chip containing and heat dissipation, and excellent performance is achieved in machining. When the PCB micro-drill grooving is implemented, the comprehensive machining efficiency is improved by 100% -200%.

Description

technical field [0001] The invention relates to hard alloy micro-drilling processing, in particular to a metal-resin composite bond diamond grinding wheel for slotting PCB micro-drilling, and belongs to the field of diamond grinding wheels. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, which is the support of electronic components and the carrier for the connection of electronic components. It is called "the mother of electronic products" and plays an important role in most electronic equipment and products. play a vital role. PCB is mainly used in computer, communication, consumer electronics, automotive electronics, industrial control medical, military aerospace and other fields. According to the degree of softness and hardness, PCB can be divided into rigid board (RPCB), flexible board (FPC) and rigid-flex board; according to the number of layers, it can be divided into single-sided board, double-sided board and mul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/02B24D3/34B24D18/00
Inventor 龚文王凯平涂俊群
Owner 江苏赛扬精工科技有限责任公司
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