Addition process manufacturing process of fine circuit board
A manufacturing process and circuit board technology, which is applied in the field of circuit boards, can solve problems such as environmental pollution, lower yield, and increase post-processing costs, and achieve the effects of reducing production processes, improving product quality, and shortening production time
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Embodiment 1
[0045] An additive manufacturing process for fine circuit boards, comprising the steps of:
[0046] S1, substrate treatment: immerse the substrate in the microetching solution, supplemented by ultrasonic vibration, to carry out microetching treatment on the substrate; the total volume of phosphoric acid, sulfuric acid and water in the microetching solution is 150ml, phosphoric acid, sulfuric acid and The volume ratio of water is 1:3:1; the content of manganese dioxide is 50g / L; the microetching time is 10min, the temperature of microetching solution is 50°C; the ultrasonic frequency is 40kHz;
[0047] S2, electroless copper plating: place the substrate processed through step S1 in an electroless copper plating solution, the electroless copper plating solution includes copper sulfate pentahydrate of 10g / L, citrate complexing agent of 3g / L, 2g / L Formaldehyde reducing agent, 0.005g / L stabilizer (potassium ferrocyanide), 5g / L pH adjuster (sodium carbonate), carry out electroless c...
Embodiment 2
[0056] An additive manufacturing process for fine circuit boards, comprising the steps of:
[0057] S1, substrate treatment: immerse the substrate in the microetching solution, supplemented by ultrasonic vibration, to carry out microetching treatment on the substrate; the total volume of phosphoric acid, sulfuric acid and water in the microetching solution is 150ml, phosphoric acid, sulfuric acid and The volume ratio of water is 1:3.5:1; the content of manganese dioxide is 80g / L; the microetching time is 15min, the temperature of microetching solution is 60°C; the ultrasonic frequency is 40kHz;
[0058] S2, electroless copper plating: place the substrate processed through step S1 in an electroless copper plating solution, the electroless copper plating solution includes copper sulfate pentahydrate of 15g / L, citrate complexing agent of 5g / L, 5g / L Formaldehyde reducing agent, the stabilizer (potassium ferrocyanide) of 0.02g / L, the pH adjuster (sodium carbonate) of 10g / L, carry o...
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