Nano twin crystal copper thin film material and preparation method and application thereof

A nano-twinned copper and nano-twin technology, applied in nanotechnology, nanotechnology, metal pattern materials, etc., can solve problems such as weak mechanical properties and inability to meet the requirements of mechanical service performance of copper interconnect materials.

Active Publication Date: 2021-05-11
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electroplating non-uniform nano-twinned copper will have inherently weak mechanical properties, which cannot meet the requirements of copper interconnect materials for mechanical service properties

Method used

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  • Nano twin crystal copper thin film material and preparation method and application thereof
  • Nano twin crystal copper thin film material and preparation method and application thereof
  • Nano twin crystal copper thin film material and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] 1. Preparation of plating solution. The electroplating solution is prepared with the following component proportions and fully dispersed: copper ion 40g / L, sulfuric acid 40g / L, chloride ion 30ppm, accelerator 80ppm, auxiliary agent 20ppm, pure water 250mL;

[0072] Wherein, the accelerator is gelatin with a coagulation value of 100 bloom, and the adjuvant is sodium oleate.

[0073] 2. Cathode pretreatment. A high-purity titanium plate is used as the cathode, and it goes through the processes of degreasing, pickling, and water washing in sequence.

[0074] 3. DC electroplating. Immerse the titanium plate cathode and phosphor copper anode (phosphorus content 0.05wt.%) in the plating solution, apply 300rpm mechanical stirring and 700W 50Hz ultrasound, and control the temperature of the plating solution to 30°C. Then connect the rectifier to 4A / dm 2 Current density electroplating for 150min.

[0075] 4. Post-coating treatment. Take out the plating layer and substrate,...

Embodiment 2

[0078] 1) Preparation of plating solution. The electroplating solution is prepared with the following component ratios and fully dispersed: copper ion 40g / L, sulfuric acid 20g / L, chloride ion 50ppm, accelerator 30ppm, auxiliary agent 10ppm, pure water 250mL;

[0079] Wherein, the accelerator is gelatin with a coagulation value of 80 bloom, and the adjuvant is sodium laurate.

[0080]2) Cathode pretreatment. A high-purity titanium plate is used as the cathode, and it goes through the processes of degreasing, pickling, and water washing in sequence.

[0081] 3) DC electroplating. Immerse the titanium plate cathode and phosphor copper anode (phosphorus content 0.05wt.%) in the plating solution, apply 300rpm magnetic stirring and 300W 50Hz ultrasound, and control the temperature of the plating solution to 25°C. Then connect the rectifier to 3A / dm 2 Electroplating at current density for 20 min.

[0082] 4) Post-coating treatment. Take out the plating layer and substrate, rins...

Embodiment 3

[0085] The difference from Example 1 is that 300 rpm mechanical stirring was not applied in step 3, but a 2 L / min circulating jet was used instead. The structure of the coating, the proportion of nano-twinned columnar crystals and nano-twinned equiaxed crystals are similar to those in Example 1.

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Abstract

The invention discloses a nano twin crystal copper thin film material and a preparation method and application thereof. The copper thin film material comprises a nano twin crystallization hierarchical structure, and the thickness ratio of the hierarchical structure in a copper thin film is larger than or equal to 90%. The hierarchical structure is composed of nano twin crystallization columnar crystals and nano twin crystallization equiaxed crystals, the thickness ratio of the nano twin crystallization equiaxed crystals in the hierarchical structure is larger than that of the nano twin crystallization columnar crystals in the hierarchical structure, and the nano twin crystallization equiaxed crystals are randomly distributed in the twin crystal lamellar direction. The nano twin crystal copper thin film material has the characteristics of excellent strength, ductility and mechanical isotropy, and can meet the requirement of a copper interconnection material for mechanical service performance.

Description

technical field [0001] The invention relates to the technical field of nano-structured metal materials, in particular to a nano-twinned copper thin film material and a preparation method and application thereof. Background technique [0002] Copper metal is widely used in many fields such as electronic and electrical, machinery manufacturing, metallurgy and chemical industry. Specifically, in the field of contemporary advanced integrated circuit packaging and printed circuit board manufacturing, copper has become an irreplaceable electronic interconnection material due to its excellent electrical conductivity, thermal conductivity, and resistance to electromigration. In the most mature patterned copper interconnect material filling process, an absolute proportion of copper interconnect needs to be prepared by electroplating. [0003] Generally, the elongation at break of electroplated copper is high (>10%) but the tensile strength is insufficient (<300MPa). With the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/20C25D21/10H01L23/532H05K1/09B82Y30/00B82Y40/00
CPCC25D3/38C25D5/20C25D21/10H01L23/53228H05K1/09B82Y30/00B82Y40/00
Inventor 刘志权李哲黄静高丽茵孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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