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Preparation method of angle-insensitive reflective plasma structural color

A plasma and reflective technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of angle insensitivity, complicated and expensive preparation methods, incident angle sensitivity, etc., and achieve low cost and simple design , The effect of simple preparation process

Pending Publication Date: 2021-12-07
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Purpose of the invention: The purpose of the present invention is to propose a method for preparing an angle-insensitive reflective plasma structural color, which is limited by the complex and expensive preparation methods and the sensitivity of the incident angle of the existing plasma structural color. A method for preparing metal micro-nano structures with simple process and low cost; through the plasmon effect of metal sodium micro-nano structure arrays and the weak coupling between micro-nano structures, the reflection spectrum is highly adjustable in the visible band and the angle is different Sensitivity, has important application prospects in display, sensor detection and imaging, etc.

Method used

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  • Preparation method of angle-insensitive reflective plasma structural color
  • Preparation method of angle-insensitive reflective plasma structural color
  • Preparation method of angle-insensitive reflective plasma structural color

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preparation example Construction

[0033] Such as figure 1 As mentioned, the preparation method of an angle-insensitive reflective plasma structural color according to the present invention, the specific operation steps are as follows:

[0034] (1) Through the FIB (focused ion beam) process, the cylindrical hole array is etched on the quartz plate with the Ag film deposited on the surface;

[0035] (2), soak the quartz sheet etched with the array of cylindrical holes in nitric acid with a concentration of 97.2%, remove the Ag film, clean the quartz sheet with deionized water, and then dry the quartz sheet with a nitrogen gun;

[0036] (3) Place the dried quartz sheet in a muffle furnace, and calcinate it at 600-700°C for 10-30min in an air atmosphere;

[0037] (4), the surface of the hole array of the calcined quartz sheet is etched by an ion beam, and then sent to a glove box equipped with argon as a protective gas to obtain a spin-coated quartz substrate;

[0038] (5) Place the prepared solid sodium block i...

Embodiment 1

[0052] Hole array quartz plate substrate: Ultrasonic cleaning of the quartz plate substrate with ethanol, after cleaning is completed, it is ready for use; one side of the quartz plate faces the direction of the vacuum evaporation silver target, and by controlling the instrument parameters, 30nm thick silver is evaporated on the surface film; after the evaporation is completed, put the silver film face up and send it to the focused ion beam chamber, set the hole array structure parameters as diameter D=160±20nm, H=70±20nm, P=300±20nm, hole array The area is about 30μm*30μm, and the shape of the hole array on the quartz wafer substrate is shown in the attached figure 2 As shown, it is proved that the hole array structure has good uniformity.

Embodiment 2

[0054] 1) Preparation of Plasma Structural Color: The preparation method of the hole array quartz wafer substrate in this embodiment is the same as that in Embodiment 1, wherein the structure parameters of the hole array in the step are adjusted respectively D, H, and P, wherein the diameter D is 100-400 nm, and the depth H is 20-100nm, and the period P is 200-500nm; when other conditions remain unchanged, the hole array structure is also obtained on the quartz plate; after the etching is completed, use 97.2% nitric acid to remove the Ag on the surface of the quartz plate, and then use Ultrasonic cleaning of the quartz wafer substrate with ionized water, followed by drying the quartz wafer substrate with nitrogen gas; then placing the obtained quartz wafer in a muffle furnace with the array structure facing up, and calcining at 600-700°C for 10-30min in an air atmosphere After the calcination is completed, the quartz plate array structure surface is evenly etched about 30nm by ...

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Abstract

The invention discloses a preparation method of an angle-insensitive reflective plasma structural color. The method comprises the following steps: etching a cylindrical hole array on a quartz plate; soaking in nitric acid to remove an Ag film, cleaning and drying; after calcining, carrying out ion beam etching, and sending to a glove box to obtain a spin-coated quartz substrate; placing the solid sodium block on a heating table for heating until the solid sodium block is molten into liquid sodium; stripping oxides and the like on the shell to obtain liquid sodium with metallic luster on the surface; and dripping on a quartz plate for curing, and packaging with glass to obtain the reflection-type angle-insensitive structural color device. According to the invention, a spin-coating mode is adopted, a metal micro-nano structure is constructed, and a specific reflective structural color is generated by regulating and controlling a plasmon resonance wavelength; because the metallic sodium has the characteristics of low penetration depth in the visible band, weak coupling of the adjacent micro-nano structure and the like, the reflection type structural color generated by the metallic sodium micro-nano structure has the property of angle insensitivity; the method can be applied to multiple fields of sensing, information storage and the like.

Description

technical field [0001] The present invention relates to the technical field of plasma structural color, more specifically, to a preparation method of an angle-insensitive reflective plasma structural color and its application in color display and high-throughput information storage. Background technique [0002] Color is one of the main sources of information we get from our surroundings and plays an important role in the transmission of information. Generally, chemical dyes and pigments are used to produce specific colors. However, traditional chemical dyes and pigments have the characteristics of easy fading, low brightness and poor spatial resolution. In addition, with the consumption of dyes and pigments, the post-treatment process of chemical dyes and pigments has caused a significant burden on the ecological environment. [0003] Structural color is through the interaction of light with micro-scale and / or nano-scale structures, such as interference, diffraction and / o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B82Y20/00B82Y30/00B82Y40/00
CPCB81C1/00444B82Y20/00B82Y30/00B82Y40/00
Inventor 周林张会珍杨宇涵朱嘉
Owner NANJING UNIV
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