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A kind of low surface energy fluorine silicon additive for epoxy resin and preparation method thereof

A low surface energy technology for epoxy resin, applied in the direction of epoxy resin coatings, coatings, etc., can solve the problems of being only applicable, unable to be widely promoted, and unable to participate in the curing reaction of epoxy resin, etc., to achieve reduced dosage and excellent migration properties, excellent hydrophobic and oleophobic properties, and the effect of reactive properties

Active Publication Date: 2022-03-15
无锡龙驰氟硅新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional modification methods generally introduce silicone or organic fluorine alone, and cannot combine the respective advantages of silicone and organic fluorine; moreover, most of the low surface energy resins used in traditional modification methods cannot participate in the curing reaction of epoxy resin, resulting in Additives are easy to precipitate; in addition, traditional modification methods have great limitations and are only suitable for specific coating systems and cannot be widely promoted

Method used

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  • A kind of low surface energy fluorine silicon additive for epoxy resin and preparation method thereof
  • A kind of low surface energy fluorine silicon additive for epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Hydrolysis: Add a mixture of 1mol dimethyldichlorosilane, 3mol (1H, 1H, 2H, 2H-perfluorohexyl) methyldichlorosilane and 1212g of toluene dropwise while stirring, and control The reaction temperature is 20°C. After the dropwise addition, continue to stir for 2 hours, separate and discharge the lower layer of acidic water, wash the organic layer with 5% sodium carbonate solution until neutral, then heat up and distill to recover toluene to obtain the hydrolyzed material.

[0026] Catalytic cracking: Transfer the hydrolyzed material to the cracking kettle, then add potassium hydroxide powder with 0.5% mass of the hydrolyzed material, stir and turn on the vacuum pump, raise the temperature to 150°C, and collect the obtained cracked material.

[0027] Polymerization: Add 500g cracking material and 1000g high hydrogen-containing silicone oil (hydrogen content 1.6%) into the polymerization kettle, stir evenly, add 75g concentrated sulfuric acid, heat up to 35°C and mix for 5 ho...

Embodiment 2

[0030] Basically the same as Example 1, the difference is: in the hydrolysis step, the fluorocarbonylmethyldichlorosilane used is (1H,1H,2H,2H-perfluorooctyl)methyldichlorosilane, the amount of toluene It is 1512g.

Embodiment 3

[0032] It is basically the same as Example 1, except that in the hydrolysis step, the fluorocarbonylmethyldichlorosilane used is (1H, 1H, 2H, 2H-perfluorodecyl)methyldichlorosilane, and the amount of toluene It is 2112g.

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Abstract

The invention discloses a low-surface-energy fluorosilicone additive for epoxy resin and a preparation method thereof, wherein the preparation method includes four steps of hydrolysis, catalytic cracking, polymerization, and hydrosilicon addition. The main chain of the low surface energy fluorosilicone additive for epoxy resin prepared by the present invention is composed of flexible silicon-oxygen chains, has excellent migration characteristics, can automatically migrate to the surface of the coating without affecting the adhesion of the coating, and can reduce Dosage: The side groups contain long-chain fluorocarbon groups and epoxy groups, which can provide excellent hydrophobicity and reactivity, and can be bonded to the cross-linked network of epoxy resin to prevent precipitation during later use. In addition, the additive can be used in almost all epoxy resin systems, including UV light curing systems.

Description

technical field [0001] The invention relates to the field of fluorosilicon materials, in particular to a low surface energy fluorosilicon additive for epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin is a type of polymer prepolymer containing at least two epoxy groups in its molecular structure. Under the action of a curing agent or a catalyst, a cross-linked network can be obtained through the ring-opening reaction of the epoxy group. It is a thermosetting resin. important one. By matching the types of epoxy resin and curing agent, coatings with different properties can be obtained, so epoxy resin is widely used in the field of coatings. For example, various surface protective coatings formulated with epoxy resin as the base polymer can be used for anti-rust of steel, anti-corrosion of wood, anti-plankton of hull, anti-wear of pavement, etc. However, the surface energy of epoxy resin coating is high. Although it can effectively prote...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/24C08G77/38C09D163/00C09D7/65
CPCC08G77/24C08G77/38C09D163/00C09D7/65C08L83/08
Inventor 王宇郑晓强白永平
Owner 无锡龙驰氟硅新材料有限公司