Alpha-alumina film with gold-based mosaic structure and preparation method and application thereof
A mosaic structure, aluminum oxide technology, applied in metal material coating process, ion implantation plating, laser, etc., can solve the problems of increased transmission loss of waveguide, low efficiency of sputtering gold plating, etching of electrode surface, etc., to achieve waveguide Small reflection loss, low surface roughness, good thermal stability
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Embodiment 1
[0027] A kind of copper electrode, its preparation method comprises the following steps:
[0028] 1) Polish one side of the oxygen-free copper substrate with a size of 20mm×20mm×4mm, and then evenly apply a layer of HR-8812 copper oxide high-temperature glue (manufacturer: Dongguan Huirui Rubber Industry Co., Ltd.), and then paste the size 20mm×20mm gold foil, flatten and remove air bubbles, bake at 80°C for 120min;
[0029] 2) Nano α-Al with a particle size of 150nm to 180nm 2 o 3 Put the powder into a muffle furnace, burn at 1100°C for 60 minutes, and air cool;
[0030] 3) Put the oxygen-free copper substrate pasted with gold foil into a flat-bottomed beaker with an inner diameter of 42 mm and a volume of 50 mL, with the side pasted with gold foil facing up, and then 267 μg of nano-α-Al 2 o 3 Powder, 1.6mL of propyl ether and 38.4mL of absolute ethanol are pre-mixed evenly and poured into a flat-bottomed beaker, ultrasonically treated for 20 minutes, left to stand for 60...
Embodiment 2
[0040] A kind of copper electrode, its preparation method comprises the following steps:
[0041] 1) Polish one side of the oxygen-free copper substrate with a size of 20mm×20mm×4mm, and then evenly apply a layer of HR-8812 copper oxide high-temperature glue (manufacturer: Dongguan Huirui Rubber Industry Co., Ltd.), and then paste the size 20mm×20mm gold foil, flatten and remove air bubbles, bake at 80°C for 120min;
[0042] 2) Nano α-Al with a particle size of 150nm to 180nm 2 o 3 Put the powder into a muffle furnace, burn at 1100°C for 60 minutes, and air cool;
[0043] 3) Put the oxygen-free copper substrate pasted with gold foil into a flat-bottomed beaker with an inner diameter of 42 mm and a volume of 50 mL, with the side pasted with gold foil facing up, and then 178 μg of nano-α-Al 2 o 3 Powder, 1.6mL of propyl ether and 38.4mL of absolute ethanol are pre-mixed evenly and poured into a flat-bottomed beaker, ultrasonically treated for 20 minutes, left to stand for 60...
Embodiment 3
[0050] A kind of copper electrode, its preparation method comprises the following steps:
[0051] 1) Polish one side of the oxygen-free copper substrate with a size of 20mm×20mm×4mm, and then evenly apply a layer of HR-8812 copper oxide high-temperature glue (manufacturer: Dongguan Huirui Rubber Industry Co., Ltd.), and then paste the size 20mm×20mm gold foil, flatten and remove air bubbles, bake at 80°C for 120min;
[0052] 2) Nano α-Al with a particle size of 150nm to 180nm 2 o 3 Put the powder into a muffle furnace, burn at 1100°C for 60 minutes, and air cool;
[0053] 3) Put the oxygen-free copper substrate pasted with gold foil into a flat-bottomed beaker with an inner diameter of 42 mm and a volume of 50 mL, with the side pasted with gold foil facing up, and then 356 μg of nano-α-Al 2 o 3 Powder, 1.6mL of propyl ether and 38.4mL of absolute ethanol are pre-mixed evenly and poured into a flat-bottomed beaker, ultrasonically treated for 20 minutes, left to stand for 60...
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