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Flexible copper-clad plate substrate, preparation method and application thereof, and circuit board

A flexible copper clad laminate and substrate technology, applied in circuit substrate materials, printed circuit components, etc., can solve the problems of poor electrical performance of flexible copper clad laminate substrates, and achieve good dielectric constant consistency, simple operation, Low dielectric loss effect

Pending Publication Date: 2021-04-20
高绍兵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The electrical properties of the prepared flexible copper clad laminate base material are poor

Method used

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  • Flexible copper-clad plate substrate, preparation method and application thereof, and circuit board

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preparation example Construction

[0081] In addition, the present application also provides a method for preparing the above-mentioned flexible copper-clad laminate base material, which may include the following steps: sintering the mixture of ceramic material and polytetrafluoroethylene material. When the raw materials for the preparation of the flexible copper clad laminate base material also include additives, the mixture of the ceramic material, the polytetrafluoroethylene material and the additives is sintered.

[0082] In an optional embodiment, when the raw materials for the preparation of the flexible copper-clad laminate base material include additives, the mixture is obtained in the following manner: firstly mixing the ceramic material with the additives, and then mixing with the polytetrafluoroethylene material. By first mixing the ceramic material and the auxiliary agent, the auxiliary agent modifies the surface of the ceramic material and reduces its surface energy activity.

[0083] In an optiona...

Embodiment 1

[0096] The calcium titanate, strontium titanate and barium titanate are respectively modified with rare earth elements, the rare earth elements are lanthanum and yttrium, and the total amount of lanthanum and yttrium used for each ceramic material to be modified is 0.5 wt% of material. The silicon dioxide, titanium dioxide, modified strontium titanate, modified calcium titanate, modified barium titanate, aluminum oxide and zinc oxide whiskers were respectively ball milled to a particle size of 0.8 μm.

[0097] Using chemical mixing and dispersing, and using additives to carry out the second surface modification of the above ceramic materials. The auxiliary agent is composed of coupling agent, surfactant and oxidizing agent in a mass ratio of 1:1:1. The dosage of the additive is 0.5wt‰ of the ceramic material, and the ceramic material is 40wt% of the preparation raw material.

[0098] The silicon dioxide, titanium dioxide, strontium titanate, calcium titanate, barium titanate...

Embodiment 2

[0106] The calcium titanate, strontium titanate, and barium titanate are respectively modified with rare earth elements, the rare earth elements are lanthanum, cerium, erbium and yttrium, and the total amount of rare earth elements used for each ceramic material to be modified is 0.1wt% of the modified ceramic material. Silicon dioxide, titanium dioxide, modified strontium titanate, modified calcium titanate, modified barium titanate, aluminum oxide and zinc oxide whiskers were respectively ball milled to a particle size of 1.5 μm.

[0107] Chemical mixing and dispersion are used to modify the surface of the above-mentioned ceramic materials with additives. The additives are composed of coupling agent, surfactant and oxidizing agent in a mass ratio of 1:1:1. The dosage of the auxiliary agent is 1wt‰ of the ceramic material, and the ceramic material is 70wt% of the raw material for preparation.

[0108] Take the silicon dioxide, titanium dioxide, strontium titanate, calcium ti...

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Abstract

The invention discloses a flexible copper-clad plate substrate, a preparation method and application thereof, and a circuit board, and belongs to the technical field of electronic circuits. The preparation raw materials of the flexible copper-clad plate substrate comprise a ceramic material and a polytetrafluoroethylene material, the ceramic material comprises at least three of silicon dioxide, titanium dioxide, calcium titanate, strontium titanate, barium titanate, aluminum oxide and zinc oxide, and the calcium titanate, the strontium titanate and the barium titanate are respectively obtained by rare earth element modification. Through cooperation of the ceramic material and the polytetrafluoroethylene material, the flexible copper-clad plate substrate with low dielectric loss and good dielectric constant consistency can be obtained. The preparation method comprises the step of mixing the ceramic material and the polytetrafluoroethylene material, is simple to operate and can realize industrial production. The flexible copper-clad plate substrate can be used for processing a circuit board, so that the circuit board has good electrical properties.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular, to a flexible copper-clad laminate substrate, a preparation method and application thereof, and a circuit board. Background technique [0002] At present, the existing technology is usually mixed with ceramic powder and dispersed polytetrafluoroethylene powder and organic solvent to uniformly mature, press the blank, extrude into a rod, and the rod is rolled into a film several times to make a flexible copper clad laminate substrate. material. The electrical performance of the prepared flexible copper clad laminate base material is poor. [0003] In view of this, the present invention is proposed. Contents of the invention [0004] One of the objectives of the present invention includes providing a flexible copper clad laminate substrate to solve the above technical problems. [0005] The second object of the present invention includes providing a method for prepar...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08K13/06C08K9/02C08K3/24C08K3/36C08K3/22C08K7/08C08J5/18H05K1/03
Inventor 高绍兵吴蓬生
Owner 高绍兵
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