Etching solution for removing etching residues of ceramic substrate and etching method

Abstract

The invention belongs to the technical field of production of power semiconductors, and particularly relates to an etching solution for removing etching residues of a ceramic substrate and an etching method. The etching solution comprises an etching solution A and an etching solution B; and the etching liquid A and the etching liquid B comprise hydrogen peroxide, ammonia water, sulfuric acid, and a composition structurally containing one or more of hydroxyl, carboxyl and salts thereof, organic amine and a surfactant, and the etching liquid is used for removing solder residues and a joint layer of the copper-clad ceramic substrate after copper etching. According to the etching solution, a traditional nitric acid system and a traditional cyanide complex double salt system are abandoned, the etching solution does not contain cyanide and phosphorus, residual etching welding flux after copper etching can be effectively removed, the prepared copper-clad ceramic substrate has the advantage of being long in service life, corrosion to copper is small during etching, etching is thorough, and the copper surface state is good.

Description

technical field [0001] The invention relates to the technical field of power semiconductor production, in particular to an etching solution and an etching method for removing etching residues on a ceramic substrate. Background technique [0002] High-power semiconductor modules are widely used in electric locomotives, electric vehicles, photovoltaic solar energy and other fields. As high-power modules become more integrated and use more power, the heat generated by semiconductor devices is on the rise. At present, the method of sintering metals with excellent electrical and thermal conductivity and ceramics such as nitrides with good insulating properties to form ceramic circuit boards has been widely used in power semiconductors to solve the heat dissipation problem of power semiconductor devices. [0003] At present, there are mainly two methods for joining ceramics and metals, direct joining and active brazing. The direct bonding method refers to a method of directly bo...

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Problems solved by technology

[0007] Aiming at the deficiencies in the prior art, the present invention provides an etching solution and an etching method for removing etching residues on a ceramic substrate, which solves the problem of the relatively common etching method for solder in the industry. Acidity is corrosive to copper to a certain extent, and large corrosion cavities are formed at the joints and sides of the mask, resulting in product scrapping; the existing hydrogen peroxide system etching solution contains cyanide, phosphorus, endless etching, and poor stability , Poor state of copper surface, etc.

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