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Soldering paste and preparation method thereof, device and welding method

A welding method and solder paste technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of easy oxidation and sintering performance of solder paste, improve thermal cycle stability, simplify process flow, reduce cost effect

Active Publication Date: 2021-05-28
SONGSHAN LAKE MATERIALS LAB +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a new solder paste and its preparation method, device and soldering method for the problems that copper-based solder paste is easy to oxidize and has poor sintering performance.

Method used

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  • Soldering paste and preparation method thereof, device and welding method

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preparation example Construction

[0059] The embodiment of the present invention also provides a preparation method of the solder paste of any of the above embodiments, comprising the following steps:

[0060] mixing molybdenum carbide, diluent, dispersant and binder to obtain a first mixture;

[0061] Copper powder is mixed with the first mixture to obtain a copper-molybdenum carbide mixture.

[0062] Compared with traditional welding methods, the advantages of the present invention include:

[0063] Simple technological process and low industrial cost;

[0064] The added molybdenum carbide particles, which have a negative Poisson's ratio structure and high hardness, can increase the mechanical strength of the interconnect material;

[0065] The added molybdenum carbide particles can enhance the interface wettability between micro-nano copper particles and chips and substrates, and can enhance the shear strength of interconnect materials;

[0066] The addition of molybdenum carbide changes the thermal expa...

Embodiment 1

[0084] S1: use 4nm molybdenum carbide particles and ethanol, ethylene glycol, polyvinylpyrrolidone, polypropylene alcohol, polyethylene glycol, mix together and then ultrasonically disperse as the first mixture;

[0085] S2: Utilize organic solvents such as formic acid, acetic acid or ethanol to clean the micron copper sheet and 60nm nanometer copper particles, and centrifuge to remove oxides and impurities on the copper surface;

[0086] S3: Add ethanol, ethylene glycol, polyvinylpyrrolidone, polypropylene alcohol, polyethylene glycol to the micronano copper obtained in S2 to obtain a second mixture;

[0087] S4: Add the first mixture described in S1 to the second mixture described in S3 to obtain the second mixture, perform ultrasonic stirring at a speed of 1500 r / min according to the mass ratio of 1:5, and finally prepare by vacuum degassing after centrifugation Micronano Cu-Mo 2 C compound solder paste, the structure is as figure 1 As shown, it will be subsequently used ...

Embodiment 2

[0090] Embodiment 2 is basically the same as Embodiment 1, except that the copper powder only contains nano-copper particles and does not contain micro-copper flakes. That is, micron copper flakes are replaced by nano copper particles of equal mass.

[0091] In a formic acid reducing atmosphere at 180°C, under a pressure of 2 MPa, pre-sintered for 10 seconds, and at 300°C, under a pressure of 10 MPa, for a second sintering of 15 minutes, the shear strength of the obtained sintered body was 55 MPa, and the thermal conductivity was 240 W / mK. Sintering - After a second sintering cycle, the shear strength decreased by 30%.

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Abstract

The invention discloses a soldering paste. The soldering paste is prepared from copper powder, molybdenum carbide, a diluent, a dispersing agent and a binder, the molybdenum carbide is adsorbed on the surface of the copper powder, the molybdenum carbide is in a nanometer level, the copper powder is in any one or more of the nanometer level and the micrometer level, and the particle size of the copper powder is larger than that of the molybdenum carbide. The invention further discloses a preparation method of the soldering paste. The invention further discloses a device. The device comprises a substrate and a chip, and the substrate and the chip are welded through the soldering paste. The invention further discloses a welding method. The welding method comprises the following steps that the welding paste is applied between the substrate and the chip, and pre-sintering is carried out at the pre-sintering temperature of 65-180 DEG C for 5-120 seconds; and after presintering is finished, the temperature is immediately increased to the secondary sintering temperature for secondary sintering, the secondary sintering temperature ranges from 250 DEG C to 320 DEG C, and the secondary sintering time ranges from 5 minutes to 30 minutes.

Description

technical field [0001] The invention relates to the technical field of nanomaterials for electronic packaging and interconnection, in particular to solder paste and a preparation method thereof, a device and a welding method. Background technique [0002] With the commercial breakthrough of 5G communication technology, the performance requirements of electronic devices are also continuously improved, and higher requirements are put forward for device power and stability. Due to the third-generation semiconductor silicon carbide, gallium nitride has the advantages of high breakdown electric field strength, good thermal stability, and high carrier saturation drift speed. It has application advantages in high-power devices, and its maximum operating temperature can reach 600 ° C. And high stability in high temperature environment. Its working temperature poses a huge challenge to chip interconnection materials and processes, and it is urgent to develop a good interconnection m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/40B23K1/00
CPCB23K35/22B23K35/40B23K1/00
Inventor 袁朝城张安平陈昭铭殷鸿杰刘鸣然罗惠馨
Owner SONGSHAN LAKE MATERIALS LAB
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