A new type of copper alloy manufacturing process for water-cooled exchangers based on monocrystalline silicon smelting
A manufacturing process and exchanger technology, applied in the field of new copper alloy manufacturing process, can solve the problems of low stainless steel material recovery rate, poor thermal conductivity and heat dissipation performance, and poor corrosion resistance, so as to improve heat dissipation efficiency and condensation efficiency, and reduce consumables. cost and productivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] A novel copper alloy manufacturing process for water-cooled exchangers based on monocrystalline silicon smelting, comprising the following steps:
[0034] S1 Material preparation: Prepare 500Kg of charge for smelting for use. The composition and mass content of each element in the charge are: Cr 25%, Zr 3%, Si 1%, Mg 1%, rare earth 1%, graphene supported Ce powder 1%, Cu 69%, wherein, Cr and Zr are added in the form of intermediate alloy copper plates; the preparation method of graphene-supported Ce powder is: take graphene oxide and CeCl 3 ·H 2 After the O mass ratio is 3:1, after mixing evenly, join in the water-bath crucible and heat in a water bath at 150°C for 20h, after washing, freeze-dry at -20°C for 10h to obtain graphene-loaded Ce powder;
[0035]S2 Furnace melting: Add 25Kg glass and 5Kg flux to the bottom of the furnace. If it cannot be covered or the glass is too thick, you can add or remove excess glass according to the actual situation. The solvents are ...
Embodiment 2
[0042] This embodiment is basically the same as Example 1, except that the stirring method in step S5 is the bottom blowing top magnetic stirring method, the bottom blowing top magnetic stirring method stirs argon gas at the bottom of the furnace, and electromagnetic stirring is used at the top to stir The melt was mixed and stirred, the stirring speed was 200r / min, and the argon pressure was kept at 5Pa.
Embodiment 3
[0044] This embodiment is basically the same as Embodiment 1, the difference is that:
[0045] The cold forging treatment method in step S7 is the ultrasonic cold forging nitriding method, and the ultrasonic cold forging nitriding method includes the following steps:
[0046] S1 Ultrasonic pretreatment: Ultrasonic vibration with a frequency of 30 Hz and an amplitude of 20 μm acts on the inner wall of the water-cooled heat exchanger through the punch, causing severe plastic deformation of the inner wall to achieve surface nanometerization, the diameter of the punch is 0.2 mm, and the number of impacts is 19820 times / mm 2 ;
[0047] S2 cold forging treatment: the process parameters of cold forging are: the forging speed is 6mm / s, the swivel angle is 45°, the cold forging thickness deviation is 0.1mm, and the temperature is 25°C;
[0048] S3 ion nitriding treatment: Put the water-cooled heat exchanger after cold forging into the nitriding furnace, evacuate to 4Pa, and after de...
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


